公开(公告)号：US10797371B2

公开(公告)日：2020-10-06

申请号：US16375655

申请日：2019-04-04

Applicant: Keyssa Systems, Inc.

Inventor： Alan Besel ,  Eric Sweetman ,  Bojana Zivanovic

IPC: H01P3/12 ,  H01P3/16 ,  H01P5/107 ,  H01Q13/02 ,  H01Q13/06 ,  H04B5/00 ,  H02J7/00

Abstract: Conduit structures for redirecting extremely high frequency (EHF) signals are disclosed herein. The conduit structures discussed herein are designed to re-direct EHF or RF signal energy from a first signal path to a second signal path. The conduit structures according to embodiments discussed herein can re-direct the RF signal energy while simultaneously adhering to specified signaling characteristic of the RF signal and minimizing stray RF signal radiation within a device to support device-to-device contactless communications.

公开(公告)号：US20170263576A1

公开(公告)日：2017-09-14

申请号：US15068417

申请日：2016-03-11

Applicant: Keyssa Systems, Inc.

Inventor： Mostafa Naguib Abdulla ,  Mohamed Sameh Mahmoud ,  Alan Besel ,  Eric Sweetman ,  Bojana Zivanoic ,  Giriraj Mantrawadi

IPC: H01L23/64 ,  H05K1/18

CPC classification number: H01L23/64 ,  H01L2224/48091 ,  H01L2924/181 ,  H04B15/00 ,  H05K1/0216 ,  H05K1/181 ,  H05K9/006 ,  H05K2201/10371 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Methods, systems, and apparatus for EM isolation structures. One of the apparatus includes a communication module, the communication module including: a printed circuit board; a plurality of integrated circuit packages, each integrated circuit package including at least one transmitter, receiver, or transceiver; and one or more metallic blocking structures configured to at least partially encircle a corresponding one of the plurality of integrated circuit packages, wherein each metallic blocking structure is configured to reduce signal leakage from the corresponding integrated circuit package.

公开(公告)号：US10389454B2

公开(公告)日：2019-08-20

申请号：US14968739

申请日：2015-12-14

Applicant: Keyssa Systems, Inc.

Inventor： Giriraj Mantrawadi ,  Dennis F. Rosenauer ,  Ian A. Kyles ,  Eric Sweetman ,  Roger D. Isaac ,  Stephan Lang

IPC: H04B15/00 ,  H05K3/36

Abstract: Systems and apparatus for electromagnetic communications are provided. One of the apparatuses include a communication module, the communication module including: a printed circuit board; a plurality of integrated circuit packages, each integrated circuit package including at least one transmitter, receiver, or transceiver; a plurality of signal guiding structures, each signal guiding structure being associated with a corresponding integrated circuit package of the plurality of integrated circuit packages; and one or more signal blocking structures positioned between one or more pairs of integrated circuit packages.

公开(公告)号：US10454526B1

公开(公告)日：2019-10-22

申请号：US15398588

申请日：2017-01-04

Applicant: Keyssa Systems, Inc.

Inventor： Ahmed Khidre ,  Mohamed Sameh Mahmoud ,  Eric Sweetman

IPC: H04M1/00 ,  H04B3/32 ,  H05K9/00 ,  H04M1/02

Abstract: Systems and apparatuses for electromagnetic communications are provided. One of the apparatuses includes a housing portion for an electronic device, wherein the housing portion comprises: a first region formed from a first material; and a second region comprising an arrangement of structures formed from the first material and a second material, wherein the arrangement of structures reduce propagation of electromagnetic radiation propagating through the second region.

公开(公告)号：US20190089037A1

公开(公告)日：2019-03-21

申请号：US15708522

申请日：2017-09-19

Applicant: Keyssa Systems, Inc.

Inventor： Alan Besel ,  Eric Sweetman

IPC: H01Q1/12 ,  H04B5/00 ,  H01P5/02

Abstract: Hinge assemblies that serve as conduits for guiding extremely high frequency (EHF) signals are disclosed herein. The hinge assembly can contain EHF signal energy as data is transmitted from one structure to the other and the hinge assembly can also include a one or more waveguides that define EHF signal pathways through which EHF signal energy is directed. Each hinge assembly may serve as a conduit structure for each coupled pair of contactless communication units (CCUs), and multiple hinge assemblies may be used as separate conduit structures each of several coupled pairs of contactless communication unit.

公开(公告)号：US20180182723A1

公开(公告)日：2018-06-28

申请号：US15888632

申请日：2018-02-05

Applicant: Keyssa Systems, Inc.

