公开(公告)号：US09166128B2

公开(公告)日：2015-10-20

申请号：US14251534

申请日：2014-04-11

Applicant: LEXTAR ELECTRONICS CORPORATION

Inventor： Yei-How Ho

IPC: H01L21/00 ,  H01L33/58 ,  F21V5/04 ,  H01L33/60 ,  H01L33/00

CPC classification number: F21V7/22 ,  F21V5/04 ,  F21V7/041 ,  F21V7/045 ,  F21Y2115/10 ,  H01L33/0095 ,  H01L33/58 ,  H01L33/60 ,  H05K1/0274 ,  H05K2201/09909 ,  H05K2201/10106 ,  H05K2201/2054

Abstract: A light-emitting assembly and a method for manufacturing the same are provided. The light-emitting assembly includes a circuit board with a light-emitting element and a plurality of optical microstructures disposed thereon. The optical microstructures adjacent to the light-emitting element absorb or guide a portion of light emitted from the light-emitting element.

Abstract translation: 提供发光组件及其制造方法。 发光组件包括具有发光元件的电路板和设置在其上的多个光学微结构。 与发光元件相邻的光学微结构吸收或引导从发光元件发射的光的一部分。

公开(公告)号：US20150060914A1

公开(公告)日：2015-03-05

申请号：US14251534

申请日：2014-04-11

Applicant: LEXTAR ELECTRONICS CORPORATION

Inventor： Yei-How Ho

IPC: H01L33/58 ,  H01L33/60 ,  H01L33/00

CPC classification number: F21V7/22 ,  F21V5/04 ,  F21V7/041 ,  F21V7/045 ,  F21Y2115/10 ,  H01L33/0095 ,  H01L33/58 ,  H01L33/60 ,  H05K1/0274 ,  H05K2201/09909 ,  H05K2201/10106 ,  H05K2201/2054

Abstract: A light-emitting assembly and a method for manufacturing the same are provided. The light-emitting assembly includes a circuit board with a light-emitting element and a plurality of optical microstructures disposed thereon. The optical microstructures adjacent to the light-emitting element absorb or guide a portion of light emitted from the light-emitting element.

Abstract translation: 提供发光组件及其制造方法。 发光组件包括具有发光元件的电路板和设置在其上的多个光学微结构。 与发光元件相邻的光学微结构吸收或引导从发光元件发射的光的一部分。