公开(公告)号：US09191263B2

公开(公告)日：2015-11-17

申请号：US13760089

申请日：2013-02-06

Applicant: Keyssa, Inc.

Inventor： Gary D McCormack ,  Ian A Kyles

IPC: H04J3/24 ,  H04L29/06 ,  G06F13/00

CPC classification number: H04B5/0031 ,  G06F13/00 ,  H04B5/0037 ,  H04B5/0075 ,  H04L29/06068 ,  H04L69/08

Abstract: A contactless, electromagnetic (EM) replacement (substitute, alternative) for cabled (electric) Standards-based interfaces (such as, but not limited to USB) which effectively handles the data transfer requirements (such as bandwidth, speed, latency) associated with the Standard, and which is also capable of measuring and replicating relevant physical conditions (such as voltage levels) on data lines so as to function compatibly and transparently with the Standard. A contactless link may be provided between devices having transceivers. A non-conducting housing may enclose the devices. Some applications for the contactless (EM) interface are disclosed. A dielectric coupler facilitating communication between communications chips which are several meters apart. Conductive paths may provide power and ground for bus-powered devices.

Abstract translation: 对于有效处理与之相关的数据传输要求（如带宽，速度，延迟）的电缆（电）标准接口（例如但不限于USB）的非接触式，电磁（EM）替代（替代） 标准，并且还能够测量和复制数据线上的相关物理条件（如电压电平），以便与标准兼容和透明地运行。 可以在具有收发器的设备之间提供非接触式链路。 不导电的外壳可能会封闭设备。 公开了用于非接触式（EM）接口的一些应用。 介质耦合器，其有助于彼此间隔数米的通信芯片之间的通信。 导电路径可为总线供电设备提供电源和接地。

公开(公告)号：US09559753B2

公开(公告)日：2017-01-31

申请号：US14205658

申请日：2014-03-12

Applicant: Keyssa, Inc.

Inventor： Gary D McCormack ,  Ian A Kyles ,  Roger D Isaac

IPC: H04B7/00 ,  H04B5/00 ,  H04W76/02

CPC classification number: H04B5/0031 ,  H04B5/0037 ,  H04W76/10 ,  H04W76/14

Abstract: A Physical Layer (PHY) of a host system of an electronic device may be implemented as a contactless PHY (cPHY) for extremely high frequency (EHF) contactless communication and the operation of EHF transmitters (TX), receivers (RX) and transceivers (EHF-XCVR) in an extremely high frequency integrated circuit (EHF IC) of the electronic device. The Host-cPHY translates logical communications requests from the Link Layer (LINK) into hardware-specific operations to affect transmission or reception of signals over an EHF contactless link. The Link Layer (LINK) may also be optimized as a contactless Link Layer (cLINK) for EHF contactless communication. A virtualized contactless Physical Layer (VcPHY) may comprise a contactless Physical Layer (Host-cPHY), and a contactless Link Layer (cLINK) for coupling a conventional Link Layer (LINK) with the contactless Physical Layer (Host-cPHY). Multiple data streams may be transported over the EHF contactless link over a range of frequencies.

Abstract translation: 电子设备的主机系统的物理层（PHY）可以实现为用于极高频（EHF）非接触通信的无触点PHY（cPHY）和EHF发射机（TX），接收机（RX）和收发器 EHF-XCVR）在电子设备的极高频集成电路（EHF IC）中。 Host-cPHY将来自链路层（LINK）的逻辑通信请求转换为特定于硬件的操作，以影响通过EHF非接触式链路传输或接收信号。 链路层（LINK）也可以被优化为用于EHF非接触通信的非接触式链路层（cLINK）。 虚拟化非接触物理层（VcPHY）可以包括用于将常规链路层（LINK）与非接触物理层（Host-cPHY）耦合的非接触式物理层（Host-cPHY）和非接触式链路层（cLINK）。 多个数据流可以在一个频率范围上通过EHF非接触式链路传输。

公开(公告)号：US09474099B2

公开(公告)日：2016-10-18

申请号：US13969565

申请日：2013-08-17

Applicant: Keyssa, Inc.

