公开(公告)号：US20100078201A1

公开(公告)日：2010-04-01

申请号：US12523320

申请日：2008-02-07

Applicant: Kazuyuki Yoshizaki ,  Teppei Ito ,  Iji Onozuka ,  Kensuke Nakamura

Inventor： Kazuyuki Yoshizaki ,  Teppei Ito ,  Iji Onozuka ,  Kensuke Nakamura

IPC: H05K1/03 ,  B32B5/12 ,  B32B37/00

CPC classification number: H05K1/0366 ,  B32B5/024 ,  B32B5/12 ,  B32B5/22 ,  B32B5/26 ,  B32B5/28 ,  B32B15/14 ,  B32B15/18 ,  B32B15/20 ,  B32B27/12 ,  B32B27/281 ,  B32B27/304 ,  B32B27/32 ,  B32B27/322 ,  B32B27/36 ,  B32B29/005 ,  B32B29/02 ,  B32B2260/021 ,  B32B2260/028 ,  B32B2260/046 ,  B32B2262/02 ,  B32B2262/0261 ,  B32B2262/0269 ,  B32B2262/0276 ,  B32B2262/101 ,  B32B2307/30 ,  B32B2307/50 ,  B32B2307/54 ,  B32B2307/718 ,  B32B2457/08 ,  H05K1/0271 ,  H05K1/036 ,  H05K2201/029 ,  H05K2201/09136 ,  Y10T156/10 ,  Y10T428/24124 ,  Y10T442/2951 ,  Y10T442/3179 ,  Y10T442/3301 ,  Y10T442/3415 ,  Y10T442/3431 ,  Y10T442/3463 ,  Y10T442/3496

Abstract: There is provided a laminated body comprising a first resin layer consisting of a first fibrous base material and a resin and a second resin layer consisting of a second fibrous base material and a resin, wherein the first resin layer and the second resin layer are disposed such that the first resin layer and the second resin layer are at least partly positioned in separate regions separated by the center line in a thickness direction of the laminated body; wherein at least one of the first fibrous base material and the second fibrous base material has a bowing region where a bowing region is a region in which a smaller warp/weft crossing angle is less than 90° in the fibrous base material; and wherein in the bowing region, an angle formed by a warp of the first fibrous base material and a warp of the second fibrous base material and an angle formed by a weft of the first fibrous base material and a weft of the second fibrous base material, whichever is larger, is 2° or less.

Abstract translation: 提供了一种层叠体，其包括由第一纤维基材和树脂构成的第一树脂层和由第二纤维基材和树脂组成的第二树脂层，其中第一树脂层和第二树脂层被设置为 所述第一树脂层和所述第二树脂层至少部分地位于沿所述层叠体的厚度方向由所述中心线分开的分离区域中; 其中所述第一纤维基材和所述第二纤维基材中的至少一个具有弯曲区域，在所述弯曲区域中，所述纤维基材中弯曲区域是较小经纱/纬纱交叉角度小于90°的区域; 并且其中在所述弯曲区域中，由所述第一纤维基材的翘曲和所述第二纤维基材的翘曲形成的角度和由所述第一纤维基材的纬纱和所述第二纤维基材的纬纱形成的角度 以较大者为准，为2°以下。

