公开(公告)号：US20170238428A1

公开(公告)日：2017-08-17

申请号：US15583331

申请日：2017-05-01

Applicant: KURARAY CO., LTD.

Inventor： Takeshi TAKAHASHI ,  Takahiro NAKASHIMA ,  Minoru ONODERA ,  Tetsuya HARA

IPC: H05K3/46 ,  H05K1/03 ,  H05K3/10

CPC classification number: H05K3/4632 ,  B29C65/02 ,  B29C66/034 ,  B29C66/1122 ,  B29C66/45 ,  B29C66/7352 ,  B29C66/7392 ,  B29C66/73921 ,  B29C66/742 ,  B29C66/91411 ,  B29C66/91445 ,  B29C66/91933 ,  B29L2031/3425 ,  B32B15/08 ,  B32B38/0036 ,  H05K1/0313 ,  H05K1/0393 ,  H05K3/10 ,  H05K3/4635 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0355 ,  H05K2203/0278 ,  H05K2203/111 ,  H05K2203/1178 ,  H05K2203/1194

Abstract: Provided are circuit board excellent in interlayer adhesion and solder heat resistance, and production method thereof. The circuit board is produced by a method including: preparing a plurality of at least one kind of thermoplastic liquid crystal polymer (TLCP) films, forming a conductor layer on one side or both sides of a film in at least one of the films to obtain a unit circuit board, laminating the films containing the unit circuit board to obtain a stacked material, conducting thermo-compression-bonding of the stacked material under pressurization to a first temperature giving an interlayer adhesion to integrate the stacked material, carrying out structure-controlling thermal treatment by heating the integrated stacked material at a second temperature which is lower than the first temperature and is lower than a melting point of a TLCP having a lowest melting point out of the plurality of TLCP films.

公开(公告)号：US20190001628A1

公开(公告)日：2019-01-03

申请号：US16123876

申请日：2018-09-06

Applicant: KURARAY CO., LTD.

Inventor： Takahiro NAKASHIMA ,  Takeshi TAKAHASHI ,  Minoru ONODERA

IPC: B32B15/09 ,  B32B37/10 ,  B32B15/20 ,  H05K3/02 ,  C08G63/06 ,  C08J5/18

Abstract: Provided is a method for producing a metal-clad laminate of a thermoplastic liquid crystal polymer film (TLCP film) and a metal sheet(s) bonded to at least one surface of the film using roll-to-roll processing. The metal sheet has a surface with a ten-point average roughness (Rz) of 5.0 μm or less to be bonded to the TLCP film. The method includes preparing the laminate, dry-treating the laminate by subjecting the laminate passed through a dry zone satisfying the following conditions (1) and (2): (1) a drying temperature of lower than the melting point of the TLCP film, (2) for a drying period of 10 seconds or longer, and heat-treating the dried laminate by subjecting the laminate passed through a heating zone on a temperature condition of not lower than the melting point of the TLCP film successively after the dry treatment.

公开(公告)号：US20210251074A1

公开(公告)日：2021-08-12

申请号：US17245542

申请日：2021-04-30

Applicant: KURARAY CO., LTD.

Inventor： Minoru ONODERA ,  Tatsuya SUNAMOTO ,  Takeshi TAKAHASHI ,  Takahiro NAKASHIMA

IPC: H05K1/03 ,  H05K1/02

Abstract: Provided is a thermoplastic liquid crystal polymer film (TLCP film) having a dielectric constant in a thickness direction of the film, which is suitable for a millimeter-wave radar substrate. The TLCP film is a film comprising a thermoplastic polymer capable of forming an optically anisotropic melt phase, wherein the TLCP film has a dielectric constant of from 2.5 to 3.2 in the thickness direction of the film at a temperature of 23° C. and a frequency of 20 GHz, and a heat deformation temperature of from 180 to 320° C. The TLCP film has, on a film plane, dielectric constants of from 2.6 to 3.7 at a temperature of 23° C. and a frequency of 15 GHz both in one direction of the film and in a direction perpendicular to the one direction of the film.

公开(公告)号：US20200375030A1

公开(公告)日：2020-11-26

申请号：US16984942

申请日：2020-08-04

Applicant: KURARAY CO., LTD.

