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公开(公告)号：US20190390919A1
公开(公告)日：2019-12-26
申请号：US16539848
申请日：2019-08-13
Applicant: KELVIN THERMAL TECHNOLOGIES, INC.
Inventor： Ryan John Lewis , Yung-Cheng Lee , Li-Anne Liew , Yunda Wang
Abstract: Embodiments described herein relate to the concept and designs of a polymer-based thermal ground plane. In accordance with one embodiment, a polymer is utilized as the material to fabricate the thermal ground plane. Other embodiments include am optimized wicking structure design utilizing two arrays of micropillars, use of lithography-based microfabrication of the TGP using copper/polymer processing, micro-posts, throttled releasing holes embedded in the micro-posts, atomic layer deposition (ALD) hydrophilic coating, throttled fluid charging structure and sealing method, defect-free ALD hermetic coating, and compliant structural design.
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公开(公告)号：US20220155025A1
公开(公告)日：2022-05-19
申请号：US17592490
申请日：2022-02-03
Applicant: KELVIN THERMAL TECHNOLOGIES, INC.
Inventor： Ryan John Lewis , Yung-Cheng Lee , Li-Anne Liew , Yunda Wang
Abstract: Embodiments described herein relate to the concept and designs of a polymer-based thermal ground plane. In accordance with one embodiment, a polymer is utilized as the material to fabricate the thermal ground plane. Other embodiments include am optimized wicking structure design utilizing two arrays of micropillars, use of lithography-based microfabrication of the TGP using copper/polymer processing, micro-posts, throttled releasing holes embedded in the micro-posts, atomic layer deposition (ALD) hydrophilic coating, throttled fluid charging structure and sealing method, defect-free ALD hermetic coating, and compliant structural design.
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公开(公告)号：US11598594B2
公开(公告)日：2023-03-07
申请号：US15930016
申请日：2020-05-12
Applicant: Kelvin Thermal Technologies, Inc.
Inventor： Ryan John Lewis , Li-Anne Liew , Ching-Yi Lin , Collin Jennings Coolidge , Shanshan Xu , Ronggui Yang , Yung-Cheng Lee
Abstract: A thermal ground plane (TGP) is disclosed. A TGP may include a first planar substrate member comprising copper and a second planar substrate member comprising a metal, wherein the first planar substrate member and the second planar substrate member enclose a working fluid. The TGP may include a first plurality of pillars disposed on an interior surface of the first planar substrate and a mesh layer disposed on the top of the first plurality of pillars, wherein the mesh layer comprises at least one of copper, polymer encapsulated with copper, or stainless steel encapsulated with copper. The TGP may also include a second plurality of pillars disposed on an interior surface of the second planar substrate member within an area defined by the perimeter of the second planar substrate member and the second plurality of pillars extend from the second planar substrate member to the mesh layer.
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Patent Agency Ranking
公开(公告)号：US10731925B2
公开(公告)日：2020-08-04
申请号：US14857567
申请日：2015-09-17
Applicant: Kelvin Thermal Technologies, Inc.
Inventor： Ryan John Lewis , Li-Anne Liew , Ching-Yi Lin , Collin Jennings Coolidge , Shanshan Xu , Ronggui Yang , Yung-Cheng Lee
Abstract: A thermal ground plane (TGP) is disclosed. A TGP may include a first planar substrate member configured to enclose a working fluid; a second planar substrate member configured to enclose the working fluid; a plurality of wicking structures disposed on the first planar substrate; and one or more planar spacers disposed on the second planar substrate. The first planar substrate and the second planar substrate are may be hermetically sealed.
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公开(公告)号：US20230332841A1
公开(公告)日：2023-10-19
申请号：US18180122
申请日：2023-03-07
Applicant: Kelvin Thermal Technologies, Inc.
