公开(公告)号：US11862473B2

公开(公告)日：2024-01-02

申请号：US17998489

申请日：2021-05-10

Applicant: Lam Research Corporation

Inventor： Stephen M. Sirard ,  Gregory Blachut ,  Diane Hymes

IPC: H01L21/311 ,  H01L21/302 ,  H01L21/306

CPC classification number: H01L21/31138 ,  H01L21/302 ,  H01L21/306 ,  H01L21/31127

Abstract: Removing a stimuli responsive polymer (SRP) from a substrate includes controlled degradation. In certain embodiments of the methods described herein, removing SRPs includes exposure to two reactants that react to form an acid or base that can trigger the degradation of the SRP. The exposure occurs sequentially to provide more precise top down control. In some embodiments, the methods involve diffusing a compound, or a reactant that reacts to form a compound, only to a top portion of the SRP. The top portion is then degraded and removed, leaving film the remaining SRP intact. The exposure and removal cycles are repeated.

公开(公告)号：US20230178364A1

公开(公告)日：2023-06-08

申请号：US18003894

申请日：2021-06-30

Applicant: Lam Research Corporation

Inventor： Gregory Blachut ,  Diane Hymes ,  Stephen M. Sirard

IPC: H01L21/02 ,  H01L21/311

CPC classification number: H01L21/02118 ,  H01L21/02271 ,  H01L21/31127

Abstract: A method includes performing a first substrate treatment on a substrate using a first dry process in a first substrate processing tool operating at vacuum; after the first substrate treatment, depositing a polymer film on an exposed surface of the substrate using a chemical vapor deposition (CVD) process in the first substrate processing tool; removing the substrate from the first substrate processing tool for a queue period; after the queue period, removing the polymer film from the substrate; and performing a second substrate treatment on the substrate using a second dry process in a second substrate processing tool.

公开(公告)号：US11065654B2

公开(公告)日：2021-07-20

申请号：US16017445

申请日：2018-06-25

Applicant: LAM RESEARCH CORPORATION

Inventor： Mark Kawaguchi ,  Gregory Blachut

IPC: H01L21/02 ,  B08B7/00 ,  H01L21/677 ,  H01L21/66

Abstract: A method for cleaning a substrate includes supplying a vapor to a processing chamber to grow a polymer film on a substrate in the processing chamber; adding a solution to the polymer film on the substrate to create a viscoelastic fluid on the substrate; and removing the viscoelastic fluid to remove particle contaminants from the substrate.