公开(公告)号：US20080257480A1

公开(公告)日：2008-10-23

申请号：US11659973

申请日：2005-08-09

Applicant: Kensuke Nakamura

Inventor： Kensuke Nakamura

IPC: H05K3/46 ,  H05K3/30

CPC classification number: H05K1/162 ,  H05K3/002 ,  H05K3/0044 ,  H05K3/4626 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0376 ,  H05K2201/09509 ,  H05K2203/025 ,  H05K2203/0554 ,  Y10T29/435 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: The object of the present invention is to provide: a method for manufacturing a multilayer printed wiring board which enables the dielectric layers to have excellent thickness uniformity, the capacitor circuits to have high registration accuracy and the unnecessary dielectric layer is removed as large as possible; and a multilayer printed wiring board with an embedded capacitor circuit manufactured by the method. To achieve this object, a method is employed in which a multilayer printed wiring board with an embedded capacitor circuit is manufactured through: a first-conductive-metal-layer laminating step where a dielectric layer and a first conductive metal layer are provided on both sides of a core material having base electrode circuits; an top-electrode forming step where the first conductive metal layer(s) locating as outer layer(s) is(are) processed into top electrodes and the dielectric layer(s) in the area other than those of circuit portions is(are) exposed; a dielectric-layer removing step where the exposed dielectric layer(s), which is(are) in the area other than those of circuit portions, is(are) removed; a second-conductive-metal laminating step where the gaps among the top electrodes are filled in and an insulating layer and a second conductive metal layer are provided on the top electrodes; and an outer layer circuit forming step where the second conductive metal layer(s) is(are) processed into outer layer circuits.

Abstract translation: 本发明的目的是提供一种多层印刷电路板的制造方法，其能够使电介质层具有优异的厚度均匀性，使具有高配准精度的电容器电路和去除尽可能大的不需要的介电层; 以及通过该方法制造的具有嵌入式电容器电路的多层印刷线路板。 为了实现这个目的，采用了一种方法，其中通过以下方式制造具有嵌入式电容器电路的多层印刷线路板：第一导电金属层层压步骤，其两侧设置介电层和第一导电金属层 具有基极电极的芯材料; 其中将第一导电金属层定位为外层的顶电极形成步骤被处理成顶电极，并且除了电路部分之外的区域中的介电层是（） 裸露; 介质层去除步骤，其中除去除了电路部分以外的区域中的暴露介电层; 第二导电金属层叠步骤，其中顶部电极之间的间隙被填充，并且在顶部电极上设置绝缘层和第二导电金属层; 以及外层电路形成步骤，其中将第二导电金属层加工成外层电路。

公开(公告)号：US06620067B1

公开(公告)日：2003-09-16

申请号：US09868896

申请日：2001-07-06

Applicant: Kensuke Nakamura ,  Sadao Kojima ,  Atsushi Tanaka ,  Shinji Yamada ,  Hajime Maeda ,  Hidehiko Kamiyama

Inventor： Kensuke Nakamura ,  Sadao Kojima ,  Atsushi Tanaka ,  Shinji Yamada ,  Hajime Maeda ,  Hidehiko Kamiyama

IPC: F16H708

CPC classification number: F01L1/024 ,  F16H7/18 ,  F16H2007/0804 ,  F16H2007/0872

Abstract: A tensioner device 14 for an engine 1 comprises a support member 16, a blade shoe 17 coming into sliding contact with a timing chain 11 having a base end section 17a held by a cylinder block 3 and a tip end section 17b supported by the support member 16, and a leaf spring 18 held by the blade shoe 1 for pressing the blade shoe 17 against the timing chain 11 elastically. The support member 16 is formed integrally with the cylinder block 3. The tip end section 17b comes into sliding contact with a guide surface 16a formed on the support member 16 to be supported.

Abstract translation: 用于发动机1的张紧装置14包括支撑构件16，与具有由气缸体3保持的基端部17a的正时链11滑动接触的叶片靴17和由支撑构件支撑的前端部17b 由叶片1保持的板簧18，用于将刀片17弹性地压靠正时链11。 支撑构件16与气缸体3一体地形成。前端部17b与形成在支撑构件16上的引导面16a滑动接触以被支撑。

公开(公告)号：US5788381A

公开(公告)日：1998-08-04

申请号：US795276

申请日：1997-02-04

Applicant: Masakazu Yamazaki ,  Fuminori Kawashima ,  Chiharu Shimizu ,  Kensuke Nakamura ,  Nobuyoshi Takamatsu ,  Toru Kano ,  Tomoki Okita ,  Hideo Ueshima