Inventor： Takahiro NAKASHIMA ,  Takeshi TAKAHASHI ,  Minoru ONODERA

IPC: H05K1/03 ,  B32B15/08 ,  B32B27/08 ,  B32B15/20 ,  H05K3/46 ,  C08J5/18 ,  B32B3/04 ,  B32B7/05 ,  C09K19/38 ,  H05K1/02

Abstract: Provided are a thermoplastic liquid crystal polymer film having an improved thermo-adhesive property, a circuit board, and methods respectively for producing the same. The thermoplastic liquid crystal polymer film has a segment orientation ratio SOR of 0.8 to 1.4 and a moisture content of 300 ppm or less. The circuit board contains a plurality of circuit board materials wherein the circuit board materials are at least one member selected from the group consisting of an insulating substrate having a conductor layer on at least one surface, a bonding sheet, and a coverlay. At least one of the circuit board materials includes a thermoplastic liquid crystal polymer film. The circuit board shows a solder heat resistance when the circuit board is placed in a solder bath at 290° C. for 60 seconds in accordance with JIS C 5012.

公开(公告)号：US20180134025A1

公开(公告)日：2018-05-17

申请号：US15567748

申请日：2016-04-20

Applicant: KURARAY CO., LTD.

Inventor： Takahiro NAKASHIMA ,  Takeshi TAKAHASHI ,  Minoru ONODERA

IPC: B32B38/00 ,  B32B3/26 ,  B32B15/09 ,  H05K1/03 ,  H05K3/46 ,  H05K3/38

CPC classification number: B32B38/0036 ,  B29C65/02 ,  B32B3/263 ,  B32B15/08 ,  B32B15/09 ,  B32B37/10 ,  B32B37/182 ,  B32B2457/08 ,  H05K1/0353 ,  H05K3/38 ,  H05K3/381 ,  H05K3/4611 ,  H05K2201/0141 ,  H05K2201/0145

Abstract: A method for manufacturing a metal-clad laminate sheet including forming a laminate sheet having the thermoplastic liquid crystal polymer film and the metal foil bonded together; and providing the laminate sheet with a heat treatment which satisfies conditions (1) and (2) below: (1) a heat treatment temperature ranges between 1° C. inclusive and 50° C. exclusive higher than a melting point of the thermoplastic liquid crystal polymer film. (2) a time for the heat treatment ranges from one second to 10 minutes.

公开(公告)号：US20160212845A1

公开(公告)日：2016-07-21

申请号：US15084554

申请日：2016-03-30

Applicant: KURARAY CO., LTD.

Inventor： Takahiro NAKASHIMA ,  Takeshi TAKAHASHI ,  Minoru ONODERA

IPC: H05K1/03 ,  H05K1/02 ,  H05K3/46 ,  C09K19/38

Abstract: Provided are a thermoplastic liquid crystal polymer film having an improved thermo-adhesive property, a circuit board, and methods respectively for producing the same. The thermoplastic liquid crystal polymer film has a segment orientation ratio SOR of 0.8 to 1.4 and a moisture content of 300 ppm or less. The circuit board contains a plurality of circuit board materials wherein the circuit board materials are at least one member selected from the group consisting of an insulating substrate having a conductor layer on at least one surface, a bonding sheet, and a coverlay. At least one of the circuit board materials includes a thermoplastic liquid crystal polymer film. The circuit board shows a solder heat resistance when the circuit board is placed in a solder bath at 290° C. for 60 seconds in accordance with JIS C 5012.

Abstract translation: 提供一种具有改进的热粘合性能的热塑性液晶聚合物膜，电路板及其制备方法。 热塑性液晶聚合物膜的分段取向比SOR为0.8〜1.4，水分含量为300ppm以下。 电路板包含多个电路板材料，其中电路板材料是选自由至少一个表面上具有导体层的绝缘基底，粘合片和覆盖物组成的组中的至少一种。 至少一个电路板材料包括热塑性液晶聚合物膜。 根据JIS C 5012，将电路板放置在290℃的焊料槽中60秒钟时，电路板显示焊料耐热性。