公开(公告)号：US20220418107A1

公开(公告)日：2022-12-29

申请号：US17756541

申请日：2020-11-26

Applicant: LG INNOTEK CO., LTD.

Inventor： Kyo Hun KOO ,  Jin Hak LEE ,  In Ho JEONG

IPC: H05K1/11

Abstract: A printed circuit board according to an embodiment includes: an insulating layer including a via hole; and a via disposed in the via hole of the insulating layer, wherein the via includes; a connection portion disposed in the via hole of the insulating layer; a first pad disposed on an upper surface of the insulating layer and an upper surface of the connection portion; and a second pad disposed under a lower surface of the insulating layer and a lower surface of the connection portion, wherein the upper surface of the connection portion has a concave shape in a downward direction, the lower surface of the connection portion has a concave shape in an upward direction, a lower surface of the first pad has a convex shape corresponding to the upper surface of the connection portion, and an upper surface of the second pad has a convex shape corresponding to the lower surface of the connection portion.

公开(公告)号：US20240422908A1

公开(公告)日：2024-12-19

申请号：US18821067

申请日：2024-08-30

Applicant: LG INNOTEK CO., LTD.

Inventor： Kyo Hun KOO ,  Jin Hak LEE ,  In Ho JEONG

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/42

Abstract: A circuit board according to an embodiment includes: an insulating layer including a through hole and a via disposed in the through hole and wherein the via including a first metal layer on an upper surface of the insulating layer and an inner wall of the through hole; and a second metal layer disposed in the through hole, and the an upper surface of the second metal layer includes a protruding portion that does not overlap an upper surface of the insulating layer in a vertical direction and is located higher than the first metal layer.