公开(公告)号：US20180180925A1

公开(公告)日：2018-06-28

申请号：US15842585

申请日：2017-12-14

Applicant: LG DISPLAY CO., LTD.

Inventor： YounSeok AHN ,  SungHyun BAE

IPC: G02F1/1345 ,  G02F1/1333 ,  G02F1/1343 ,  G02F1/1335 ,  G02F1/133 ,  C09J9/02

CPC classification number: G02F1/13458 ,  C08K2003/085 ,  C08K2003/0862 ,  C08K2201/001 ,  C09J7/21 ,  C09J9/02 ,  C09J2201/128 ,  C09J2203/318 ,  C09J2205/102 ,  C09J2400/263 ,  C09J2433/00 ,  G02F1/13306 ,  G02F1/133305 ,  G02F1/133526 ,  G02F1/134309 ,  G02F2202/28

Abstract: An electronic device according to an example embodiment of the present disclosure includes a first substrate, a conductive layer formed on the first substrate, a first pad electrode that is electrically connected to and extends from the conductive layer, a second substrate electrically connected to the first pad electrode, and an adhesive member disposed between the first pad electrode and the second substrate. The adhesive member includes a conductive fiber sheet. The electronic device according to various embodiments of the present disclosure uses an adhesive member which includes a plurality of conductive fiber sheets and an adhesive layer having an adhesive and conductive particles. Therefore, it is possible to easily attach electronic parts at a low temperature and a low pressure and minimize damages of the pad electrode and the substrate of the electronic parts which may be caused during the adhering process.