公开(公告)号：US20250109480A1

公开(公告)日：2025-04-03

申请号：US18717554

申请日：2021-12-10

Applicant: KOREA INSTITUTE OF MATERIALS SCIENCE

Inventor： Sung-hoon JUNG ,  Do-geun KIM ,  Seung-hoon LEE ,  Joo-young PARK ,  Eun-yeon BYEON ,  Jun-yeong YANG

IPC: C23C14/20 ,  C23C14/02

Abstract: The present disclosure provides a low dielectric polymer substrate and a preparation method thereof. More specifically, the present disclosure provides a low dielectric polymer substrate to which metal or ceramic may be deposited with high adhesion without a separate adhesive layer through surface modification of a polymer substrate and a preparation method thereof.