公开(公告)号：US10242941B1

公开(公告)日：2019-03-26

申请号：US15671083

申请日：2017-08-07

Applicant: Juniper Networks, Inc.

Inventor： Peng Su ,  Helen L. Turner ,  Marc D. Hartranft ,  Gautam Ganguly ,  Guhan Subbarayan

IPC: H01L23/04 ,  H01L23/498 ,  H01L21/768 ,  H05K3/34 ,  H05K3/24

Abstract: The disclosed apparatus may include (1) a stiffening brace that (A) is coupled to a top surface of a lidless integrated circuit and (B) includes at least one joint and (2) a removable lid that (A) interfaces with the stiffening brace at the joint, (B) temporarily sits atop the stiffening brace during a reflow process in which a bottom surface of the lidless integrated circuit is soldered to a circuit board, and (C) provides structural support to the lidless integrated circuit to impede the lidless integrated circuit from warping during the reflow process. Various other apparatuses, systems, and methods are also disclosed.