公开(公告)号：US09968970B2

公开(公告)日：2018-05-15

申请号：US14960210

申请日：2015-12-04

Applicant: LAM RESEARCH AG

Inventor： Andreas Gleissner ,  Peter Strutzmann

IPC: H01L21/687 ,  B08B3/04 ,  B08B9/00 ,  F26B21/00 ,  H01L21/67

CPC classification number: B08B3/04 ,  B08B9/00 ,  F26B21/00 ,  H01L21/67028 ,  H01L21/67051 ,  H01L21/6708 ,  H01L21/67115 ,  H01L21/68792

Abstract: In a method and apparatus for processing wafer-shaped articles, a spin chuck is positioned inside a process chamber. The spin chuck is configured to hold a wafer-shaped article at a predetermined process position. A cover covers the spin chuck and is affixed to or integral with the spin chuck for rotation therewith. The cover has a central opening. A stationary nozzle assembly extends into the process chamber such that a discharge end of the stationary nozzle assembly passes through the central opening of the cover. The nozzle assembly comprises a rinse nozzle configured to direct rinse liquid radially outwardly of the nozzle assembly onto a downwardly-facing surface of the cover.