Inventor： Mostafa Naguib Abdulla ,  Mohamed Sameh Mahmoud ,  Alan Besel ,  Eric Sweetman ,  Bojana Zivanoic ,  Giriraj Mantrawadi

IPC: H01L23/64 ,  H05K1/18 ,  H04B15/00

CPC classification number: H01L23/64 ,  H01L24/00 ,  H01L2224/48091 ,  H01L2924/181 ,  H04B15/00 ,  H05K1/0216 ,  H05K1/181 ,  H05K9/006 ,  H05K2201/10371 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Methods, systems, and apparatus for EM isolation structures. One of the apparatus includes a communication module, the communication module including: a printed circuit board; a plurality of integrated circuit packages, each integrated circuit package including at least one transmitter, receiver, or transceiver; and one or more metallic blocking structures configured to at least partially encircle a corresponding one of the plurality of integrated circuit packages, wherein each metallic blocking structure is configured to reduce signal leakage from the corresponding integrated circuit package.

公开(公告)号：US20170170913A1

公开(公告)日：2017-06-15

申请号：US14968739

申请日：2015-12-14

Applicant: Keyssa Systems, Inc.

Inventor： Giriraj Mantrawadi ,  Dennis F. Rosenauer ,  Ian A. Kyles ,  Eric Sweetman ,  Roger D. Isaac ,  Stephan Lang

IPC: H04B15/00

CPC classification number: H04B15/00 ,  H05K3/36

Abstract: Systems and apparatus for electromagnetic communications are provided. One of the apparatuses include a communication module, the communication module including: a printed circuit board; a plurality of integrated circuit packages, each integrated circuit package including at least one transmitter, receiver, or transceiver; a plurality of signal guiding structures, each signal guiding structure being associated with a corresponding integrated circuit package of the plurality of integrated circuit packages; and one or more signal blocking structures positioned between one or more pairs of integrated circuit packages.

公开(公告)号：US10483614B2

公开(公告)日：2019-11-19

申请号：US15708522

申请日：2017-09-19

Applicant: Keyssa Systems, Inc.

Inventor： Alan Besel ,  Eric Sweetman

IPC: H01P5/12 ,  H01Q1/12 ,  H01P5/02 ,  H04B5/00 ,  H01P5/04 ,  H01Q1/22 ,  H01Q21/28 ,  H04B1/04

Abstract: Hinge assemblies that serve as conduits for guiding extremely high frequency (EHF) signals are disclosed herein. The hinge assembly can contain EHF signal energy as data is transmitted from one structure to the other and the hinge assembly can also include a one or more waveguides that define EHF signal pathways through which EHF signal energy is directed. Each hinge assembly may serve as a conduit structure for each coupled pair of contactless communication units (CCUs), and multiple hinge assemblies may be used as separate conduit structures each of several coupled pairs of contactless communication unit.

公开(公告)号：US20190305398A1

公开(公告)日：2019-10-03

申请号：US16375655

申请日：2019-04-04

Applicant: Keyssa Systems, Inc.

Inventor： Alan Besel ,  Eric Sweetman ,  Bojana Zivanovic

IPC: H01P3/12 ,  H02J7/00 ,  H04B5/00 ,  H01Q13/06 ,  H01P5/107 ,  H01P3/16 ,  H01Q13/02

Abstract: Conduit structures for redirecting extremely high frequency (EHF) signals are disclosed herein. The conduit structures discussed herein are designed to re-direct EHF or RF signal energy from a first signal path to a second signal path. The conduit structures according to embodiments discussed herein can re-direct the RF signal energy while simultaneously adhering to specified signaling characteristic of the RF signal and minimizing stray RF signal radiation within a device to support device-to-device contactless communications.

公开(公告)号：US10403586B2

公开(公告)日：2019-09-03

申请号：US15888632

申请日：2018-02-05

Applicant: Keyssa Systems, Inc.

Inventor： Mostafa Naguib Abdulla ,  Mohamed Sameh Mahmoud ,  Alan Besel ,  Eric Sweetman ,  Bojana Zivanoic ,  Giriraj Mantrawadi

IPC: H01L23/64 ,  H05K1/18 ,  H04B15/00 ,  H05K9/00 ,  H05K1/02

Abstract: Methods, systems, and apparatus for EM isolation structures. One of the apparatus includes a communication module, the communication module including: a printed circuit board; a plurality of integrated circuit packages, each integrated circuit package including at least one transmitter, receiver, or transceiver; and one or more metallic blocking structures configured to at least partially encircle a corresponding one of the plurality of integrated circuit packages, wherein each metallic blocking structure is configured to reduce signal leakage from the corresponding integrated circuit package.