公开(公告)号：US20240158628A1

公开(公告)日：2024-05-16

申请号：US18282379

申请日：2022-08-05

Applicant: KCC CORPORATION

Inventor： Chan Young PARK ,  Myoung Taek SHIM ,  Eun Han LEE ,  Byung Seon KONG

IPC: C08L63/00 ,  C08J3/12

CPC classification number: C08L63/00 ,  C08J3/126 ,  C08J3/128 ,  C08J2363/00 ,  C08L2207/53

Abstract: The present invention relates to an epoxy resin composition for molding, and a semiconductor device sealed using the same or a vehicle part molded using the same.