公开(公告)号：US20140048316A1

公开(公告)日：2014-02-20

申请号：US13968812

申请日：2013-08-16

Applicant: LG INNOTEK CO., LTD.

Inventor： Sung Jin YUN ,  Hyuk Soo LEE ,  In Hee CHO ,  Jae Man PARK ,  Myeong Jeong KIM ,  Jong Heum YOON ,  Jeung Ook PARK ,  Jong Sik LEE ,  Gun Young GIL ,  Thanh Kieu GIANG ,  Jin Hwan KIM

IPC: H05K1/03 ,  H05K1/02

CPC classification number: H05K1/0373 ,  C08G59/28 ,  C08G59/30 ,  C08K3/013 ,  C08L63/00 ,  H05K1/0203 ,  H05K1/056 ,  H05K2201/0209 ,  C08K3/0033

Abstract: There is provided an epoxy resin compound including an epoxy resin including a crystalline epoxy, a curing agent, and an inorganic filler. Also, there is provided a radiant heat circuit board including a metal plate, an insulating layer formed on the metal plate; and a circuit pattern formed on the insulating layer, in which the insulting layer is formed by curing an epoxy resin compound including an epoxy resin including a crystalline epoxy, a curing agent, and an inorganic filler.

Abstract translation: 提供了包含环氧树脂的环氧树脂化合物，该环氧树脂包括结晶环氧树脂，固化剂和无机填料。 另外，提供了一种辐射热电路板，其包括金属板，形成在金属板上的绝缘层; 以及形成在绝缘层上的电路图案，其中通过固化包括结晶环氧树脂，固化剂和无机填料的环氧树脂的环氧树脂化合物来形成绝缘层。

公开(公告)号：US20130284502A1

公开(公告)日：2013-10-31

申请号：US13872682

申请日：2013-04-29

Applicant: LG INNOTEK CO., LTD.

Inventor： Jae Man PARK ,  Hae Yeon KIM ,  SungBae MOON ,  Jeungook PARK ,  SungJin YUN ,  JongHeum YOON ,  Hyuk Soo LEE ,  Jaehun JEONG ,  In Hee CHO

IPC: C08L63/00 ,  H05K1/05 ,  C07D303/46

CPC classification number: C08L63/00 ,  C07D303/46 ,  C08G59/28 ,  H05K1/05

Abstract: An epoxy resin compound including an epoxy resin, a hardening agent, and an inorganic filler as a main component is provided. The epoxy resin includes an epoxy resin represented by a chemical formula. Therefore, the epoxy resin having a mesogen structure that increases crystallinity is used, and thus thermal conductivity can be increased. Further, the epoxy resin is used as an insulating material for a printed circuit board, and thus a high radiant heat substrate can be provided.

Abstract translation: 提供包含环氧树脂，硬化剂和无机填料作为主要成分的环氧树脂化合物。 环氧树脂包括由化学式表示的环氧树脂。 因此，使用具有提高结晶性的介晶结构的环氧树脂，因此可以提高导热性。 此外，环氧树脂用作印刷电路板的绝缘材料，因此可以提供高辐射热衬底。

公开(公告)号：US20180082797A1

公开(公告)日：2018-03-22

申请号：US15560964

申请日：2016-03-24

Applicant: LG INNOTEK CO., LTD.

Inventor： Seung Kwon HONG ,  Hyuk Soo LEE ,  In Hee CHO ,  Hyun Gyu PARK

IPC: H01G11/42 ,  H01G11/24 ,  H01G11/86

CPC classification number: H01G11/42 ,  H01G11/24 ,  H01G11/32 ,  H01G11/86 ,  Y02E60/13

Abstract: An electrode material according to one exemplary embodiment of the present invention includes a silicon carbide powder including mesopores having a diameter of 2 to 50 nm and micropores having a diameter of 2 nm or less.

公开(公告)号：US20140153221A1

公开(公告)日：2014-06-05

申请号：US14091755

申请日：2013-11-27

Applicant: LG INNOTEK CO., LTD.

Inventor： Seung Kwon HONG ,  Hyun Gyu PARK ,  In Hee CHO ,  Hyuk Soo LEE

IPC: F21V19/00

CPC classification number: F21V19/003 ,  G02F2001/133612 ,  H05K1/0278 ,  H05K1/028 ,  H05K3/0061 ,  H05K2201/0394 ,  H05K2201/09063 ,  H05K2201/10106 ,  H05K2203/302

Abstract: Provided is a printed circuit board including: a support substrate including a first area in which a light emitting device is mounted, and a second area extending from the first area; a bending part which is configured such that a part between the first area and the second area is bent; a through hole passing through the bending part; a connection wiring connected to the light emitting device and disposed on the bending part; and a wiring connected to the connection wiring.

Abstract translation: 提供一种印刷电路板，包括：支撑基板，包括其中安装有发光装置的第一区域和从所述第一区域延伸的第二区域; 弯曲部，其构造成使得所述第一区域和所述第二区域之间的部分弯曲; 穿过弯曲部的通孔; 连接到所述发光装置并且设置在所述弯曲部上的连接配线; 以及连接到连接布线的布线。

公开(公告)号：US20140198530A1

公开(公告)日：2014-07-17

申请号：US14156117

申请日：2014-01-15

Applicant: LG INNOTEK CO., LTD.

Inventor： Seung Kwon HONG ,  Hyun Gyu PARK ,  In Hee CHO ,  Nam Yang LEE ,  Hyuk Soo LEE

IPC: F21V8/00

CPC classification number: G02B6/0091 ,  G02B6/0073 ,  G02B6/0083 ,  H05K1/0284 ,  H05K1/056 ,  H05K2201/09063 ,  H05K2201/10106 ,  H05K2201/2036

Abstract: Provided are a circuit board for irradiating light to a light guide plate and a flat panel display having a structure for efficiently fixing the circuit board and the light guide plate, the circuit board, including: a support substrate comprising a first area and a second area, the second area being bent from the first area; a plurality of light emitting device mounting parts disposed in the first area; and a protective member connecting part of an outer side of the plurality of light emitting device mounting parts.

Abstract translation: 提供一种用于向导光板照射光的电路板和具有用于有效地固定电路板和导光板，电路板的结构的平板显示器，包括：支撑基板，包括第一区域和第二区域 第二区域从第一区域弯曲; 设置在所述第一区域中的多个发光装置安装部; 以及连接多个发光装置安装部的外侧的一部分的保护构件。