Inventor： Masakazu Yamazaki ,  Fuminori Kawashima ,  Chiharu Shimizu ,  Kensuke Nakamura ,  Nobuyoshi Takamatsu ,  Toru Kano ,  Tomoki Okita ,  Hideo Ueshima

IPC: F01M1/06 ,  F01M1/02 ,  F02B67/00 ,  F16C33/10 ,  F16F15/26 ,  F16C33/66

CPC classification number: F16C33/1085 ,  F01M1/02 ,  F02B67/00 ,  F16F15/265 ,  F01M2001/0276

Abstract: An engine has two balancer shafts supported on two bearing bushings which are made of the same material and mounted to a balancer holder. Lubricating oil passages for supplying oil to the bearing bushings are defined offset upwards from the centers O of the bearing bushings and by a distance .delta.. Each of the bearing bushings has two oil bores having a center angle .theta. other than 180.degree.. The two oil bores in the bearing bushing of one balancer shaft communicate with the lubricating oil passage, and one of the oil bores in the bearing bushing of another balancer shaft communicates with the lubricating oil passage, while the other oil bore of that another balancer shaft is closed to keep out of the lubricating oil passage. Thus, downstream ends of the lubricating oil passages for supplying the oil to the bearing bushings of the plurality of rotary shafts can be closed without use of a special closing member such as a blind plug.

Abstract translation: 发动机具有两个平衡轴，该平衡轴支撑在由相同材料制成并安装到平衡器支架上的两个轴承衬套上。 用于向轴承衬套供油的润滑油通道被限定为从轴承衬套的中心O向上偏移并且距离增量。 每个轴承衬套具有两个中心角度θ为180°的油孔。 一个平衡轴的轴承衬套中的两个油孔与润滑油通道连通，另一个平衡轴的轴承衬套中的一个油孔与润滑油通道连通，另一个平衡轴的另一个油孔 关闭以防止润滑油通道。 因此，用于将油供给到多个旋转轴的轴承衬套的润滑油通道的下游端可以不使用诸如盲塞等特殊的关闭构件而关闭。

公开(公告)号：US20130085650A1

公开(公告)日：2013-04-04

申请号：US13701165

申请日：2011-06-06

Applicant: Kensuke Nakamura ,  Noriaki Fujiki ,  Keigo Ajiro

Inventor： Kensuke Nakamura ,  Noriaki Fujiki ,  Keigo Ajiro

IPC: B60T8/17 ,  B60T8/176 ,  B60T8/1755

CPC classification number: B60T8/17 ,  B60T1/10 ,  B60T8/1755 ,  B60T8/176 ,  B60T13/745 ,  B60T2270/604 ,  B60W10/08 ,  B60W10/188 ,  B60W30/18127 ,  B60W2050/0052

Abstract: A vehicle brake control system includes a regenerative braking control component, a frictional braking control component, a calculating component and a controlling component. The regenerative braking control component controls a regenerative braking device to provide a regenerative braking torque. The frictional braking control component controls a frictional braking device to provide a frictional braking torque. The calculating component calculates a regenerative braking torque filter processing value based on a fluctuation frequency of the regenerative braking torque. The controlling component, during a first condition, operates a motorized power assist control device based on the regenerative braking torque filter processing value, instead of the regenerative braking torque, to moderate the frictional braking torque, such that the regenerative braking torque and the moderated frictional braking torque provide a target braking torque based on a braking operation.

