公开(公告)号：US20220033248A1

公开(公告)日：2022-02-03

申请号：US16944362

申请日：2020-07-31

Applicant: Knowles Electronics, LLC

Inventor： Adam Ariffin ,  Donald Yochem

IPC: B81B7/00 ,  H04R19/04

Abstract: A sensor package can include a substrate including a plurality of layers. The plurality of layers can include a first pair of layers and a second pair of layers different from the first pair of layers. The substrate can have a first side and a second side opposite the first side. The sensor package can include a transducer coupled to the second side of the substrate. The sensor package can include an inductor electrically coupled to the transducer. The inductor can be configured as a single layer trace on an inductor layer within the substrate and disposed between the first pair of layers within the substrate. The first pair of layers can be more distal from the second side of the substrate than the second pair of layers.

公开(公告)号：US11711641B2

公开(公告)日：2023-07-25

申请号：US17602015

申请日：2019-04-10

Applicant: Knowles Electronics, LLC

Inventor： Donald Yochem ,  Meiling Huang

IPC: H04R1/08 ,  H04R7/16

CPC classification number: H04R1/08 ,  H04R7/16

Abstract: The present disclosure relates to microphone devices. One microphone assembly includes a transducer and a housing. The microphone assembly includes an integrated circuit coupled to the transducer. The housing includes a port, a base, and a cover. The cover includes an inner wall and an outer wall. The inner wall and outer wall can be coupled to the base. The inner wall and the base are mechanically coupled and define an enclosed volume. The transducer is disposed in the enclosed volume.

公开(公告)号：US20220159360A1

公开(公告)日：2022-05-19

申请号：US17602015

申请日：2019-04-10

Applicant: Knowles Electronics, LLC

Inventor： Donald Yochem ,  Meiling Huang

IPC: H04R1/08 ,  H04R7/16

Abstract: The present disclosure relates to microphone devices. One microphone assembly includes a transducer and a housing. The microphone assembly includes an integrated circuit coupled to the transducer. The housing includes a port, a base, and a cover. The cover includes an inner wall and an outer wall. The inner wall and outer wall can be coupled to the base. The inner wall and the base are mechanically coupled and define an enclosed volume. The transducer is disposed in the enclosed volume.

公开(公告)号：US11912564B2

公开(公告)日：2024-02-27

申请号：US16944362

申请日：2020-07-31

Applicant: Knowles Electronics, LLC

Inventor： Adam Ariffin ,  Donald Yochem

IPC: B81B7/00 ,  H04R19/04

CPC classification number: B81B7/008 ,  H04R19/04 ,  B81B2201/0221 ,  B81B2201/0257 ,  H04R2201/003

Abstract: A sensor package can include a substrate including a plurality of layers. The plurality of layers can include a first pair of layers and a second pair of layers different from the first pair of layers. The substrate can have a first side and a second side opposite the first side. The sensor package can include a transducer coupled to the second side of the substrate. The sensor package can include an inductor electrically coupled to the transducer. The inductor can be configured as a single layer trace on an inductor layer within the substrate and disposed between the first pair of layers within the substrate. The first pair of layers can be more distal from the second side of the substrate than the second pair of layers.

公开(公告)号：US11894599B2

公开(公告)日：2024-02-06

申请号：US17108713

申请日：2020-12-01

Applicant: Knowles Electronics, LLC

Inventor： Karan Jumani ,  Donald Yochem

IPC: H01Q1/22 ,  H01Q1/38 ,  H04R1/02 ,  H04R3/00 ,  H04R19/04

CPC classification number: H01Q1/22 ,  H01Q1/38 ,  H04R1/021 ,  H04R1/028 ,  H04R3/00 ,  H04R19/04 ,  H04R2201/003

Abstract: Integrated microphone and antennas include a microphone and an antenna. The microphone includes a housing and an acoustic transducer. The housing defines a cavity and includes a conductive layer. The acoustic transducer is positioned within the cavity and structured to generate an acoustic signal. The antenna is at least partially integrated with the microphone and structured to transmit and receive radio frequency signals. The antenna is structured to utilize the conductive layer of the housing as a radiating element.

公开(公告)号：US20210144487A1

公开(公告)日：2021-05-13

申请号：US17156494

申请日：2021-01-22

Applicant: Knowles Electronics, LLC

Inventor： Joshua Watson ,  Karan Jumani ,  Donald Yochem

IPC: H04R19/04 ,  H01F27/40 ,  H04R1/04 ,  H04R31/00 ,  H04R3/00

Abstract: Microphone devices and methods for manufacturing microphone devices that include a substrate having a first surface and a second surface, a cover secured to the first surface of the substrate to form an enclosed back volume, an application specific integrated circuit (ASIC) embedded between the first surface and the second surface of the substrate, a microelectromechanical systems (MEMS) transducer mounted on the first surface of the substrate, and an inductor mounted on the first surface of the substrate.

公开(公告)号：US20210083359A1

公开(公告)日：2021-03-18

申请号：US17108713

申请日：2020-12-01

Applicant: Knowles Electronics, LLC

Inventor： Karen Jumani ,  Donald Yochem

IPC: H01Q1/22 ,  H01Q1/38 ,  H04R1/02 ,  H04R3/00 ,  H04R19/04

Abstract: Integrated microphone and antennas include a microphone and an antenna. The microphone includes a housing and an acoustic transducer. The housing defines a cavity and includes a conductive layer. The acoustic transducer is positioned within the cavity and structured to generate an acoustic signal. The antenna is at least partially integrated with the microphone and structured to transmit and receive radio frequency signals. The antenna is structured to utilize the conductive layer of the housing as a radiating element.