公开(公告)号：US20220061195A1

公开(公告)日：2022-02-24

申请号：US17402182

申请日：2021-08-13

Applicant: LG Display Co., Ltd.

Inventor： Buhui Lee ,  Sangsoo Yoon ,  Dongwon Jang ,  Jongseok Cha

IPC: H05K7/20 ,  H05K1/02 ,  H05K1/18

Abstract: A display apparatus capable of improving heat-dissipation performance while not increasing a total thickness thereof include a heat-dissipation member accommodated in a cushion plate. Thus, the heat-dissipation performance may be improved without increasing a thickness of the display apparatus. Thus, a mounting space for components may be secured without increasing a bezel area. Further, the heat-dissipation member having a predetermined thickness and an air gap are disposed in the heat-dissipation member accommodating space of the cushion plate, thereby maximizing the heat-dissipation from a driving integrated circuit disposed under the cushion plate so as to overlap the heat-dissipation member accommodating space.

公开(公告)号：US11856741B2

公开(公告)日：2023-12-26

申请号：US17402182

申请日：2021-08-13

Applicant: LG Display Co., Ltd.

Inventor： Buhui Lee ,  Sangsoo Yoon ,  Dongwon Jang ,  Jongseok Cha

IPC: H05K7/20 ,  H05K1/18 ,  H05K1/02

CPC classification number: H05K7/20963 ,  H05K1/028 ,  H05K1/189 ,  H05K2201/10128

Abstract: A display apparatus capable of improving heat-dissipation performance while not increasing a total thickness thereof include a heat-dissipation member accommodated in a cushion plate. Thus, the heat-dissipation performance may be improved without increasing a thickness of the display apparatus. Thus, a mounting space for components may be secured without increasing a bezel area. Further, the heat-dissipation member having a predetermined thickness and an air gap are disposed in the heat-dissipation member accommodating space of the cushion plate, thereby maximizing the heat-dissipation from a driving integrated circuit disposed under the cushion plate so as to overlap the heat-dissipation member accommodating space.