Abstract:
An aspect of the present invention relates to composite aggregate particles, which include a fine particle compound (a1) containing at least either an amorphous titanosilicate compound or an aluminosilicate compound, and a plastic powder (a2). The plastic powder (a2) is attached to at least a part of the surface of the fine particle compound (a1). The pore volume and the average particle size D50 of the composite aggregate particles satisfy the following formula: pore volume (ml/g)≥0.0010×D50 (μm)+1.60.
Abstract:
An embodiment of the present invention relates to an adsorbent which contains a fine particle compound containing an aluminosilicate compound and activated carbon particles, wherein the fine particle compound containing an aluminosilicate compound has a specific surface area of 300 m2/g or more and an average particle size of 10 to 200 μm and includes particles having a particle size of 10 μm or less in volume particle size distribution at 10 volume % or less, and the activated carbon particles have a mode diameter of 0.06 to 0.6 mm.
Abstract:
To provide a thermoplastic liquid crystal polymer film capable of suppressing change in relative dielectric constant before and after heating, and a laminated and a circuit board using the same. In this film, a change ratio of a dielectric constant (∈r2) of the film after heating to a dielectric constant (∈r1) of the film before the heating satisfies the following formula (I) where the film is heated for 1 hour at a temperature in a range from a temperature being 30° C. lower than a melting point of the film to a temperature being 10° C. higher than the melting point, |∈r2−∈r1|/∈r1×100≦5 (I) where ∈r1 denotes the relative dielectric constant before the heating, ∈r2 denotes the relative dielectric constant after the heating. These relative dielectric constants are measured at the same frequency in a range of 1 to 100 GHz.