公开(公告)号：US20050285253A1

公开(公告)日：2005-12-29

申请号：US10876434

申请日：2004-06-24

Applicant: Kumamoto Takashi

Inventor： Kumamoto Takashi

IPC: H01L21/4763 ,  H01L21/48 ,  H01L23/053 ,  H05K1/02 ,  H05K3/02 ,  H05K3/34 ,  H05K3/38 ,  H05K3/40

CPC classification number: H01L21/486 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H05K1/0204 ,  H05K3/022 ,  H05K3/341 ,  H05K3/386 ,  H05K3/4046 ,  H05K2201/0355 ,  H05K2201/10242 ,  H05K2201/10416 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A preformed copper plug may be inserted into a via hole in a package substrate. The opposed surfaces of the copper preform may be covered with a solder material. Copper foils may then be applied over the core and over the preformed plug. A vacuum hot press method may be utilized to activate or cure adhesive between the foil and the core to adhesively secure the foil to the core. At the same time, the heat from the vacuum hot press method may solder the copper foil to the solder coated copper plug. Thus, in some embodiments, the difficulty of filling via holes in situ with plated copper may be reduced, increasing throughput and reducing cost in some cases.

Abstract translation: 预先形成的铜塞可以插入到封装基板的通孔中。 铜预制件的相对表面可以用焊料材料覆盖。 然后可以将铜箔施加在芯上并在预制塞上。 可以使用真空热压法来激活或固化箔和芯之间的粘合剂，以将箔粘合地固定到芯上。 同时，来自真空热压法的热量可以将铜箔焊接到焊料涂覆的铜塞上。 因此，在一些实施例中，可以减少用电镀铜原位填充孔的困难，在一些情况下可以降低生产量并降低成本。

公开(公告)号：US20060166490A1

公开(公告)日：2006-07-27

申请号：US11392120

申请日：2006-03-29

Applicant: Kumamoto Takashi

Inventor： Kumamoto Takashi

IPC: H01L21/4763

CPC classification number: H01L21/486 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H05K1/0204 ,  H05K3/022 ,  H05K3/341 ,  H05K3/386 ,  H05K3/4046 ,  H05K2201/0355 ,  H05K2201/10242 ,  H05K2201/10416 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A preformed copper plug may be inserted into a via hole in a package substrate. The opposed surfaces of the copper preform may be covered with a solder material. Copper foils may then be applied over the core and over the preformed plug. A vacuum hot press method may be utilized to activate or cure adhesive between the foil and the core to adhesively secure the foil to the core. At the same time, the heat from the vacuum hot press method may solder the copper foil to the solder coated copper plug. Thus, in some embodiments, the difficulty of filling via holes in situ with plated copper may be reduced, increasing throughput and reducing cost in some cases.

Abstract translation: 预先形成的铜塞可以插入到封装基板的通孔中。 铜预制件的相对表面可以用焊料材料覆盖。 然后可以将铜箔施加在芯上并在预制塞上。 可以使用真空热压法来激活或固化箔和芯之间的粘合剂，以将箔粘合地固定到芯上。 同时，来自真空热压法的热量可以将铜箔焊接到焊料涂覆的铜塞上。 因此，在一些实施例中，可以减少用电镀铜原位填充孔的困难，在一些情况下可以降低生产量并降低成本。

公开(公告)号：US20060000718A1

公开(公告)日：2006-01-05

申请号：US10881016

申请日：2004-06-30

Applicant: Kumamoto Takashi

Inventor： Kumamoto Takashi

IPC: C25D5/02

CPC classification number: H05K3/242 ,  H05K3/42 ,  H05K2203/0152 ,  H05K2203/1536 ,  H05K2203/1581

Abstract: An apparatus includes a first package substrate, a second package substrate, and a deformable conductor sandwiched between the first package substrate and the second package substrate.

Abstract translation: 一种装置包括第一封装基板，第二封装基板和夹在第一封装基板和第二封装基板之间的可变形导体。