Electroless copper plating
    1.
    发明授权
    Electroless copper plating 失效
    电镀铜镀层

    公开(公告)号:US3650777A

    公开(公告)日:1972-03-21

    申请号:US3650777D

    申请日:1971-02-11

    CPC classification number: C23C18/40

    Abstract: An improved aqueous autocatalytic copper deposition solution is provided which comprises maintaining in a solution, containing complexing and reducing agents for the copper ion and a pH adjuster, a small effective amount of a compound providing a metal value selected from the group consisting of molybdenum, niobium, tungsten, rhenium, rare earths of the actinide series, rare earths of the lanthanide series, and mixtures of the foregoing. Additionally, an improved method of depositing electroless copper is provided which comprises employing the solution hereinabove defined.

    Abstract translation: 提供了一种改进的水性自催化铜沉积溶液,其包括保持在含有铜离子的络合和还原剂和pH调节剂的溶液中,小的有效量的提供选自钼,铌的金属值的化合物 ,钨,铼,锕系稀土,镧系稀土,以及上述的混合物。 另外,提供了一种沉积无电解铜的改进方法,其包括采用上文所述的溶液。

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