公开(公告)号：US20150342049A1

公开(公告)日：2015-11-26

申请号：US14718368

申请日：2015-05-21

Applicant: KYOCERA CIRCUIT SOLUTIONS, INC.

Inventor： Tomoharu TSUCHIDA ,  Kazuki OKA ,  Daichi OHMAE

IPC: H05K1/14 ,  H05K3/36 ,  H01L21/78 ,  H05K3/10

CPC classification number: H05K1/142 ,  H01L21/78 ,  H01L2224/11 ,  H05K3/0097 ,  H05K3/10 ,  H05K3/36 ,  H05K2201/049 ,  H05K2201/09036 ,  H05K2201/09154 ,  H05K2203/0169 ,  Y10T29/303 ,  Y10T29/49163

Abstract: The multi-piece, wiring board according to the embodiment of the present invention includes a supporting board including a frame portion formed on an upper surface of a bottom plate, the frame portion configured to divide the upper surface of the bottom plate into a plurality of product forming regions, and a wiring board formed on the upper surface of the bottom plate in. each of the product forming regions, the: wiring board including an insulating layer formed so as to expose an upper surface of the frame portion, and a wiring conductor formed on the insulating layer.

Abstract translation: 根据本发明的实施例的多片式布线板包括支撑板，该支撑板包括形成在底板的上表面上的框架部分，框架部分被构造成将底板的上表面分成多个 产品形成区域和形成在每个产品形成区域的底板的上表面上的布线板，所述布线板包括形成为暴露框架部分的上表面的绝缘层，以及布线 导体形成在绝缘层上。