Abstract translation: 车辆制动控制系统包括再生制动控制部件，摩擦制动控制部件，计算部件和控制部件。 再生制动控制部件控制再生制动装置，以提供再生制动转矩。 摩擦制动控制部件控制摩擦制动装置以提供摩擦制动转矩。 计算部件基于再生制动转矩的变动频率来计算再生制动转矩滤波处理值。 控制部件在第一状态下，基于再生制动转矩滤波器处理值而不是再生制动转矩来操作电动助力控制装置，以调节摩擦制动转矩，使得再生制动转矩和调节摩擦 制动力矩基于制动操作提供目标制动转矩。

公开(公告)号：US20080289865A1

公开(公告)日：2008-11-27

申请号：US11659948

申请日：2005-08-09

Applicant: Kensuke Nakamura ,  Kazuhiro Yamazaki

Inventor： Kensuke Nakamura ,  Kazuhiro Yamazaki

IPC: H01G4/06 ,  H05K1/16

CPC classification number: H05K1/162 ,  H05K1/0366 ,  H05K3/002 ,  H05K3/0044 ,  H05K3/20 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/09509 ,  H05K2203/025 ,  H05K2203/0554 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: An object is to obtain a dielectric layer constituting material, a capacitor circuit forming piece, etc. in which unnecessary dielectric layer is removed except capacitor circuit parts that improve accuracy of position of an embedded capacitor circuit in a multi-layer printed wiring board. For the purpose of achieving the object, “a method for manufacturing a dielectric layer constituting material characterized in that step a is a step for forming a first electrode circuit by etching a conductor layer on one side of a metal clad dielectric comprising a conductor layer on each side of a dielectric layer; step b is a step for removing the dielectric layer that is exposed between the first electrode circuits to manufacture the dielectric layer constituting material; and the step a is conducted and then the step b is conducted” is adopted. Then as a process for manufacturing a capacitor circuit forming piece, the dielectric layer constituting material obtained above is used and a process for forming a second electrode at a position facing the first electrode is conducted.

Abstract translation: 除了提高多层印刷电路板中的嵌入式电容器电路的位置的精度的电容器电路部分之外，其目的是获得除去不需要的介电层的电介质层构成材料，电容器电路形成片等。 为了实现该目的，“制造介电层构成材料的方法的特征在于步骤a是通过在包含导体层的金属包覆电介质的一侧蚀刻导体层来形成第一电极电路的步骤 电介质层的每一侧;步骤b是用于去除在第一电极电路之间暴露的介电层以制造介电层构成材料的步骤，并且进行步骤a然后进行步骤b“。 然后，作为制造电容器电路形成件的工艺，使用上述得到的电介质层构成材料，并且在与第一电极相对的位置上形成第二电极的工艺被进行。

公开(公告)号：US20140183758A1

公开(公告)日：2014-07-03

申请号：US14239960

申请日：2012-08-24

Applicant: Kensuke Nakamura ,  Toru Meura ,  Yoji Ishimura

Inventor： Kensuke Nakamura ,  Toru Meura ,  Yoji Ishimura

IPC: H01L25/00 ,  H01L25/065

CPC classification number: H01L25/50 ,  H01L23/3121 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05025 ,  H01L2224/05568 ,  H01L2224/05655 ,  H01L2224/06181 ,  H01L2224/13007 ,  H01L2224/13023 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13118 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16238 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/7598 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81209 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83209 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/83 ,  H01L2924/0665 ,  H01L2224/05552

Abstract: A method of manufacturing a semiconductor device is provided which is capable of improving productivity and reliability. The method of manufacturing a semiconductor device (1) of the invention includes a sequential stacking process, an individual stacked body-obtaining process, and a base material bonding process. In the sequential stacking process, a block stacked body is obtained. The block stacked body is a block stacked body (2B) in which semiconductor blocks (10B, 12B, 14B, and 16B) are stacked in a state of not being solder-bonded. In the semiconductor blocks (10B, 12B, 14B, and 16B), a plurality of semiconductor components are arranged. In the individual stacked body obtaining process, an individual stacked body (2) is obtained in which terminals of the stacked semiconductor components are solder-bonded and which is cut from the block stacked body (2B) in a stacked semiconductor component unit.

