公开(公告)号：US20120049945A1

公开(公告)日：2012-03-01

申请号：US12943080

申请日：2010-11-10

Applicant: Toru MEGURO ,  Kunihiro WATANABE

Inventor： Toru MEGURO ,  Kunihiro WATANABE

IPC: H04B1/10

CPC classification number: H01P1/15 ,  H03H7/0123 ,  H03H7/1766 ,  H03H2001/0085 ,  H04B1/006 ,  H04B1/48

Abstract: A high-frequency switch module includes a FET switch mounted on a multilayer substrate and a low pass filter arranged between the FET switch and a transmission signal input terminal. The low pass filter includes at least one inductor connected in series between a transmission input port and the transmission signal input terminal, a first capacitor, one end of which is connected to the transmission input port and the other end of which is grounded, and a second capacitor, one end of which is connected to the transmission signal input terminal and the other end of which is grounded, and the first capacitor and the second capacitor have different capacitance values.

Abstract translation: 高频开关模块包括安装在多层基板上的FET开关和布置在FET开关和传输信号输入端之间的低通滤波器。 低通滤波器包括串联连接在传输输入端口和传输信号输入端子之间的至少一个电感器，第一电容器的一端连接到传输输入端口，另一端接地，第一电容器 第二电容器的一端连接到发送信号输入端子，另一端接地，第一电容器和第二电容器具有不同的电容值。

公开(公告)号：US20080191956A1

公开(公告)日：2008-08-14

申请号：US12109521

申请日：2008-04-25

Applicant: Kunihiro WATANABE

Inventor： Kunihiro WATANABE

IPC: H01Q1/52

CPC classification number: H01Q1/526 ,  H01L24/48 ,  H01L25/162 ,  H01L2223/6677 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/181 ,  H01L2924/19106 ,  H01L2924/3025 ,  H01Q9/0485 ,  H01Q23/00 ,  H05K1/0218 ,  H05K1/141 ,  H05K3/284 ,  H05K2201/0715 ,  H05K2201/09772 ,  H05K2201/10242 ,  H05K2203/1572 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: In a high-frequency module, an antenna device is disposed on a first principal surface of a second substrate, a first principal surface of a first substrate and a second principal surface of the second substrate face each other and are connected to each other by conductive connecting members, electronic components including an IC chip are mounted on the first principal surface of the first substrate, ground electrodes are disposed on the first and second substrates, the conductive connecting members are connected to a ground potential, and thus the IC chip is surrounded by the ground electrodes of the first and second substrates and the conductive connecting members.

Abstract translation: 在高频模块中，天线装置设置在第二基板的第一主表面上，第一基板的第一主表面和第二基板的第二主表面彼此面对并且通过导电 连接构件，包括IC芯片的电子部件安装在第一基板的第一主表面上，接地电极设置在第一和第二基板上，导电连接构件连接到接地电位，因此IC芯片被包围 通过第一和第二基板的接地电极和导电连接构件。