公开(公告)号：US20180275360A1

公开(公告)日：2018-09-27

申请号：US15696943

申请日：2017-09-06

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Hiroshi UEMURA ,  Hideto FURUYAMA ,  Yoichiro KURITA ,  Fumitaka ISHIBASHI

IPC: G02B6/42

CPC classification number: G02B6/4243 ,  G02B6/3644 ,  G02B6/3809 ,  G02B6/3885 ,  G02B6/423 ,  G02B6/4245 ,  G02B6/4249 ,  G02B6/4292

Abstract: According to one embodiment, there is provided an optical coupling module including an optical device and an adaptor. The adaptor is attached to the optical device. The optical device has an optical element and a via. The optical element is placed on a first principal surface of a substrate. The via is placed in the substrate at a position corresponding to the optical element. The via has a first opening in a second principal surface of the substrate opposite to the first principal surface. The via does not reach the first principal surface. The adaptor has a guide hole having a second opening in a third principal surface of the adaptor opposite the second principal surface. The second opening corresponds to the first opening. The guide hole has a third opening in a fourth principal surface of the adaptor.

公开(公告)号：US20250076047A1

公开(公告)日：2025-03-06

申请号：US18731984

申请日：2024-06-03

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Daiki ONO ,  Hideaki MURASE ,  Fumito MIYAZAKI ,  Yasushi TOMIZAWA ,  Kei MASUNISHI ,  Kengo UCHIDA ,  Etsuji OGAWA ,  Fumitaka ISHIBASHI ,  Jumpei OGAWA

IPC: G01C19/5705

Abstract: According to one embodiment, a sensor includes a base including a first face, a fixed portion fixed to the first face, a movable portion supported by the fixed portion, a first fixed electrode, and a first opposing fixed electrode. The fixed portion includes a first center in a first plane parallel to the first face. The movable portion includes first and second annular portions. The first fixed electrode includes first and second regions. The first opposing fixed electrode includes first and second opposing regions. The first region is provided between the second annular portion and the first annular portion. The first opposing region is provided between the second annular portion and the first region. The second region is provided between the second annular portion and the first annular portion. The second opposing region is provided between the second annular portion and the second region.

公开(公告)号：US20180128998A1

公开(公告)日：2018-05-10

申请号：US15688717

申请日：2017-08-28

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Hideto FURUYAMA ,  Yoichiro KURITA ,  Hiroshi UEMURA ,  Fumitaka ISHIBASHI

IPC: G02B6/42 ,  G02B6/32 ,  G02B6/34

CPC classification number: G02B6/424 ,  G02B6/32 ,  G02B6/34 ,  G02B6/4239 ,  G02B6/4251 ,  G02B6/4256 ,  G02B6/4274

Abstract: An optical semiconductor module includes a resin body having a first surface and an opposed second surface, an optical device having a third surface and a fourth surface opposite the third surface, the optical device comprising an optical element located at the fourth surface, the optical element capable of at least one of receiving light from, and transmitting light through, the third surface, a first terminal located at the first surface of the resin body, and an electrical connection between the first terminal and the optical device, the electrical connection embedded in the resin body.

公开(公告)号：US20250076049A1

公开(公告)日：2025-03-06

申请号：US18732079

申请日：2024-06-03

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Fumito MIYAZAKI ,  Hideaki MURASE ,  Kei MASUNISHI ,  Yasushi TOMIZAWA ,  Daiki ONO ,  Kengo UCHIDA ,  Etsuji OGAWA ,  Jumpei OGAWA ,  Fumitaka ISHIBASHI

IPC: G01C19/5712

Abstract: According to one embodiment, a sensor includes a base including a first face, a fixed portion fixed to the first face, and a movable portion supported by the fixed portion. The movable portion includes a plurality of annular portions and a plurality of connect portions. Each of the plurality of annular portions is provided around the fixed portion with the fixed portion as a center on a first plane along the first face. The plurality of annular portions includes a first annular portion, a second annular portion, and a third annular portion. The plurality of connect portions includes first and second connect portions. The first connect portion is provided between the first and second annular portions, and is connected to the first and second annular portions. The second connect portion is provided between the second and third annular portions, and is connected to the second and third annular portions.

公开(公告)号：US20240085360A1

公开(公告)日：2024-03-14

申请号：US18173681

申请日：2023-02-23

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Yoshihiko KURUI ,  Hiroaki YAMAZAKI ,  Yosuke AKIMOTO ,  Ping WANG ,  Fumitaka ISHIBASHI ,  Yumi HAYASHI

IPC: G01N27/22

CPC classification number: G01N27/228

Abstract: According to one embodiment, a sensor includes a detection device and a circuit portion. The detection device includes a first detection portion and a second detection portion. The first detection portion includes a first detection element. The first detection element includes a first conductive member and a first detection member. The second detection portion includes a second detection element. The second detection element includes a second conductive member and a second detection member. The circuit portion is configured to execute a first detection portion operation for outputting a first detection result corresponding to a first detection value based on the first detection member when a first current is supplied to the first conductive member. In a case where a first evaluation value is not within a first range, the circuit portion is configured to execute a second detection portion operation by the second detection portion.