Abstract translation: 提供一种制造半导体器件的方法，其能够提高生产率和可靠性。 制造本发明的半导体器件（1）的方法包括顺序堆叠工艺，单独的层叠体获得工艺和基材粘合工艺。 在顺序堆叠处理中，获得块堆叠体。 块状堆叠体是在未焊接的状态下层叠有半导体块（10B，12B，14B，16B）的块状堆叠体（2B）。 在半导体块（10B，12B，14B，16B）中，配置有多个半导体元件。 在各个层叠体取得工序中，获得堆叠的半导体部件的端子被焊接并且从堆叠的半导体部件单元中的块状堆叠体（2B）切断的单个层叠体（2）。

公开(公告)号：US07859110B2

公开(公告)日：2010-12-28

申请号：US12298706

申请日：2007-04-26

Applicant: Kensuke Nakamura ,  Hiroshi Hirose

Inventor： Kensuke Nakamura ,  Hiroshi Hirose

IPC: H01L21/00

CPC classification number: H05K3/281 ,  B32B3/263 ,  B32B5/022 ,  B32B5/024 ,  B32B27/10 ,  B32B27/12 ,  B32B27/18 ,  B32B27/20 ,  B32B27/28 ,  B32B27/38 ,  B32B2260/021 ,  B32B2260/028 ,  B32B2260/046 ,  B32B2262/0238 ,  B32B2262/0246 ,  B32B2262/0253 ,  B32B2262/0261 ,  B32B2262/0276 ,  B32B2262/0292 ,  B32B2262/101 ,  B32B2307/30 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2307/308 ,  B32B2307/402 ,  B32B2307/50 ,  B32B2307/718 ,  B32B2457/08 ,  C08G2650/56 ,  C08L63/00 ,  C08L65/00 ,  C08L71/00 ,  H05K1/0269 ,  H05K2201/0191 ,  H05K2201/0195 ,  H05K2203/161 ,  Y10T428/24612 ,  Y10T428/2495 ,  Y10T428/31504 ,  Y10T428/31511 ,  Y10T428/31525 ,  C08L2666/14

Abstract: The present invention provides a solder resist material, which can suppress the warpage of a semiconductor package upon exposure to heat or impact even when used in a thin wiring board and meets a demand for size reduction in electronic devices and a higher level of integration, and a wiring board comprising the solder resist material and a semiconductor package. The solder resist material of the present invention can effectively suppress the warpage of a semiconductor package through a fiber base material-containing layer interposed between resin layers. The fiber base material-containing layer is preferably unevenly distributed in the thickness direction of the solder resist material.

Abstract translation: 本发明提供一种阻焊材料，其即使在薄的布线板中使用也能够抑制暴露于热或冲击时的半导体封装的翘曲，并且满足电子器件的尺寸减小和更高的集成度的需求，以及 包括阻焊材料和半导体封装的布线板。 本发明的阻焊材料能够有效地抑制通过设置在树脂层之间的含有纤维基材的层的半导体封装的翘曲。 含有纤维基材的层优选在阻焊材料的厚度方向上不均匀地分布。

公开(公告)号：US07331502B2

公开(公告)日：2008-02-19

申请号：US10472311

申请日：2001-03-19

Applicant: Ryoichi Okada ,  Hitoshi Aoki ,  Yoshitaka Okugawa ,  Kensuke Nakamura ,  Shinichiro Itoh

Inventor： Ryoichi Okada ,  Hitoshi Aoki ,  Yoshitaka Okugawa ,  Kensuke Nakamura ,  Shinichiro Itoh

IPC: B23K31/02

CPC classification number: H05K3/3436 ,  H01L21/486 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/293 ,  H01L23/49827 ,  H01L24/29 ,  H01L24/81 ,  H01L2221/68345 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/1147 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01059 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1579 ,  H05K3/20 ,  H05K3/305 ,  H05K3/3489 ,  H05K3/386 ,  H05K3/4617 ,  H05K2201/0195 ,  H05K2201/0394 ,  H05K2201/10977 ,  H05K2203/0475 ,  H05K2203/1189 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00015 ,  H01L2224/05599

