System and method of broad band optical end point detection for film change indication
    1.
    发明申请
    System and method of broad band optical end point detection for film change indication 失效
    用于胶片变化指示的宽带光端点检测系统和方法

    公开(公告)号:US20030184732A1

    公开(公告)日:2003-10-02

    申请号:US10112425

    申请日:2002-03-29

    Applicant: LAM RESEARCH

    Abstract: A system and method for detecting an endpoint during a chemical mechanical polishing process is disclosed that includes illuminating a first portion of a surface of a wafer with a first broad beam of light. A first reflected spectrum data is received. The first reflected spectrum of data corresponds to a first spectra of light reflected from the first illuminated portion of the surface of the wafer. A second portion of the surface of the wafer with a second broad beam of light. A second reflected spectrum data is received. The second reflected spectrum of data corresponds to a second spectra of light reflected from the second illuminated portion of the surface of the wafer. The first reflected spectrum data is normalized and the second reflected spectrum data is normalized. An endpoint is determined based on a difference between the normalized first spectrum data and the normalized second spectrum data.

    Abstract translation: 公开了一种用于在化学机械抛光工艺期间检测端点的系统和方法,其包括用第一宽光束照射晶片表面的第一部分。 接收到第一反射光谱数据。 数据的第一反射光谱对应于从晶片表面的第一照射部分反射的光的第一光谱。 具有第二宽光束的晶片表面的第二部分。 接收第二反射光谱数据。 数据的第二反射光谱对应于从晶片的表面的第二照射部分反射的光的第二光谱。 将第一反射光谱数据归一化,并将第二反射光谱数据归一化。 基于归一化的第一光谱数据和归一化的第二光谱数据之间的差来确定端点。

    System and method of broad band optical end point detection for film change indication
    2.
    发明申请
    System and method of broad band optical end point detection for film change indication 有权
    用于胶片变化指示的宽带光端点检测系统和方法

    公开(公告)号:US20040165177A1

    公开(公告)日:2004-08-26

    申请号:US10721136

    申请日:2003-11-24

    Applicant: LAM RESEARCH

    Abstract: A system and method for detecting an endpoint is disclosed that includes illuminating a first portion of a surface of a wafer with a first broad beam of light. A first reflected spectrum data is received. The first reflected spectrum of data corresponds to a first spectra of light reflected from the first illuminated portion of the surface of the wafer. A second portion of the surface of the wafer with a second broad beam of light. A second reflected spectrum data is received. The second reflected spectrum of data corresponds to a second spectra of light reflected from the second illuminated portion of the surface of the wafer. The first reflected spectrum data is normalized and the second reflected spectrum data is normalized. An endpoint is determined based on a difference between the normalized first spectrum data and the normalized second spectrum data.

    Abstract translation: 公开了一种用于检测端点的系统和方法,其包括用第一宽光束照射晶片表面的第一部分。 接收到第一反射光谱数据。 数据的第一反射光谱对应于从晶片表面的第一照射部分反射的光的第一光谱。 具有第二宽光束的晶片表面的第二部分。 接收第二反射光谱数据。 数据的第二反射光谱对应于从晶片的表面的第二照射部分反射的光的第二光谱。 将第一反射光谱数据归一化,并将第二反射光谱数据归一化。 基于归一化的第一光谱数据和归一化的第二光谱数据之间的差来确定端点。

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