公开(公告)号：US20170170913A1

公开(公告)日：2017-06-15

申请号：US14968739

申请日：2015-12-14

Applicant: Keyssa Systems, Inc.

Inventor： Giriraj Mantrawadi ,  Dennis F. Rosenauer ,  Ian A. Kyles ,  Eric Sweetman ,  Roger D. Isaac ,  Stephan Lang

IPC: H04B15/00

CPC classification number: H04B15/00 ,  H05K3/36

Abstract: Systems and apparatus for electromagnetic communications are provided. One of the apparatuses include a communication module, the communication module including: a printed circuit board; a plurality of integrated circuit packages, each integrated circuit package including at least one transmitter, receiver, or transceiver; a plurality of signal guiding structures, each signal guiding structure being associated with a corresponding integrated circuit package of the plurality of integrated circuit packages; and one or more signal blocking structures positioned between one or more pairs of integrated circuit packages.

公开(公告)号：US10882408B2

公开(公告)日：2021-01-05

申请号：US15685356

申请日：2017-08-24

Applicant: Keyssa Systems, Inc.

Inventor： Alan Besel ,  Stephan Lang

IPC: H01R13/62 ,  B60L53/14 ,  H01R13/66 ,  B60L53/16 ,  B60L53/65 ,  B60L53/30 ,  H02J7/00 ,  H01R12/71 ,  H02J50/80 ,  H02J50/90 ,  H02J50/10 ,  H01F38/14 ,  H02J7/02 ,  H02J7/04 ,  H04B5/00 ,  H01F27/36

Abstract: Embodiments discussed herein refer to connectors that enable two structures or devices to be coupled together in a manner that enables consistent and reliable operation of contactless communications and power transfer. The connector integrates power and alignment such that when two connectors are coupled together the power connections are also responsible for connector alignment. The connector alignment ensures that contactless communication channels, spanning between the connectors, are aligned to enable consistent and reliable operation of contactless communications.

公开(公告)号：US10389454B2

公开(公告)日：2019-08-20

申请号：US14968739

申请日：2015-12-14

Applicant: Keyssa Systems, Inc.

Inventor： Giriraj Mantrawadi ,  Dennis F. Rosenauer ,  Ian A. Kyles ,  Eric Sweetman ,  Roger D. Isaac ,  Stephan Lang

IPC: H04B15/00 ,  H05K3/36

Abstract: Systems and apparatus for electromagnetic communications are provided. One of the apparatuses include a communication module, the communication module including: a printed circuit board; a plurality of integrated circuit packages, each integrated circuit package including at least one transmitter, receiver, or transceiver; a plurality of signal guiding structures, each signal guiding structure being associated with a corresponding integrated circuit package of the plurality of integrated circuit packages; and one or more signal blocking structures positioned between one or more pairs of integrated circuit packages.

公开(公告)号：US10720689B2

公开(公告)日：2020-07-21

申请号：US15818237

申请日：2017-11-20

Applicant: Keyssa Systems, Inc.

Inventor： James Gill Shook ,  Stephan Lang ,  Alan Besel ,  Dennis F. Rosenauer ,  Giriraj Mantrawadi ,  Eric Sweetman ,  Bojana Zivanovic ,  Srikanth Gondi

IPC: H01P5/107 ,  H01P5/02 ,  H03H7/38 ,  H01P3/20 ,  H04B5/00

Abstract: Conduit structures for guiding extremely high frequency (EHF) signals are disclosed herein. The conduit structures can include EHF containment channels that define EHF signal pathways through which EHF signal energy is directed. The conduit structures can minimize or eliminate crosstalk among adjacent paths within a device and across devices. Launch structures that interface with waveguides are also disclosed herein. Launch structures can control the EHF interface impedance between a contactless communication unit and the waveguide. Waveguide structures discussed herein are designed to provide maximum bandwidth with minimal jitter over a desired distance.

公开(公告)号：US20190356395A1

公开(公告)日：2019-11-21

申请号：US16525124

申请日：2019-07-29

Applicant: Keyssa Systems, Inc.

Inventor： Giriraj Mantrawadi ,  Dennis F. Rosenauer ,  Ian A. Kyles ,  Eric Sweetman ,  Roger D. Issac ,  Stephan Lang

IPC: H04B15/00

Abstract: Systems and apparatus for electromagnetic communications are provided. One of the apparatuses include a communication module, the communication module including: a printed circuit board; a plurality of integrated circuit packages, each integrated circuit package including at least one transmitter, receiver, or transceiver; a plurality of signal guiding structures, each signal guiding structure being associated with a corresponding integrated circuit package of the plurality of integrated circuit packages; and one or more signal blocking structures positioned between one or more pairs of integrated circuit packages.

公开(公告)号：US20190157738A1

公开(公告)日：2019-05-23

申请号：US15818237

申请日：2017-11-20

Applicant: Keyssa Systems, Inc.

Inventor： James Gill Shook ,  Stephan Lang ,  Alan Besel ,  Dennis F. Rosenauer ,  Giriraj Mantrawadi ,  Eric Sweetman ,  Bojana Zivanovic ,  Srikanth Gondi

IPC: H01P5/02 ,  H01P3/20 ,  H03H7/38

Abstract: Conduit structures for guiding extremely high frequency (EHF) signals are disclosed herein. The conduit structures can include EHF containment channels that define EHF signal pathways through which EHF signal energy is directed. The conduit structures can minimize or eliminate crosstalk among adjacent paths within a device and across devices. Launch structures that interface with waveguides are also disclosed herein. Launch structures can control the EHF interface impedance between a contactless communication unit and the waveguide. Waveguide structures discussed herein are designed to provide maximum bandwidth with minimal jitter over a desired distance.

公开(公告)号：US20180062454A1

公开(公告)日：2018-03-01

申请号：US15685356

申请日：2017-08-24

Applicant: Keyssa Systems, Inc.

Inventor： Alan Besel ,  Stephan Lang

IPC: H02J50/90 ,  H01F38/14 ,  H02J7/00 ,  H02J50/10 ,  H02J50/80

CPC classification number: H02J50/90 ,  B60L53/12 ,  B60L53/14 ,  B60L53/16 ,  B60L53/30 ,  B60L53/305 ,  B60L53/60 ,  B60L53/65 ,  B60L2270/38 ,  B60L2270/40 ,  H01F27/36 ,  H01F38/14 ,  H01F2038/143 ,  H01F2038/146 ,  H01R13/6205 ,  H01R13/6608 ,  H02J7/0004 ,  H02J7/0027 ,  H02J7/0042 ,  H02J7/025 ,  H02J7/04 ,  H02J50/10 ,  H02J50/80 ,  H04B5/0031 ,  Y02T10/7005 ,  Y02T10/7088 ,  Y02T90/121 ,  Y02T90/128 ,  Y02T90/14 ,  Y02T90/16 ,  Y02T90/163 ,  Y02T90/169 ,  Y04S30/14

Abstract: Embodiments discussed herein refer to connectors that enable two structures or devices to be coupled together in a manner that enables consistent and reliable operation of contactless communications and power transfer. The connector integrates power and alignment such that when two connectors are coupled together the power connections are also responsible for connector alignment. The connector alignment ensures that contactless communication channels, spanning between the connectors, are aligned to enable consistent and reliable operation of contactless communications.