Inventor： Gary D McCormack ,  Ian A Kyles ,  Roger D Isaac

IPC: H04B7/00 ,  H04W76/04 ,  H04W52/02 ,  H04B1/40 ,  H04B5/00 ,  H05K1/02

CPC classification number: H04W76/043 ,  H04B1/40 ,  H04B5/0031 ,  H04W52/0229 ,  H04W76/23 ,  H05K1/0243 ,  H05K1/0259 ,  H05K2201/10098 ,  Y02D70/142 ,  Y02D70/144 ,  Y02D70/166 ,  Y02D70/40 ,  Y02D70/42

Abstract: “Smart” connectors with embedded processors, measurement circuits and control circuits are disclosed for establishing a “contactless” radio frequency (RF) electromagnetic (EM) Extremely High Frequency (EHF) communications link between two electronic devices having host systems. The connectors are capable of monitoring, controlling, and directing (managing) link operation to dynamically adapt to conditions, as well as monitoring and altering (or modifying) data passing through the connector, and selecting a protocol suitable for a communications session. The connectors are capable of identifying the type of content being transferred, providing authentication and security services, and enabling application support for the host systems based on the type of connection or the type of content. The connectors may operate independently of the host systems, and may perform at least one of sensing proximity of a nearby object; detecting a shape of a nearby object; and detecting vibrations.

Abstract translation: 公开了具有嵌入式处理器，测量电路和控制电路的“智能”连接器，用于在具有主机系统的两个电子设备之间建立“非接触式”射频（RF）电磁（EM）极高频（EHF）通信链路。 连接器能够监视，控制和指导（管理）链接操作以动态地适应条件，以及监视和改变（或修改）通过连接器的数据，并选择适合通信会话的协议。 连接器能够识别正在传送的内容的类型，提供认证和安全服务，并且基于连接的类型或内容的类型来为主机系统启用应用支持。 连接器可以独立于主机系统操作，并且可以执行感测邻近对象的接近中的至少一个; 检测附近物体的形状; 并检测振动。

公开(公告)号：US09929776B2

公开(公告)日：2018-03-27

申请号：US14205605

申请日：2014-03-12

Applicant: Keyssa, Inc.

Inventor： Gary D McCormack ,  Ian A Kyles ,  Roger D Isaac

IPC: H04B5/00 ,  H04W76/02

CPC classification number: H04B5/0031 ,  H04B5/0037 ,  H04W76/10 ,  H04W76/14

Abstract: A Physical Layer (PHY) of a host system of an electronic device may be implemented as a contactless PHY (Host-cPHY) for extremely high frequency (EHF) contactless communication and the operation of EHF transmitters (TX), receivers (RX) and transceivers (EHF-XCVR) in an extremely high frequency integrated circuit (EHF IC) of the electronic device. The Host-cPHY translates logical communications requests from the Link Layer (LINK) into hardware-specific operations to affect transmission or reception of signals over an EHF contactless link). The Link Layer (LINK) may also be optimized as a contactless Link Layer (cLINK) for EHF contactless communication. Multiple data streams may be transported over the EHF contactless link over a range of frequencies.

公开(公告)号：US09344201B2

公开(公告)日：2016-05-17

申请号：US14137939

申请日：2013-12-20

Applicant: Keyssa, Inc.

Inventor： Gary D McCormack ,  Roger D. Isaac

IPC: H04B15/00 ,  H03H7/00 ,  H04B5/00

CPC classification number: H04B15/00 ,  H01L24/73 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/3025 ,  H04B5/0031 ,  H04W4/80 ,  H04W12/06 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: Shielded extremely high frequency (EHF) connector assemblies are disclosed herein. In some embodiments, a first extremely high frequency (EHF) shielded connector assembly configured to be coupled with a second EHF shielded connector assembly. The first EHF connector assembly can include a first EHF communication unit operative to contactlessly communicate EHF signals with a second EHF communication unit included in the second EHF shielded connector assembly. The first connector can include a connector interface that includes a configuration to interface with a respective connector interface of the second EHF shield connector assembly, and several different material compositions that, in conjunction with the configuration, provide shielding to prevent or substantially reduce EHF signal leakage when the first EHF assembly connector is coupled to the second EHF assembly connector and the first EHF communication unit is contactlessly communicating EHF signals with the second EHF communication unit.

Abstract translation: 本文公开了屏蔽的极高频（EHF）连接器组件。 在一些实施例中，构造成与第二EHF屏蔽连接器组件耦合的第一极高频（EHF）屏蔽连接器组件。 第一EHF连接器组件可以包括第一EHF通信单元，其用于与包括在第二EHF屏蔽连接器组件中的第二EHF通信单元非接触地通信EHF信号。 第一连接器可以包括连接器接口，该连接器接口包括与第二EHF屏蔽连接器组件的相应连接器接口接口的配置以及结合该配置提供屏蔽以防止或基本上减少EHF信号泄漏的几种不同的材料组成 当第一EHF组件连接器耦合到第二EHF组件连接器并且第一EHF通信单元与第二EHF通信单元非接触地通信EHF信号时。