公开(公告)号：US09532452B2

公开(公告)日：2016-12-27

申请号：US14607199

申请日：2015-01-28

Applicant: LG INNOTEK CO., LTD.

Inventor： Jeong Won Park ,  Hee Beom An ,  Kyu Dong Kang ,  Gyu Ho Park ,  Su Jin Park ,  Sang Hoon Yoon

IPC: H05K1/11 ,  H05K1/03

CPC classification number: H05K1/115 ,  H05K1/0366 ,  H05K2201/09863

Abstract: A printed circuit board includes a substrate; and a hole passing through first and second surfaces of the substrate. The hole includes an area in which a width of the hole formed in an inner side of the substrate is formed larger than that of an opening formed on the first surface and/or the second surface.

Abstract translation: 印刷电路板包括基板; 以及穿过基板的第一和第二表面的孔。 孔包括形成在基板的内侧的孔的宽度形成为大于形成在第一表面和/或第二表面上的开口的宽度的区域。

公开(公告)号：US20150216052A1

公开(公告)日：2015-07-30

申请号：US14607199

申请日：2015-01-28

Applicant: LG INNOTEK CO., LTD.

Inventor： Jeong Won PARK ,  Hee Beom An ,  Kyu Dong Kang ,  Gyu Ho Park ,  Su Jin Park ,  Sang Hoon Yoon

IPC: H05K1/11

CPC classification number: H05K1/115 ,  H05K1/0366 ,  H05K2201/09863

Abstract: A printed circuit board includes a substrate; and a hole passing through first and second surfaces of the substrate. The hole includes an area in which a width of the hole formed in an inner side of the substrate is formed larger than that of an opening formed on the first surface and/or the second surface.

Abstract translation: 印刷电路板包括基板; 以及穿过基板的第一和第二表面的孔。 孔包括形成在基板的内侧的孔的宽度形成为大于形成在第一表面和/或第二表面上的开口的宽度的区域。