Abstract: In a process for producing an electronic part which comprises soldering (A) an electronic member having conductor portions I for electric connection having a solder layer or a solder bump (a solder portion) on a surface of a tip and (B) an electronic member to be connected having conductor portions II for electric connection arranged at positions corresponding to positions of conductor portions I by pressing (A) to (B) under heating via an adhesive layer, the solder portion is brought into contact with the adhesive layer, the solder portion is melted by heating at a temperature of or higher than a melting point of the solder, the soldering is conducted by pressing the melted solder portion, and the adhesive layer is cured. An electronic part is obtained in accordance with the process. Electric connection is surely achieved and a highly reliable electronic part can be obtained with excellent productivity.

Abstract translation: 在制造电子部件的方法中，包括将具有焊料层或焊料凸块（焊料部分）的电连接用导体部分I的电子部件（A）焊接到电极部件的表面上，（B）电子部件 通过粘合剂层在加热下通过按压（A）至（B）而将具有用于电连接的导体部分II布置在与导体部分I的位置相对应的位置处，焊料部分与粘合剂层接触，焊料 通过在焊料的熔点以上的温度加热来熔融部分，通过挤压熔化的焊料部分进行焊接，并且使粘合剂层固化。 根据该过程获得电子部件。 可靠地实现电连接，并且可以以优异的生产率获得高可靠性的电子部件。

公开(公告)号：US20070102804A1

公开(公告)日：2007-05-10

申请号：US10580198

申请日：2004-12-09

Applicant: Kensuke Nakamura ,  Tetsuro Sato

Inventor： Kensuke Nakamura ,  Tetsuro Sato

IPC: B05D5/12

CPC classification number: H05K3/4655 ,  H05K3/386 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2203/066 ,  Y10T428/12556 ,  Y10T428/12569 ,  Y10T428/12708 ,  Y10T428/24917

Abstract: An object of the present invention is to provide a multi-layered printed wiring board which does not require roughening such as black oxide treatment and the like on inner layer circuits. For the purpose of achieving this object, there is adopted a multi-layered printed wiring board characterized by comprising a primer resin layer P comprising exclusively a resin between each inner layer circuit Ci formed without roughening and an insulating resin layer 5 of the multi-layered printed wiring board. The multi-layered printed wiring board is manufactured by taking the steps such as (a) a steps for producing a primer resin sheet with a carrier film including a 2 micron m to 12 micron m thick primer resin layer; (b) a steps for placing the primer resin sheet on the inner-layer circuit board in which the primer resin layer of the primer resin sheet with a carrier film is placed on the inner layer circuit board and then the carrier film is removed; (c) a steps for pressing in which a pre-preg and a metal foil for forming a conductive layer are superposed on the primer resin sheet, and pressed to form the multi-layered metal clad laminate; and (d) a steps for forming an outer layer circuit wherein the outer layer circuit is formed by etching the outer layer metal foil of the multi-layered metal clad laminate to make the multi-layered printed wiring board.

Abstract translation: 本发明的目的是提供一种在内层电路上不需要诸如黑色氧化物处理等的粗糙化的多层印刷线路板。 为了实现该目的，采用了一种多层印刷电路板，其特征在于包括仅在不粗化形成的每个内层电路Ci和多层绝缘树脂层5之间仅包含树脂的底漆树脂层P 印刷线路板。 通过以下步骤制造多层印刷线路板：（a）用包含2微米至12微米厚的底漆树脂层的载体膜制备底漆树脂片的步骤; （b）将底漆树脂片放置在内层电路基板上的步骤，在该内层电路板上，将具有载体膜的底漆树脂片的底漆树脂层放置在内层电路板上，然后除去载体膜; （c）用于压制的步骤，其中用于形成导电层的预浸料和金属箔叠加在底漆树脂片上，并压制以形成多层金属包覆层压板; 以及（d）形成外层电路的步骤，其中通过蚀刻多层金属包覆层压板的外层金属箔形成外层电路以制造多层印刷电路板。