公开(公告)号：US20240027384A1

公开(公告)日：2024-01-25

申请号：US18172915

申请日：2023-02-22

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Ping WANG ,  Hiroaki YAMAZAKI ,  Fumitaka ISHIBASHI ,  Ryota KITAGAWA ,  Yuki KUDO ,  Naoya FUJIWARA

IPC: G01N27/18

CPC classification number: G01N27/18

Abstract: According to one embodiment, a sensor system includes a pipe and a sensor. The sensor is configured to detect a detection target substance in the pipe. The sensor includes a base, a first detection part, and a second detection part. The base includes a first base region and a second base region. The first detection part includes a first support part, a first connection part, and a first detection element. The second detection art includes a second support part, a second connection part, and a second detection element.

公开(公告)号：US20180308831A1

公开(公告)日：2018-10-25

申请号：US16016977

申请日：2018-06-25

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Yoichiro KURITA ,  Hideto FURUYAMA ,  Hiroshi UEMURA ,  Fumitaka ISHIBASHI

IPC: H01L25/16 ,  H01L23/00

CPC classification number: H01L25/167 ,  H01L24/32 ,  H01L24/83 ,  H01L24/94 ,  H01L24/96 ,  H01L2224/27502 ,  H01L2224/29186 ,  H01L2224/32145 ,  H01L2224/83009 ,  H01L2224/83203 ,  H01L2224/83359 ,  H01L2224/83379 ,  H01L2224/83896 ,  H01L2924/10253 ,  H01L2924/1032

Abstract: According to one embodiment, at first, a compound semiconductor layer is bonded to a position straddling a plurality of chip formation regions arranged on a substrate. One of the chip formation regions has a first size, and the compound semiconductor layer has a second size smaller than the first size. Thereafter, the compound semiconductor layer is processed to provide compound semiconductor elements on the chip formation regions. Then, the substrate is divided to correspond to the chip formation regions.

公开(公告)号：US20250076054A1

公开(公告)日：2025-03-06

申请号：US18732146

申请日：2024-06-03

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Fumito MIYAZAKI ,  Hideaki MURASE ,  Kei MASUNISHI ,  Yasushi TOMIZAWA ,  Daiki ONO ,  Kengo UCHIDA ,  Etsuji OGAWA ,  Jumpei OGAWA ,  Fumitaka ISHIBASHI

IPC: G01C19/5783

Abstract: According to one embodiment, a sensor includes a first member, a first substrate, and a sensor section. A direction from the first member to the first substrate is along a first direction. A first member thickness of the first member is thicker than a first substrate thickness of the first substrate along the first direction. The sensor section is provided between the first member and the first substrate, and is fixed to the first member. The substrate is fixed to the sensor section. The sensor section includes a housing and a sensor element provided in the housing. The sensor element includes a sensor base, a fixed portion fixed to the sensor base, and a movable portion supported by the fixed portion. A direction from the fixed portion to the sensor base is along the first direction. A first gap is provided between the sensor base and the movable portion.

公开(公告)号：US20240401949A1

公开(公告)日：2024-12-05

申请号：US18424030

申请日：2024-01-26

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Hideaki MURASE ,  Yasushi TOMIZAWA ,  Daiki ONO ,  Fumito MIYAZAKI ,  Kengo UCHIDA ,  Kei MASUNISHI ,  Etsuji OGAWA ,  Jumpei OGAWA ,  Fumitaka ISHIBASHI

IPC: G01C19/5769

Abstract: According to one embodiment, a sensor includes an element section. The element section includes a base, a first fixed portion, a first intermediate connect portion, a first intermediate movable member, a first connect portion, a first movable member, and a first fixed electrode. The first fixed portion is fixed to the base. The first intermediate connect portion is supported by the first fixed portion. The first intermediate movable member is connected to the first intermediate connect portion. The first connect portion is connected to the first intermediate movable member. The first movable member is supported by the first connect portion. The first movable member includes a first movable electrode. The first fixed electrode is fixed to the base and faces the first movable electrode.

公开(公告)号：US20240310404A1

公开(公告)日：2024-09-19

申请号：US18365591

申请日：2023-08-04

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Kei MASUNISHI ,  Etsuji OGAWA ,  Yasushi TOMIZAWA ,  Fumito MIYAZAKI ,  Daiki ONO ,  Kengo UCHIDA ,  Jumpei OGAWA ,  Fumitaka ISHIBASHI ,  Hideaki MURASE

IPC: G01P15/08

CPC classification number: G01P15/08

Abstract: According to one embodiment, a sensor includes a first beam, a first opposing beam, a support portion, a first linking portion, and a first connecting portion. The first beam includes a first portion and a first other portion. A direction from the first portion to the first other portion is along a first direction. A second direction from the first opposing beam to the first beam crosses the first direction. The first opposing beam includes a first opposing portion and a first other opposing portion. The first linking portion is connected to the first other portion and the first other opposing portion. The first connecting portion is connected to the first linking portion. A first connecting portion width along the second direction of the first connecting portion is narrower than a first linking portion width along the second direction of the first linking portion.