公开(公告)号：US20160224811A1

公开(公告)日：2016-08-04

申请号：US15011823

申请日：2016-02-01

Applicant: KYOCERA Circuit Solutions, Inc.

Inventor： Takafumi KAWASHIMA

IPC: G06K7/06 ,  H05K1/11 ,  H05K1/18 ,  H05K1/02

CPC classification number: G06K7/065 ,  H01L2224/16225 ,  H05K1/0268 ,  H05K1/0298 ,  H05K1/111 ,  H05K1/113 ,  H05K1/181 ,  H05K2201/0959 ,  H05K2201/10674 ,  H05K2201/10734

Abstract: A wiring board of the present invention includes an insulating board including a core insulating plate and an insulating layer laminated on at least one surface of the insulating plate. A plurality of code information reading pads formed of a conductor layer are disposed on a surface of the insulating layer formed uppermost. A common conductor is disposed oppositely to the code information reading pads by interposing therebetween the insulating layer formed uppermost. At least one of the code information reading pads and the common conductor are electrically connected to each other through a via conductor penetrating through the insulating layer formed uppermost.

Abstract translation: 本发明的布线基板包括绝缘板，该绝缘板包括层叠在绝缘板的至少一个表面上的芯绝缘板和绝缘层。 由导体层形成的多个代码信息读取焊盘设置在最上层形成的绝缘层的表面上。 公共导体通过插入其间形成最上层的绝缘层而相对于码信息读取垫布置。 代码信息读取焊盘和公共导体中的至少一个通过穿过最上层形成的绝缘层的通孔导体彼此电连接。