公开(公告)号：US20130215610A1

公开(公告)日：2013-08-22

申请号：US13688983

申请日：2012-11-29

Applicant: LEXTAR ELECTRONICS CORPORATION

Inventor： Ming-Hua TSAI ,  Chen-I LU

IPC: F21V21/00

CPC classification number: F21V21/00 ,  F21K9/00 ,  F21V23/06 ,  F21V31/00 ,  F21Y2103/10 ,  F21Y2113/00 ,  F21Y2115/10 ,  H05K1/117 ,  H05K1/142 ,  H05K3/3405 ,  H05K2201/09709 ,  H05K2201/10106 ,  H05K2201/10287 ,  H05K2201/10363 ,  Y10S362/80

Abstract: A first substrate of a light bar assembly includes a first edge and a second edge parallel to each other along a first direction. A first connecting end includes a first connecting portion protruding further outward than a second connecting portion. A first bonding pad and a second bonding pad are disposed on the first substrate. First solid-state semiconductor light sources are disposed along the first edge and the second edge. A second substrate, disposed corresponding to the first substrate, includes a third edge, a fourth edge, a second connecting portion, a third bonding pad, a fourth bonding pad, and second solid-state semiconductor light sources. A first connecting device is electrically connected to the first bonding pad and the fourth bonding pad; a second connecting device is electrically connected to the second bonding pad and the third bonding pad to fix the first substrate and the second substrate.

Abstract translation: 光棒组件的第一基板包括沿着第一方向彼此平行的第一边缘和第二边缘。 第一连接端包括比第二连接部更向外突出的第一连接部。 第一接合焊盘和第二接合焊盘设置在第一基板上。 第一固态半导体光源沿着第一边缘和第二边缘设置。 对应于第一基板设置的第二基板包括第三边缘，第四边缘，第二连接部分，第三焊盘，第四焊盘和第二固态半导体光源。 第一连接装置电连接到第一焊盘和第四接合焊盘; 第二连接装置电连接到第二接合焊盘和第三接合焊盘以固定第一基板和第二基板。