公开(公告)号：US20130229778A1

公开(公告)日：2013-09-05

申请号：US13774655

申请日：2013-02-22

Applicant: LG INNOTEK CO., LTD.

Inventor： Chung Sang RYOU

IPC: H05K1/02 ,  H05K3/00

CPC classification number: H05K1/0266 ,  H05K1/02 ,  H05K1/0269 ,  H05K3/0008 ,  H05K3/0052 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/09918 ,  Y10T29/49117

Abstract: A PCB according to an exemplary embodiment of the present disclosure includes a plurality of unit PCBs arrayed on the PCB, and a sawing line formed among the plurality of unit PCBs.

Abstract translation: 根据本公开的示例性实施例的PCB包括排列在PCB上的多个单元PCB以及在多个单元PCB之间形成的锯线。