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    Capacitive micromachined ultrasonic transducer (CMUT) forming
    2.
    发明授权
    Capacitive micromachined ultrasonic transducer (CMUT) forming 有权

    公开(公告)号：US09937528B2

    公开(公告)日：2018-04-10

    申请号：US15095264

    申请日：2016-04-11

    Applicant: Texas Instruments Incorporated

    Inventor： Peter B. Johnson ,  Ira Oaktree Wygant

    IPC: H01B13/00 ,  B06B1/02 ,  H02N1/00 ,  H04R19/00 ,  B81C1/00 ,  B81B7/00

    CPC classification number: B06B1/0292 ,  B06B2201/76 ,  B81B7/007 ,  B81B2203/0127 ,  B81B2207/096 ,  B81C1/00301 ,  B81C2201/013 ,  B81C2203/036 ,  H02N1/006 ,  H04R19/005 ,  H05K2201/09845 ,  H05K2201/09863

    Abstract: A Capacitive Micromachined Ultrasonic Transducer (CMUT) device including at least one CMUT element with at least one CMUT cell is formed. A patterned dielectric layer thereon including a thick and a thin dielectric region is formed on a top side of a single crystal material substrate. A second substrate is bonded to the thick dielectric region to provide at least one sealed micro-electro-mechanical system (MEMS) cavity. The second substrate is thinned to reduce a thickness of said second substrate to provide a membrane layer. The membrane layer is etched to form a movable membrane over said MEMS cavity and to remove said membrane layer over said top side substrate contact area. The thin dielectric region is removed from over said top side substrate contact area. A top side metal layer is formed including a trace portion coupling said top side substrate contact area to said movable membrane. From a bottom side surface of said first substrate, etching is performed to open an isolation trench around said single crystal material to form a through-substrate via (TSV) plug of said single crystal material at least under said top side substrate contact area which is electrically isolated from surrounding regions of said single crystal material.

    WIRING BOARD AND MOUNTING STRUCTURE USING SAME
    3.
    发明申请
    WIRING BOARD AND MOUNTING STRUCTURE USING SAME 有权
    接线板和安装结构

    公开(公告)号：US20160150642A1

    公开(公告)日：2016-05-26

    申请号：US14779232

    申请日：2014-03-26

    Applicant: KYOCERA CORPORATION

    Inventor： Satoshi KAJITA ,  Mitsuhiro HAGIHARA ,  Yuuhei MATSUMOTO

    IPC: H05K1/03 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K1/09

    CPC classification number: H05K1/0306 ,  H05K1/0298 ,  H05K1/036 ,  H05K1/09 ,  H05K1/115 ,  H05K1/181 ,  H05K3/0038 ,  H05K3/421 ,  H05K3/4602 ,  H05K3/4655 ,  H05K2201/0116 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0266 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2201/09863 ,  H05K2201/2072

    Abstract: A wiring board includes: an inorganic insulating layer having a via hole formed so as to penetrate the inorganic insulating layer in a thickness direction thereof; a conductive layer disposed on the inorganic insulating layer; and a via conductor which adheres to an inner wall of the via hole and is connected with the conductive layer. The inorganic insulating layer includes a first section including a plurality of inorganic insulating particles partly connected to each other, and a resin portion located in gaps between the inorganic insulating particles, and a second section which is interposed between the first section and the via conductor, including a plurality of inorganic insulating particles partly connected to each other, and a conducting portion composed of part of the via conductor which is located in gaps between the inorganic insulating particles.

    Abstract translation: 布线板包括：无机绝缘层，其具有形成为在其厚度方向上穿透无机绝缘层的通孔; 设置在无机绝缘层上的导电层; 以及通孔导体，其粘附到通孔的内壁并与导电层连接。 无机绝缘层包括：第一部分，其包括彼此部分连接的多个无机绝缘颗粒，以及位于无机绝缘颗粒之间的间隙中的树脂部分和介于第一部分和通孔导体之间的第二部分， 包括彼此部分连接的多个无机绝缘颗粒和由位于无机绝缘颗粒之间的间隙中的通孔导体的一部分组成的导电部分。

    PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
    4.
    发明申请
    PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD 有权
    印刷线路板和制造印刷线路板的方法

    公开(公告)号：US20140216794A1

    公开(公告)日：2014-08-07

    申请号：US14169314

    申请日：2014-01-31

    Applicant: IBIDEN CO., LTD.

    Inventor： Toshiaki HIBINO

    IPC: H05K1/11 ,  H05K3/42

    CPC classification number: H05K3/429 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/0032 ,  H05K3/0055 ,  H05K3/108 ,  H05K3/4602 ,  H05K2201/0209 ,  H05K2201/09536 ,  H05K2201/09827 ,  H05K2201/09836 ,  H05K2201/09854 ,  H05K2201/09863 ,  H05K2201/2072 ,  H05K2203/108 ,  H05K2203/1476

    Abstract: A printed wiring board includes an insulating substrate having a penetrating hole formed through the substrate, a first conductive pattern formed on first surface of the substrate, a second conductive pattern formed on second surface of the substrate on the opposite side of the first surface, and a through-hole conductor formed in the penetrating hole in the substrate such that the conductor is connecting the first conductive pattern on the first surface of the substrate and the second conductive pattern on the second surface of the substrate. The penetrating hole has a first opening portion opening on the first surface of the substrate, a second opening portion opening on the second surface of the substrate and a third opening portion connecting the first and second opening portions, and the third opening portion has the maximum diameter which is greater than the minimum diameters of the first and second opening portions.

