公开(公告)号：US20230284390A1

公开(公告)日：2023-09-07

申请号：US18079514

申请日：2022-12-12

Applicant: Kioxia Corporation

Inventor： Kazuya NAGASAWA ,  Norihiro ISHII ,  Kazuhiro NOJIMA ,  Tamotsu FUJIMAKI

IPC: H05K1/18

CPC classification number: H05K1/182 ,  H05K2201/10159

Abstract: A semiconductor storage device according to an embodiment includes a board, an electronic component, and a holder. The board has a first surface. The electronic component includes a component main body and a first lead. The component main body is at a position out of the board in a direction parallel to the first surface. The first lead protrudes from the component main body toward the board. The holder is on the board. The holder holds the first lead.

公开(公告)号：US20210282267A1

公开(公告)日：2021-09-09

申请号：US17016848

申请日：2020-09-10

Applicant: Kioxia Corporation

Inventor： Kazuya NAGASAWA ,  Norihiro ISHII

IPC: H05K3/00

Abstract: A method of cutting an electronic component mounted on a circuit board includes: a step of applying adhesive to a predetermined area including at least an outermost peripheral portion of an upper surface of the electronic component and attaching a dustproof sheet to the upper surface of the electronic component; and a step of cutting the electronic component while maintaining a state where the dustproof sheet is attached to the outermost peripheral portion.

公开(公告)号：US20220304137A1

公开(公告)日：2022-09-22

申请号：US17473093

申请日：2021-09-13

Applicant: Kioxia Corporation

Inventor： Kazuya NAGASAWA ,  Tomoaki MORITA ,  Takahisa FUNAYAMA ,  Norihiro ISHII ,  Hidenori TANAKA

IPC: H05K1/02 ,  H05K1/18

Abstract: According to one embodiment, a semiconductor storage device includes a board, a first electronic device mounted on the board, at least one second electronic device mounted on the board, and a heat dissipator. At least a portion of the second electronic device overlaps at least one of the board and the first electronic device in a first direction that is a thickness direction of the board. The heat dissipator includes a first member that includes a first portion located between the first electronic device and the second electronic device in the first direction, and a second member that includes a portion located between the first member and the second electronic device in the first direction. The second member is smaller in coefficient of thermal conductivity than the first member.