-
公开(公告)号:US10692621B2
公开(公告)日:2020-06-23
申请号:US15547437
申请日:2016-01-29
Applicant: Kuprion Inc.
Inventor: Byung Hoon Lee , Chee Lip Gan , Yeng Ming Lam , Alfred A. Zinn
Abstract: According to embodiments of the present invention, a method of interconnecting nanowires is provided. The method includes providing a plurality of nanowires, providing a plurality of nanoparticles, and fusing the plurality of nanoparticles to the plurality of nanowires to interconnect the plurality of nanowires to each other via the plurality of nanoparticles. According to further embodiments of the present invention, a nanowire network and a transparent conductive electrode are also provided.
-
公开(公告)号:US12091567B2
公开(公告)日:2024-09-17
申请号:US17591264
申请日:2022-02-02
Applicant: Kuprion, Inc.
Inventor: Zhenggang Li , Yeng Ming Lam , Chee Lip Gan , Jaewon Kim , Alfred A. Zinn
IPC: C09D11/52 , B22F1/052 , B22F1/0545 , B22F1/102 , B41M5/00 , B41M7/00 , B82Y30/00 , B82Y40/00 , C09D5/24 , C09D11/033 , C09D11/037 , C09D11/322 , C09D11/36 , C09D11/38 , H01B1/02 , H01B1/22 , H01B5/14 , H01B13/00 , H05K1/09 , H05K3/12 , B22F7/08 , B22F10/10 , B22F10/25 , B22F10/28 , B22F10/40 , B22F10/64
CPC classification number: C09D11/52 , B22F1/052 , B22F1/0545 , B22F1/102 , B41M5/0023 , B41M7/009 , B82Y40/00 , C09D5/24 , C09D11/033 , C09D11/037 , C09D11/322 , C09D11/36 , C09D11/38 , H01B1/026 , H01B1/22 , H01B5/14 , H01B13/0016 , H05K1/097 , H05K3/1283 , B22F7/08 , B22F10/10 , B22F10/25 , B22F10/28 , B22F10/40 , B22F10/64 , B22F2998/10 , B22F2999/00 , B82Y30/00 , H05K2201/0245 , H05K2201/0257 , H05K2201/0266 , H05K2201/0272 , B22F2999/00 , B22F1/054 , B22F1/0547 , B22F1/065 , B22F1/0551 , B22F2998/10 , B22F10/10 , B22F3/10 , B22F2999/00 , B22F1/065 , B22F1/054 , B22F1/0551 , B22F1/0547 , B22F2999/00 , B22F1/056 , B22F1/0547 , B22F1/065 , B22F1/0551 , B22F2999/00 , B22F1/065 , B22F1/056 , B22F1/0551 , B22F1/0547
Abstract: According to embodiments of the present invention, an ink composition is provided. The ink composition includes a plurality of nanostructures distributed in at least two cross-sectional dimension ranges, wherein each nanostructure of the plurality of nanostructures is free of a cross-sectional dimension of more than 200 nm. According to further embodiments of the present invention, a method for forming a conductive member and a conductive device are also provided.
-
3.
公开(公告)号:US11417441B2
公开(公告)日:2022-08-16
申请号:US16871315
申请日:2020-05-11
Applicant: Kuprion Inc.
Inventor: Byung Hoon Lee , Chee Lip Gan , Yeng Ming Lam , Alfred A. Zinn
Abstract: According to embodiments of the present invention, a method of interconnecting nanowires is provided. The method includes providing a plurality of nanowires, providing a plurality of nanoparticles, and fusing the plurality of nanoparticles to the plurality of nanowires to interconnect the plurality of nanowires to each other via the plurality of nanoparticles. According to further embodiments of the present invention, a nanowire network and a transparent conductive electrode are also provided.
-
公开(公告)号:US11274224B2
公开(公告)日:2022-03-15
申请号:US16337917
申请日:2017-09-27
Applicant: Kuprion Inc.
Inventor: Zhenggang Li , Yeng Ming Lam , Chee Lip Gan , Jaewon Kim , Alfred A. Zinn
IPC: C09D11/52 , C09D11/322 , C09D11/36 , H01B1/22 , H01B1/02 , H05K1/09 , B82Y40/00 , C09D5/24 , B22F1/00 , B41M5/00 , B41M7/00 , C09D11/033 , C09D11/037 , C09D11/38 , H01B5/14 , H01B13/00 , H05K3/12 , B82Y30/00 , B33Y70/00 , B22F7/08 , B22F10/10
Abstract: According to embodiments of the present invention, an ink composition is provided. The ink composition includes a plurality of nanostructures distributed in at least two cross-sectional dimension ranges, wherein each nanostructure of the plurality of nanostructures is free of a cross-sectional dimension of more than 200 nm. According to further embodiments of the present invention, a method for forming a conductive member and a conductive device are also provided.
-
-
-