    Abstract translation: 印刷布线板包括：绝缘基板，具有穿过该基板形成的贯通孔，形成在基板的第一面上的第一导体图案，形成在基板的与第一面相反一侧的第二面上的第二导电图案;以及 形成在所述基板的所述贯通孔中的通孔导体，使得所述导体将所述基板的第一表面上的所述第一导电图案与所述基板的所述第二表面上的所述第二导电图案连接。 所述贯通孔具有在所述基板的第一面上开口的第一开口部，在所述基板的第二面上开口的第二开口部，以及连接所述第一开口部和所述第二开口部的第三开口部， 其直径大于第一和第二开口部分的最小直径。

    Multilayer wiring board, base for multilayer wiring board, printed wiring board and its manufacturing method
    6.
    发明授权
    Multilayer wiring board, base for multilayer wiring board, printed wiring board and its manufacturing method 失效
    多层布线板，多层布线基板，印刷线路板及其制造方法

    公开(公告)号：US07312400B2

    公开(公告)日：2007-12-25

    申请号：US10505094

    申请日：2003-02-21

    Applicant: Shoji Ito ,  Osamu Nakao ,  Reiji Higuchi ,  Masahiro Okamoto

    Inventor： Shoji Ito ,  Osamu Nakao ,  Reiji Higuchi ,  Masahiro Okamoto

    IPC: H05K1/00

    CPC classification number: H05K3/4617 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0394 ,  H05K2201/0969 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2203/0191 ,  H05K2203/1453 ,  Y10T29/49165 ,  Y10T428/12181 ,  Y10T428/24917

    Abstract: A multilayer wiring board assembly component comprises: an insulating substrate component (the insulating resin layer 111); a conductive layer 112 formed on one surface of said insulating substrate component 111 in the form of an electrode pattern; an adhesive layer 113 formed on the other surface of said insulating substrate component 111; and a conductive resin composition 115 with which is filled a through hole passing through said insulating substrate component 111, said adhesive layer and said conductive layer in order to make interlayer interconnection. The bore diameter of the conductive layer portion 114b of the through hole 114 is smaller than the bore diameter of the insulating resin layer portion and the adhesive layer portion 114a to establish electrical connection between the conductive resin composition 115 and the conductive layer 112 by the rare surface 112a of the conductive layer 112.

    Abstract translation: 多层布线基板组件包括：绝缘基板部件（绝缘树脂层111）。 以电极图案的形式形成在所述绝缘基板部件111的一个表面上的导电层112; 形成在所述绝缘基板部件111的另一个表面上的粘合层113; 以及导电树脂组合物115，其填充有穿过所述绝缘基板部件111，所述粘合剂层和所述导电层的通孔，以形成层间互连。 通孔114的导电层部分114b的孔径小于绝缘树脂层部分和粘合剂层部分114a的孔径，以通过以下方式建立导电树脂组合物115和导电层112之间的电连接： 导电层112的稀有表面112a。

    Conductive circuit structure having an electrically conductive surface fixed by collar walls
    10.
    发明授权
    Conductive circuit structure having an electrically conductive surface fixed by collar walls 失效
    导电电路结构，其具有由套环壁固定的导电表面

    公开(公告)号：US06490169B1

    公开(公告)日：2002-12-03

    申请号：US09717402

    申请日：2000-11-22

    Applicant: Hiroshi Watanabe

    Inventor： Hiroshi Watanabe

    IPC: H05K114

    CPC classification number: H01R12/79 ,  H02G5/04 ,  H05K1/095 ,  H05K3/101 ,  H05K3/107 ,  H05K3/202 ,  H05K2201/0352 ,  H05K2201/0391 ,  H05K2201/09036 ,  H05K2201/09118 ,  H05K2201/09472 ,  H05K2201/09854 ,  H05K2201/09863

    Abstract: An electrically conductive circuit conductor 2 is disposed on an insulating resin substrate 1, an electrically conductive surface 3 of the circuit conductor is exposed from the resin substrate continuously in a longitudinal direction, and both side portions 4 of the conductive surface are covered and fixed by collar walls 5 of the resin substrate. A bus bar or an electrically conductive resin material is used as the circuit conductor 2. The bus bar 2 is insert-molded onto the resin substrate. The electrically conductive resin material is poured and solidified in a groove portion in the resin substrate. A contact terminal on a mating circuit side or electrical component side is brought into contact with the conductive surface of the circuit conductor 2. A second circuit board is laminated on the resin substrate, and an insertion hole for allowing the conductive surface of the circuit conductor 2 to be exposed is provided in the second circuit board, and the contact terminal is inserted in the insertion hole. Other contact terminals on the mating circuit side or electrical component side are brought into contact with circuits of the second circuit board.

    Abstract translation: 导电电路导体2设置在绝缘树脂基板1上，电路导体的导电表面3沿着纵向连续地从树脂基板露出，并且导电表面的两个侧部4被覆盖并固定在 树脂基板的环状壁5。 母线或导电树脂材料用作电路导体2.汇流条2插入模制在树脂基片上。 导电性树脂材料在树脂基板的槽部注入并凝固。 匹配电路侧或电气元件侧的接触端子与电路导体2的导电表面接触。第二电路板层叠在树脂基板上，并且插入孔用于允许电路导体的导电表面 2被设置在第二电路板中，并且接触端子插入到插入孔中。 匹配电路侧或电气部件侧的其他接触端子与第二电路板的电路接触。

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