公开(公告)号：US20200090956A1

公开(公告)日：2020-03-19

申请号：US16692948

申请日：2019-11-22

Applicant: Lam Research AG

Inventor： Rainer Obweger ,  Andreas Gleissner ,  Thomas Wirnsberger ,  Franz Kumnig ,  Alessandro Baldaro ,  Christian Fischer ,  Mu Hung Chou ,  Rafal Ryszard Dylewicz ,  Nathan Lavdovsky ,  Ivan L. Berry

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/311

Abstract: A device for processing wafer-shaped articles comprises a closed process chamber that provides a gas-tight enclosure. A rotary chuck is located within the closed process chamber. A heater is positioned relative to the chuck so as to heat a wafer shaped article held on the chuck from one side only and without contacting the wafer shaped article. The heater emits radiation having a maximum intensity in a wavelength range from 390 nm to 550 nm. At least one first liquid dispenser is positioned relative to the chuck so as to dispense a process liquid onto a side of a wafer shaped article that is opposite the side of the wafer-shaped article facing the heater.

公开(公告)号：US09657397B2

公开(公告)日：2017-05-23

申请号：US14144846

申请日：2013-12-31

Applicant: LAM RESEARCH AG

Inventor： Andreas Gleissner

IPC: C23F1/08 ,  H01J37/32 ,  H01L21/67 ,  H01L21/687

CPC classification number: C23F1/08 ,  H01J37/32467 ,  H01J37/32495 ,  H01J37/32715 ,  H01L21/67126 ,  H01L21/6719 ,  H01L21/68792

Abstract: An apparatus for processing wafer-shaped articles comprises a closed process chamber providing a gas-tight enclosure. A rotary chuck is located within the closed process chamber, the rotary chuck being adapted to hold a wafer shaped article thereon. A lid is secured to an upper part of the closed process chamber, the lid comprising an upper plate formed from a composite fiber-reinforced material and a lower plate that faces into the process chamber and is formed from a chemically-resistant plastic.

公开(公告)号：US09418883B2

公开(公告)日：2016-08-16

申请号：US13935068

申请日：2013-07-03

Applicant: LAM RESEARCH AG

Inventor： Andreas Gleissner ,  Thomas Wirnsberger

IPC: H01L21/687 ,  H01L21/67 ,  B08B3/04 ,  B08B11/02 ,  F16D27/09

CPC classification number: H01L21/68728 ,  B08B3/04 ,  B08B11/02 ,  F16D27/09 ,  H01L21/67023 ,  H01L21/67069 ,  H01L21/68721

Abstract: A device for holding a wafer-shaped article comprises an annular chuck base body having a plurality of movable contact elements for securing a wafer-shaped article to the annular chuck base body, and a gear mechanism driving the contact elements in unison between a first position and a second position. The annular chuck base body comprises a housing formed from a material that is resistant to attack by strong inorganic acids. The annular chuck base body also comprises a reinforcing ring fitted within the housing and formed from a material whose coefficient of linear thermal expansion is substantially less than that of the housing material.

Abstract translation: 一种用于保持晶片状物品的装置，包括环形卡盘基体，其具有用于将晶片状物品固定在环形卡盘基体上的多个活动接触元件，以及齿轮机构，在第一位置 和第二个位置。 环形卡盘基体包括由耐强的无机酸侵蚀的材料形成的壳体。 环形卡盘基体还包括装配在壳体内并由线性热膨胀系数基本上小于外壳材料的系数的材料形成的加强环。

公开(公告)号：US10167552B2

公开(公告)日：2019-01-01

申请号：US14615099

申请日：2015-02-05

Applicant: LAM RESEARCH AG

Inventor： Andreas Gleissner ,  Markus Junk ,  Bhaskar Bandarapu

IPC: C23C16/455 ,  C23C16/458 ,  H01L21/67

Abstract: An apparatus for processing wafer-shaped articles comprises a spin chuck for holding a wafer-shaped article in a predetermined orientation, and a rotating shower head for supplying process gas to a surface of a wafer-shaped article when held by the spin chuck. The rotating shower head comprises an outlet plate having plural openings formed in each of a central and a peripheral region thereof. A process gas feed is provided so as to supply process gas to a gas distribution chamber. The gas distribution chamber is in fluid communication with a plurality of openings formed in the shower head.

公开(公告)号：US09911630B2

公开(公告)日：2018-03-06

申请号：US14928802

申请日：2015-10-30

Applicant: LAM RESEARCH AG

Inventor： Andreas Gleissner ,  Bhaskar Bandarapu

IPC: H01L21/00 ,  H01L21/67 ,  H01L21/687

CPC classification number: H01L21/67023 ,  H01L21/67115 ,  H01L21/6719 ,  H01L21/68785 ,  H01L21/68792

Abstract: A device for processing wafer-shaped articles comprises a closed process chamber providing a gas-tight enclosure, and a rotary chuck located within the closed process chamber. The closed process chamber comprises an annular duct surrounding the rotary chuck and extending along a first direction radially outwardly of the rotary chuck and obliquely to a rotary axis of the rotary chuck, from an inlet end that communicates with the rotary chuck to an outlet end that communicates with an exhaust duct. The annular duct comprises a duct section extending between the inlet and outlet ends that is defined by an inner chamber wall spaced apart from an outer chamber wall. The extent of the duct section along the first direction is at least twice a spacing of the inner and outer chamber walls throughout the duct section, as measured in a direction perpendicular to the first direction.