Inventor： Ryan John Lewis , Li-Anne Liew , Ching-Yi Lin , Collin Jennings Coolidge , Shanshan Xu , Ronggui Yang , Yung-Cheng Lee
IPC: F28D15/04
CPC classification number: F28D15/046
Abstract: A thermal ground plane (TGP) is disclosed. A TGP may include a first planar substrate member comprising copper and a second planar substrate member comprising a metal, wherein the first planar substrate member and the second planar substrate member enclose a working fluid. The TGP may include a first plurality of pillars disposed on an interior surface of the first planar substrate and a mesh layer disposed on the top of the first plurality of pillars, wherein the mesh layer comprises at least one of copper, polymer encapsulated with copper, or stainless steel encapsulated with copper. The TGP may also include a second plurality of pillars disposed on an interior surface of the second planar substrate member within an area defined by the perimeter of the second planar substrate member and the second plurality of pillars extend from the second planar substrate member to the mesh layer.
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公开(公告)号：US20160161193A1
公开(公告)日：2016-06-09
申请号：US14925787
申请日：2015-10-28
Applicant: KELVIN THERMAL TECHNOLOGIES, INC.
Inventor： Ryan John Lewis , Yung-Cheng Lee , Li-Anne Liew , Yunda Wang
CPC classification number: F28D15/046 , B23P15/26 , B81C1/00388 , B81C2201/0108 , C23F4/00 , F28D15/0233 , F28F13/187
Abstract: Embodiments described herein relate to the concept and designs of a polymer-based thermal ground plane. In accordance with one embodiment, a polymer is utilized as the material to fabricate the thermal ground plane. Other embodiments include am optimized wicking structure design utilizing two arrays of micropillars, use of lithography-based microfabrication of the TGP using copper/polymer processing, micro-posts, throttled releasing holes embedded in the micro-posts, atomic layer deposition (ALD) hydrophilic coating, throttled fluid charging structure and sealing method, defect-free ALD hermetic coating, and compliant structural design.
Abstract translation: 本文描述的实施例涉及基于聚合物的热接地平面的概念和设计。 根据一个实施例，使用聚合物作为制造热接地平面的材料。 其他实施方案包括使用两个微柱阵列的优化芯吸结构设计，使用铜/聚合物处理的TGP的基于光刻的微加工，微柱，嵌入微柱中的节流释放孔，原子层沉积（ALD）亲水 涂层，节流流体充填结构和密封方法，无缺陷ALD气密涂层，符合结构设计。
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公开(公告)号：US20200300563A1
公开(公告)日：2020-09-24
申请号：US15930016
申请日：2020-05-12
Applicant: Kelvin Thermal Technologies, Inc.
Inventor： Ryan John Lewis , Li-Anne Liew , Ching-Yi Lin , Collin Jennings Coolidge , Shanshan Xu , Ronggui Yang , Yung-Cheng Lee
Abstract: A thermal ground plane (TGP) is disclosed. A TGP may include a first planar substrate member comprising copper and a second planar substrate member comprising a metal, wherein the first planar substrate member and the second planar substrate member enclose a working fluid. The TGP may include a first plurality of pillars disposed on an interior surface of the first planar substrate and a mesh layer disposed on the top of the first plurality of pillars, wherein the mesh layer comprises at least one of copper, polymer encapsulated with copper, or stainless steel encapsulated with copper. The TGP may also include a second plurality of pillars disposed on an interior surface of the second planar substrate member within an area defined by the perimeter of the second planar substrate member and the second plurality of pillars extend from the second planar substrate member to the mesh layer.
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公开(公告)号：US09921004B2
公开(公告)日：2018-03-20
申请号：US14925787
申请日：2015-10-28
Applicant: KELVIN THERMAL TECHNOLOGIES, INC.
Inventor： Ryan John Lewis , Yung-Cheng Lee , Li-Anne Liew , Yunda Wang
CPC classification number: F28D15/046 , B23P15/26 , B81C1/00388 , B81C2201/0108 , C23F4/00 , F28D15/0233 , F28F13/187
Abstract: Embodiments described herein relate to the concept and designs of a polymer-based thermal ground plane. In accordance with one embodiment, a polymer is utilized as the material to fabricate the thermal ground plane. Other embodiments include am optimized wicking structure design utilizing two arrays of micropillars, use of lithography-based microfabrication of the TGP using copper/polymer processing, micro-posts, throttled releasing holes embedded in the micro-posts, atomic layer deposition (ALD) hydrophilic coating, throttled fluid charging structure and sealing method, defect-free ALD hermetic coating, and compliant structural design.
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