公开(公告)号：US07516542B2

公开(公告)日：2009-04-14

申请号：US11254312

申请日：2005-10-19

Applicant: Koji Temba

Inventor： Koji Temba

IPC: H05K3/36

CPC classification number: H01L21/485 ,  H01L23/5382 ,  H01L2924/0002 ,  H05K1/0287 ,  H05K1/0289 ,  H05K3/328 ,  H05K2201/09681 ,  H05K2201/09945 ,  H05K2203/175 ,  Y10T29/49126 ,  Y10T29/49155 ,  H01L2924/00

Abstract: A wiring board is manufactured by a step of forming a meshy cylindrical body, where plural conductive rings are connected to each other at plural positions in the respective peripheral direction, a step of forming laminated meshy sheets, by squashing the meshy cylindrical body in the radial direction, a step of inserting an insulation sheet between the meshy sheets, and a step of forming lacking portions at a position in the peripheral direction of conductive rings of the meshy sheets. It becomes possible to directly join a semiconductor chip to the conductive ring of the meshy sheet, and therefore, a wiring circuit can be obtained without using a solder joint.

Abstract translation: 通过形成网状圆柱体的步骤制造布线板，其中多个导电环在各个周向的多个位置处彼此连接，通过在径向上挤压网状圆柱体而形成叠层网状片的步骤 方向，在网状片材之间插入绝缘片的步骤，以及在网状片材的导电环的周向的位置处形成缺损部分的步骤。 可以将半导体芯片直接接合到网状片的导电环上，因此可以在不使用焊点的情况下获得布线电路。

公开(公告)号：US20060091544A1

公开(公告)日：2006-05-04

申请号：US11254312

申请日：2005-10-19

Applicant: Koji Temba

Inventor： Koji Temba

IPC: H01L23/48

CPC classification number: H01L21/485 ,  H01L23/5382 ,  H01L2924/0002 ,  H05K1/0287 ,  H05K1/0289 ,  H05K3/328 ,  H05K2201/09681 ,  H05K2201/09945 ,  H05K2203/175 ,  Y10T29/49126 ,  Y10T29/49155 ,  H01L2924/00

Abstract: A wiring board is manufactured by a step of forming a meshy cylindrical body, where plural conductive rings are connected to each other at plural positions in the respective peripheral direction, a step of forming laminated meshy sheets, by squashing the meshy cylindrical body in the radial direction, a step of inserting an insulation sheet between the meshy sheets, and a step of forming lacking portions at a position in the peripheral direction of conductive rings of the meshy sheets. It becomes possible to directly join a semiconductor chip to the conductive ring of the meshy sheet, and therefore, a wiring circuit can be obtained without using a solder joint.