公开(公告)号：US20180146578A1

公开(公告)日：2018-05-24

申请号：US15697274

申请日：2017-09-06

Applicant: LG Display Co., Ltd.

Inventor： SeongRim LEE

IPC: H05K7/20 ,  H05K7/14 ,  H05K13/04

CPC classification number: H05K7/20954 ,  G02F1/133305 ,  G02F1/13452 ,  G02F2201/42 ,  G02F2201/56 ,  G09G3/20 ,  G09G2310/0281 ,  H01L23/4985 ,  H05K7/14 ,  H05K13/04

Abstract: The present aspects provide a display apparatus including a chip-on-film (COF), which may include: a plastic substrate configured to have at least one through-hole formed in one area thereof and a conductor inserted into the through-hole; a display part configured to be disposed in another area on an upper surface of the plastic substrate; a first pad part configured to have a plurality of pads, at least one of which is disposed in the one area on the upper surface of the plastic substrate to overlap the through-hole, and configured to be connected to one end of the conductor; and a second pad part configured to be disposed on a back surface of the plastic substrate, and configured to have a plurality of pads, at least one of which is in contact with the other end of the conductor, and further provide a method for manufacturing the same.

公开(公告)号：US20190150329A1

公开(公告)日：2019-05-16

申请号：US16250107

申请日：2019-01-17

Applicant: LG DISPLAY CO., LTD.

Inventor： SeongRim LEE

IPC: H05K7/20 ,  H05K13/04 ,  G02F1/1333 ,  H01L23/498 ,  G02F1/1345 ,  H05K7/14

CPC classification number: H05K7/20954 ,  G02F1/133305 ,  G02F1/13452 ,  G02F2201/42 ,  G02F2201/56 ,  G09G3/20 ,  G09G2310/0281 ,  H01L23/49827 ,  H01L23/4985 ,  H05K7/14 ,  H05K13/04

Abstract: The present aspects provide a display apparatus including a chip-on-film (COF), which may include: a plastic substrate configured to have at least one through-hole formed in one area thereof and a conductor inserted into the through-hole; a display part configured to be disposed in another area on an upper surface of the plastic substrate; a first pad part configured to have a plurality of pads, at least one of which is disposed in the one area on the upper surface of the plastic substrate to overlap the through-hole, and configured to be connected to one end of the conductor; and a second pad part configured to be disposed on a back surface of the plastic substrate, and configured to have a plurality of pads, at least one of which is in contact with the other end of the conductor, and further provide a method for manufacturing the same.