公开(公告)号：US20150342049A1

公开(公告)日：2015-11-26

申请号：US14718368

申请日：2015-05-21

Applicant: KYOCERA CIRCUIT SOLUTIONS, INC.

Inventor： Tomoharu TSUCHIDA ,  Kazuki OKA ,  Daichi OHMAE

IPC: H05K1/14 ,  H05K3/36 ,  H01L21/78 ,  H05K3/10

CPC classification number: H05K1/142 ,  H01L21/78 ,  H01L2224/11 ,  H05K3/0097 ,  H05K3/10 ,  H05K3/36 ,  H05K2201/049 ,  H05K2201/09036 ,  H05K2201/09154 ,  H05K2203/0169 ,  Y10T29/303 ,  Y10T29/49163

Abstract: The multi-piece, wiring board according to the embodiment of the present invention includes a supporting board including a frame portion formed on an upper surface of a bottom plate, the frame portion configured to divide the upper surface of the bottom plate into a plurality of product forming regions, and a wiring board formed on the upper surface of the bottom plate in. each of the product forming regions, the: wiring board including an insulating layer formed so as to expose an upper surface of the frame portion, and a wiring conductor formed on the insulating layer.

Abstract translation: 根据本发明的实施例的多片式布线板包括支撑板，该支撑板包括形成在底板的上表面上的框架部分，框架部分被构造成将底板的上表面分成多个 产品形成区域和形成在每个产品形成区域的底板的上表面上的布线板，所述布线板包括形成为暴露框架部分的上表面的绝缘层，以及布线 导体形成在绝缘层上。

公开(公告)号：US20150351257A1

公开(公告)日：2015-12-03

申请号：US14722246

申请日：2015-05-27

Applicant: KYOCERA Circuit Solutions, Inc.

Inventor： Kohichi OHSUMI ,  Kazuki OKA

IPC: H05K3/42 ,  H05K3/10 ,  H05K3/06 ,  H05K3/18

CPC classification number: H05K3/4644 ,  H05K3/108 ,  H05K2201/0347 ,  H05K2201/09336 ,  H05K2201/09509 ,  H05K2201/09545 ,  H05K2201/09563 ,  H05K2201/09681 ,  H05K2203/025 ,  H05K2203/0723 ,  H05K2203/1476

Abstract: A method for producing a wiring board includes the steps of forming an upper insulating layer on a lower insulating layer having a lower wiring conductor on its upper surface; forming a via-hole in the upper insulating layer; depositing a first base metal layer in the via-hole and on an upper surface of the upper insulating layer; forming a first plating resist layer on the first base metal layer; depositing a first electrolytically plated layer to completely fill at least the via-hole; forming a via conductor, and depositing a second base metal layer; forming a second plating resist layer on the second base metal layer; depositing a second electrolytically plated layer; and forming a wiring pattern.

Abstract translation: 制造布线板的方法包括以下步骤：在其上表面上形成具有下布线导体的下绝缘层上的上绝缘层; 在上绝缘层中形成通孔; 在所述通孔中和所述上绝缘层的上表面上沉积第一基底金属层; 在所述第一基底金属层上形成第一电镀抗蚀剂层; 沉积第一电解镀层以至少完全填充通孔; 形成通孔导体，并沉积第二基底金属层; 在所述第二基底金属层上形成第二电镀抗蚀剂层; 沉积第二电解镀层; 并形成布线图案。