公开(公告)号：US09597701B2

公开(公告)日：2017-03-21

申请号：US14145241

申请日：2013-12-31

Applicant: LAM RESEARCH AG

Inventor： Rainer Obweger ,  Andreas Gleissner ,  Philipp Engesser

IPC: B05B13/02 ,  H01L21/67 ,  H01L21/687 ,  C23C14/50 ,  C30B25/14 ,  C23C16/458 ,  C30B25/12

CPC classification number: B05B13/0228 ,  C23C14/505 ,  C23C16/4584 ,  C30B25/12 ,  C30B25/14 ,  H01L21/67103 ,  H01L21/6719 ,  H01L21/68785 ,  H01L21/68792

Abstract: An apparatus for processing wafer-shaped articles comprises a closed process chamber providing a gas-tight enclosure. A rotary chuck is located within the closed process chamber, and is adapted to hold a wafer shaped article thereon. A lid is secured to an upper part of the closed process chamber. The lid comprises an annular chamber, gas inlets communicating with the annular chamber and opening on a surface of the lid facing outwardly of the closed process chamber, and gas outlets communicating with the annular chamber and opening on a surface of the lid facing inwardly of the closed process chamber.

公开(公告)号：US11195730B2

公开(公告)日：2021-12-07

申请号：US16692948

申请日：2019-11-22

Applicant: Lam Research AG

Inventor： Rainer Obweger ,  Andreas Gleissner ,  Thomas Wirnsberger ,  Franz Kumnig ,  Alessandro Baldaro ,  Christian Thomas Fischer ,  Mu Hung Chou ,  Rafal Ryszard Dylewicz ,  Nathan Lavdovsky ,  Ivan L. Berry, III

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/311

Abstract: A device for processing wafer-shaped articles comprises a closed process chamber that provides a gas-tight enclosure. A rotary chuck is located within the closed process chamber. A heater is positioned relative to the chuck so as to heat a wafer shaped article held on the chuck from one side only and without contacting the wafer shaped article. The heater emits radiation having a maximum intensity in a wavelength range from 390 nm to 550 nm. At least one first liquid dispenser is positioned relative to the chuck so as to dispense a process liquid onto a side of a wafer shaped article that is opposite the side of the wafer-shaped article facing the heater.

公开(公告)号：US10056287B2

公开(公告)日：2018-08-21

申请号：US14871927

申请日：2015-09-30

Applicant: LAM RESEARCH AG

Inventor： Ulrich Tschinderle ,  Andreas Gleissner ,  Thomas Wirnsberger ,  Rainer Obweger

IPC: H01L21/67 ,  H01L21/687

CPC classification number: H01L21/68785 ,  H01L21/67023 ,  H01L21/67051 ,  H01L21/6708 ,  H01L21/6719 ,  Y10T279/3493

Abstract: A device for processing wafer-shaped articles comprises a closed process chamber. The closed process chamber comprises a housing providing a gas-tight enclosure, a rotary chuck located within the closed process chamber and adapted to hold a wafer shaped article thereon, and an interior cover disposed within said closed process chamber. The interior cover is movable between a first position in which the rotary chuck communicates with an outer wall of the closed process chamber, and a second position in which the interior cover seals against an inner surface of the closed process chamber adjacent the rotary chuck to define a gas-tight inner process chamber.

公开(公告)号：US09968970B2

公开(公告)日：2018-05-15

申请号：US14960210

申请日：2015-12-04

Applicant: LAM RESEARCH AG

Inventor： Andreas Gleissner ,  Peter Strutzmann

IPC: H01L21/687 ,  B08B3/04 ,  B08B9/00 ,  F26B21/00 ,  H01L21/67

CPC classification number: B08B3/04 ,  B08B9/00 ,  F26B21/00 ,  H01L21/67028 ,  H01L21/67051 ,  H01L21/6708 ,  H01L21/67115 ,  H01L21/68792

Abstract: In a method and apparatus for processing wafer-shaped articles, a spin chuck is positioned inside a process chamber. The spin chuck is configured to hold a wafer-shaped article at a predetermined process position. A cover covers the spin chuck and is affixed to or integral with the spin chuck for rotation therewith. The cover has a central opening. A stationary nozzle assembly extends into the process chamber such that a discharge end of the stationary nozzle assembly passes through the central opening of the cover. The nozzle assembly comprises a rinse nozzle configured to direct rinse liquid radially outwardly of the nozzle assembly onto a downwardly-facing surface of the cover.

公开(公告)号：US09887122B2

公开(公告)日：2018-02-06

申请号：US15148778

申请日：2016-05-06

Applicant: LAM RESEARCH AG

Inventor： Hongbo Si ,  Bhaskar Bandarapu ,  Andreas Gleissner ,  Bernhard Loidl

IPC: H01L21/687 ,  H01L21/67 ,  B05C13/00 ,  G03F7/16 ,  B05C9/14 ,  B05C5/02

CPC classification number: H01L21/68785 ,  B05C5/0208 ,  B05C9/14 ,  B05C13/00 ,  G03F7/162 ,  G03F7/168 ,  G03F7/42 ,  H01L21/67051 ,  H01L21/6708 ,  H01L21/67115 ,  H01L21/67178 ,  H01L21/68792 ,  Y10S134/902

Abstract: In an apparatus for treating a wafer-shaped article, a spin chuck is configured to hold a wafer-shaped article of a predetermined diameter. A non-rotating plate is positioned relative to the spin chuck such that the non-rotating plate is beneath and parallel to a wafer-shaped article when positioned on the spin chuck. A fluid dispensing nozzle passes through the non-rotating plate and terminates in a discharge end positioned above and adjacent to the non-rotating plate. The discharge end comprises a horizontal gas discharge nozzle configured to distribute gas radially outwardly across an upper surface of the non-rotating plate.