公开(公告)号：US3682671A

公开(公告)日：1972-08-08

申请号：US3682671D

申请日：1970-02-05

Applicant: KOLLMORGEN CORP

Inventor： ZEBLISKY RUDOLPH J

IPC: C04B41/88 ,  C23C18/20 ,  C23C18/28 ,  C23C3/02

CPC classification number: C23C18/30 ,  C23C18/208 ,  C23C18/285

Abstract: OPTICALLY CLEAR SENSITIZING SOLUTIONS FOR RENDERING SURFACES RECEPTIVE TO THE DEPOSITION OF AN ADHERENT ELECTROLESS METAL COMPRISE WATER AND A METAL COMPLEX CONSISTING OF (A) A PRECIOUS METAL SELECTED FROM A GROUP CONSISTING OF THE PRECIOUS METALS OF THE FIFTH AND SIXTH PREROIDS OF GROUPS VII AND I-B OF THE PERIODIC TABLE OF ELEMENTS, (B) A GROUP VI METAL OF THE PERIODIC TABLE OF ELEMENTS WHICH IS CAPABLE OF TWO VALENCE STATES AND (C) AN ANION CAPABLE FO FORMING A STABLE MOIETY WITH BOTH VALENCE STATES OF THE GROUP IV METAL, IN WHICH THE MOLAR RATIO OF (A) TO (B) TO (C) IS FROM ABOUT 1:1:3 TO 1:6.24. THE SOLUTIONS CAN BE PREPARED DIRECTLY FROM THE COMPONENTS OR, PREFERABLY BY DILUTING A CONCENTRATE. THE SOLUTIONS CAN BE STABILIZED AGAINST PRECIOU METAL SEPARATION BY ADDING AN ORGANIC MONO-OL, DIOL OR POLYOL, A FLUORINATED HYDROCARBON WETTING AGENT OR HYDROGEN FLYORIDE. PROCESS FOR RENDERING SURFACES RECEPTIVE TO THE DEPOSITION OF AN ELECTROLESS METAL ARE ALSO PROVIDED IN WHIC THERE ARE EMPLOYED THE NEW SENSITIZING SOLUTIONS.

公开(公告)号：US3650777A

公开(公告)日：1972-03-21

申请号：US3650777D

申请日：1971-02-11

Applicant: KOLLMORGEN CORP

Inventor： SCHNEBLE FREDERICK W JR ,  ZEBLISKY RUDOLPH J ,  MCCORMACK JOHN F ,  WILLIAMSON JOHN DUFF

IPC: C23C18/40 ,  C23C3/02

CPC classification number: C23C18/40

Abstract: An improved aqueous autocatalytic copper deposition solution is provided which comprises maintaining in a solution, containing complexing and reducing agents for the copper ion and a pH adjuster, a small effective amount of a compound providing a metal value selected from the group consisting of molybdenum, niobium, tungsten, rhenium, rare earths of the actinide series, rare earths of the lanthanide series, and mixtures of the foregoing. Additionally, an improved method of depositing electroless copper is provided which comprises employing the solution hereinabove defined.

Abstract translation: 提供了一种改进的水性自催化铜沉积溶液，其包括保持在含有铜离子的络合和还原剂和pH调节剂的溶液中，小的有效量的提供选自钼，铌的金属值的化合物 ，钨，铼，锕系稀土，镧系稀土，以及上述的混合物。 另外，提供了一种沉积无电解铜的改进方法，其包括采用上文所述的溶液。

公开(公告)号：US3672923A

公开(公告)日：1972-06-27

申请号：US3672923D

申请日：1970-06-29

Applicant: KOLLMORGEN CORP

Inventor： ZEBLISKY RUDOLPH J

IPC: C23C18/28 ,  C23C3/02

CPC classification number: C23C18/28

Abstract: SOLID COMPOSITIONS DILUTABLE TO OPTICALLY CLEAR SENSITIZING SOLUTIONS FOR RENDERING SURFACES RECEPTIVE TO THE DEPOSITION OF AN ADHERENT ELECTRODESS METAL COMPRISE A METAL COMPLEX CONSISTING OF (A) A PRECIOUS METAL SELECTED FROM A GROUP CONSISTING OF THE PRECIOUS METALS OF THE FIFTH AND SIXTH PERIODS OF GROUPS VIII AND I-B OF THE PERIODIC TABLE OF ELEMENTS, (B) A GROUP IV METAL OF THE PERIODIC TABLE OF ELEMENTS WHICH IS CAPABLE OF TWO VALENCE STATES AND (C) AN AMION CAPABLE OF FORMING A STABLE MOIETY WITH BOTH VALENCE STATES OF THE GROUP IV METAL, IN WHICH THE MOLAR RATIO OF (A) TO (B) TO (C) IS FROM ABOUT 1:1:3 TO 1:6:24. THE SOLUTIONS CAN BE PREPARED BY DILUTING THE SOLID COMPOSITIONS. CONTROLLED EXCESSES OF (B) AND (C) AND HYDROGEN ION AND WETTING AGENTS ENHANCE THE SOLUBILITY OF THE POWDERED PRODUCT AND STABILITY OF THE DILUTED SOLUTIONS. PROCESSES FOR RENDERING SURFACES RECEPTIVE TO THE DEPOSITION OF AN ELECTROLESS METAL. E.G., COPPER, NICKEL, COBALT, PALLADIUM, GOLD AND SILVER, ARE ALSO PROVIDED.