Abstract:
A contactless, electromagnetic (EM) replacement (substitute, alternative) for cabled (electric) Standards-based interfaces (such as, but not limited to USB) which effectively handles the data transfer requirements (such as bandwidth, speed, latency) associated with the Standard, and which is also capable of measuring and replicating relevant physical conditions (such as voltage levels) on data lines so as to function compatibly and transparently with the Standard. A contactless link may be provided between devices having transceivers. A non-conducting housing may enclose the devices. Some applications for the contactless (EM) interface are disclosed. A dielectric coupler facilitating communication between communications chips which are several meters apart. Conductive paths may provide power and ground for bus-powered devices.
Abstract:
A Physical Layer (PHY) of a host system of an electronic device may be implemented as a contactless PHY (cPHY) for extremely high frequency (EHF) contactless communication and the operation of EHF transmitters (TX), receivers (RX) and transceivers (EHF-XCVR) in an extremely high frequency integrated circuit (EHF IC) of the electronic device. The Host-cPHY translates logical communications requests from the Link Layer (LINK) into hardware-specific operations to affect transmission or reception of signals over an EHF contactless link. The Link Layer (LINK) may also be optimized as a contactless Link Layer (cLINK) for EHF contactless communication. A virtualized contactless Physical Layer (VcPHY) may comprise a contactless Physical Layer (Host-cPHY), and a contactless Link Layer (cLINK) for coupling a conventional Link Layer (LINK) with the contactless Physical Layer (Host-cPHY). Multiple data streams may be transported over the EHF contactless link over a range of frequencies.
Abstract:
A Physical Layer (PHY) of a host system of an electronic device may be implemented as a contactless PHY (Host-cPHY) for extremely high frequency (EHF) contactless communication and the operation of EHF transmitters (TX), receivers (RX) and transceivers (EHF-XCVR) in an extremely high frequency integrated circuit (EHF IC) of the electronic device. The Host-cPHY translates logical communications requests from the Link Layer (LINK) into hardware-specific operations to affect transmission or reception of signals over an EHF contactless link). The Link Layer (LINK) may also be optimized as a contactless Link Layer (cLINK) for EHF contactless communication. Multiple data streams may be transported over the EHF contactless link over a range of frequencies.
Abstract:
“Smart” connectors with embedded processors, measurement circuits and control circuits are disclosed for establishing a “contactless” radio frequency (RF) electromagnetic (EM) Extremely High Frequency (EHF) communications link between two electronic devices having host systems. The connectors are capable of monitoring, controlling, and directing (managing) link operation to dynamically adapt to conditions, as well as monitoring and altering (or modifying) data passing through the connector, and selecting a protocol suitable for a communications session. The connectors are capable of identifying the type of content being transferred, providing authentication and security services, and enabling application support for the host systems based on the type of connection or the type of content. The connectors may operate independently of the host systems, and may perform at least one of sensing proximity of a nearby object; detecting a shape of a nearby object; and detecting vibrations.