NANOIMPRINT LITHOGRAPHY MOLD, TILING SYSTEM, AND METHOD

    公开(公告)号:US20250085625A1

    公开(公告)日:2025-03-13

    申请号:US18720475

    申请日:2021-12-22

    Applicant: LEIA Inc.

    Abstract: A nanoimprint lithography mold, nanoimprint lithography tiling system, and method of dicing a nanoimprint lithography substrate employ a nanoimprint lithography mold having a precision edge and an undercut sidewall. The precision edge has nanoscale roughness and is adjacent to a top surface of the nanoimprint lithography mold at a predetermined distance from a feature of the nanoimprint lithography mold. The undercut sidewall extends from the precision edge to a bottom surface of the nanoimprint lithography mold. The undercut sidewall has a surface that is angled away from the precision edge and toward a center of the nanoimprint lithography mold. The precision edge and the undercut sidewall define a side of the nanoimprint lithography mold that can be abutted with corresponding sides of one or more other nanoimprint lithography molds.

    WAFER TILING METHOD TO FORM LARGE-AREA MOLD MASTER HAVING SUB-MICROMETER FEATURES

    公开(公告)号:US20210086407A1

    公开(公告)日:2021-03-25

    申请号:US17112941

    申请日:2020-12-04

    Applicant: LEIA INC.

    Abstract: A method of forming a large-area nanoimprint mold master is provided. The method includes positioning a plurality of sub-master tiles on a rigid planar substrate. Each sub-master tile of the sub-master tile plurality has a nanoscale pattern and represents a subsection of the large-area nanoimprint mold master. The method further includes adhering the plurality of sub-master tiles to the rigid planar substrate. The positioning determines a distance between a nanoscale feature of the nanoscale pattern on each sub-master tile of a pair of adjacent sub-master tiles. The distance has microscale positioning tolerance. Also provided are a large-area nanoimprint mold master and a method of large-area nanoimprint lithography.

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