公开(公告)号：US20090195125A1

公开(公告)日：2009-08-06

申请号：US12361031

申请日：2009-01-28

Applicant: Kiyotaka MATSUGI

Inventor： Kiyotaka MATSUGI

IPC: H01L41/053

CPC classification number: H03H9/1021 ,  B81B7/0041 ,  B81B2201/0271 ,  B81C2203/0145 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/01079 ,  Y10T29/42 ,  H01L2924/00

Abstract: A piezoelectric device includes: a piezoelectric resonator element; a package storing the piezoelectric resonator element therein in a manner to mount the piezoelectric resonator element on a base portion thereof composed of at least three layers that are layered; and a through hole penetrating through the base portion. In the device, the through hole includes a first hole formed on a first layer which is positioned to face the piezoelectric resonator element among the three layers; a second hole formed on a second layer contacting with the first layer; a third hole formed larger than the second hole on a third layer contacting with the second layer; and a metal coat formed on an inner wall surface of the second hole, and a sealing part for sealing the package is formed with a sealant in at least the second hole.

Abstract translation: 压电装置包括：压电谐振元件; 以压电谐振元件的方式将压电谐振元件安装在由层叠的至少三层构成的基底部分上的封装; 以及穿过基部的通孔。 在该装置中，通孔包括形成在第一层上的第一孔，该第一层定位成面对三层之间的压电谐振元件; 形成在与第一层接触的第二层上的第二孔; 在与第二层接触的第三层上比第二孔大的第三孔; 以及形成在第二孔的内壁表面上的金属涂层和用于密封包装的密封部分至少在第二孔中形成有密封剂。

公开(公告)号：US20100251527A1

公开(公告)日：2010-10-07

申请号：US12816042

申请日：2010-06-15

Applicant: Kiyotaka MATSUGI

Inventor： Kiyotaka MATSUGI

IPC: H01L41/22

CPC classification number: H03H9/1021 ,  B81B7/0041 ,  B81B2201/0271 ,  B81C2203/0145 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/16195 ,  Y10T29/42 ,  H01L2924/00

Abstract: A piezoelectric device includes: a piezoelectric resonator element; a package storing the piezoelectric resonator element therein in a manner to mount the piezoelectric resonator element on a base portion thereof composed of at least three layers that are layered; and a through hole penetrating through the base portion. In the device, the through hole includes a first hole formed on a first layer which is positioned to face the piezoelectric resonator element among the three layers; a second hole formed on a second layer contacting with the first layer; a third hole formed larger than the second hole on a third layer contacting with the second layer; and a metal coat formed on an inner wall surface of the second hole, and a sealing part for sealing the package is formed with a sealant in at least the second hole.

Abstract translation: 压电装置包括：压电谐振元件; 以压电谐振元件的方式将压电谐振元件安装在由层叠的至少三层构成的基底部分上的封装; 以及穿过基部的通孔。 在该装置中，通孔包括形成在第一层上的第一孔，该第一层定位成面对三层之间的压电谐振元件; 形成在与第一层接触的第二层上的第二孔; 在与第二层接触的第三层上比第二孔大的第三孔; 以及形成在第二孔的内壁表面上的金属涂层和用于密封包装的密封部分至少在第二孔中形成有密封剂。