公开(公告)号：US20030168255A1

公开(公告)日：2003-09-11

申请号：US10384658

申请日：2003-03-11

Applicant: LG ELECTRONICS INC.

Inventor： Dock-Heung Kim ,  Yong-Il Kim

IPC: H05K001/11 ,  H01R012/04

CPC classification number: H05K3/4652 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H05K1/112 ,  H05K3/0097 ,  H05K3/4623 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/4913

Abstract: A multi-layer printed circuit board on which insulation resin layers and circuit pattern layers are alternatively stacked to form multiple layers, including: an insulation resin layer; a circuit pattern formed at the upper surface of the insulation resin layer; a blind via hole formed penetrating the insulation resin layer and the circuit pattern; a plated layer formed at the upper surface of the circuit pattern, at the inner wall face and the bottom of the blind via hole; an inner lead bump pad formed at the surface of the plated layer which is exposed to the lower surface of the insulation resin layer; and an outer lead bump pad formed on the circuit pattern which is formed at the upper surface of the insulation resin layer, whereby the problem of defective attachment of a bump due to a void present in a blind via hole is eliminated.