公开(公告)号：US20240158628A1

公开(公告)日：2024-05-16

申请号：US18282379

申请日：2022-08-05

Applicant: KCC CORPORATION

Inventor： Chan Young PARK ,  Myoung Taek SHIM ,  Eun Han LEE ,  Byung Seon KONG

IPC: C08L63/00 ,  C08J3/12

CPC classification number: C08L63/00 ,  C08J3/126 ,  C08J3/128 ,  C08J2363/00 ,  C08L2207/53

Abstract: The present invention relates to an epoxy resin composition for molding, and a semiconductor device sealed using the same or a vehicle part molded using the same.

公开(公告)号：US20200165414A1

公开(公告)日：2020-05-28

申请号：US16627315

申请日：2018-06-29

Applicant: KCC CORPORATION

Inventor： Ji Seung PARK ,  Chan Young PARK ,  Myoung Taek SHIM ,  Ki Young JEON ,  Sang Sun LEE

IPC: C08K5/3492 ,  C08K5/5419 ,  H01L23/29 ,  C08K3/36

Abstract: The present invention provides an epoxy resin composition comprising an epoxy resin, a curing agent, a coupling agent, a curing accelerator, and an adhesion promotor, the adhesion promotor comprising an imidazole-based compound having an average particle size of 0.1-5 μm, and a semiconductor device comprising the same. The epoxy resin composition of the present invention has high adhesion to a different kind of material, such as copper, nickel, or silver, and thus, may satisfy a high level of reliability required for a semiconductor for a car, such as MSL or TCT.