公开(公告)号：US20040154162A1

公开(公告)日：2004-08-12

申请号：US10769885

申请日：2004-02-03

Applicant: LG Electronics Inc.

Inventor： Sung-Gue Lee ,  Jung-Ho Hwang ,  Joon-Wook Han ,  Sang-Min Lee ,  Tae-Sik Eo ,  Yu-Seock Yang

IPC: H05K003/36 ,  H05K003/20

CPC classification number: H05K3/423 ,  H05K3/0023 ,  H05K3/4647 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2203/0346 ,  H05K2203/0577 ,  H05K2203/0733 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49135 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: A method for fabricating a multi-layer printed circuit board can include forming an etching resist layer on a first metal layer having plating grooves that selectively expose the first metal layer, forming a plated layer at the surface of the first metal layer exposed by the plating groove through a plating process to form connection protrusion, removing the etching resist layer, forming an insulation layer at the first metal layer and positioning a second metal layer at the surface of the insulation layer coupled to an end portion of the connection protrusion. By forming the connection protrusion through the plating process, a loss of material can be reduced and a strength of the connection protrusion can be increased. Further, a complexity of the fabrication process is reduced to reduce costs and increase productivity.

Abstract translation: 制造多层印刷电路板的方法可以包括在具有选择性地暴露第一金属层的镀槽的第一金属层上形成抗蚀剂层，在由电镀暴露的第一金属层的表面形成镀层 通过电镀工艺形成连接突起，去除抗蚀剂层，在第一金属层处形成绝缘层，并将第二金属层定位在连接到连接突起的端部的绝缘层的表面处。 通过通过电镀工艺形成连接突起，可以减少材料的损失，并且可以提高连接突起的强度。 此外，减少制造过程的复杂性以降低成本并提高生产率。