公开(公告)号：US20150296625A1

公开(公告)日：2015-10-15

申请号：US14438666

申请日：2013-05-09

Applicant: LG INNOTEK CO., LTD.

Inventor： Won Suk JUNG ,  Kyu Won LEE ,  Yun Ho AN ,  Woo Young LEE

IPC: H05K1/18 ,  H05K1/03 ,  H05K1/11 ,  H05K1/02

CPC classification number: H05K1/186 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/3135 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/2402 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/82039 ,  H01L2224/83005 ,  H01L2224/8314 ,  H01L2224/83191 ,  H01L2224/92144 ,  H01L2224/97 ,  H01L2924/15787 ,  H01L2924/15788 ,  H05K1/0298 ,  H05K1/0366 ,  H05K1/115 ,  H05K1/185 ,  H05K3/305 ,  H05K3/4602 ,  H05K2201/0195 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10984 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2224/82

Abstract: Provided is a printed circuit board including: an insulating layer; electronic devices embedded, in the insulating layer; and an adhesive layer for fixing the electronic devices.

Abstract translation: 提供一种印刷电路板，包括：绝缘层; 电子器件嵌入绝缘层; 以及用于固定电子设备的粘合剂层。