公开(公告)号：US20170324004A1

公开(公告)日：2017-11-09

申请号：US15528058

申请日：2015-10-29

Applicant: LG INNOTEK CO., LTD.

Inventor： Eun Hyung LEE ,  Yoo Hwan KANG ,  Won Ho KIM ,  Tae Ki KIM ,  Sungwon David ROH ,  Hyo Jung MOON ,  Yong Han JEON

IPC: H01L33/38 ,  H01L33/30 ,  H01L33/40 ,  H01L33/46

CPC classification number: H01L33/387 ,  H01L33/08 ,  H01L33/16 ,  H01L33/24 ,  H01L33/30 ,  H01L33/382 ,  H01L33/405 ,  H01L33/46 ,  H01L2933/0016

Abstract: Disclosed is a light emitting device according to the embodiment including a conductive semiconductor layer divided into at least two or more light emitting regions; a plurality of light emitting structures on the conductive semiconductor layer; an electrode layer on the plurality of light emitting structures; a second electrode electrically connected to the electrode layer; and a first electrode electrically connected to the conductive semiconductor layer, wherein each of the light emitting structures includes a rod-shaped first conductivity type semiconductor, an active layer configured to surround the first conductivity type semiconductor and a second conductivity type semiconductor configured to surround the active layer, and each of the light emitting structures has at least two or more outer surfaces having different extending directions with respect to an upper surface of the conductive semiconductor layer.

公开(公告)号：US20230113302A1

公开(公告)日：2023-04-13

申请号：US17906166

申请日：2021-03-12

Applicant: LG INNOTEK CO., LTD.

Inventor： Yong Han JEON ,  Jin Seok LEE ,  Tae Ki KIM

IPC: H05K1/11

Abstract: A circuit board according to an embodiment includes an insulating layer; a circuit pattern disposed on an upper surface of the insulating layer; a first solder resist disposed on an upper surface of the insulating layer and having a height smaller than a height of the circuit pattern; and a second solder resist disposed on an upper surface of the first solder resist and including a first portion having an upper surface lower than an upper surface of the circuit pattern and a second. portion having an upper surface higher than the upper surface of the circuit pattern, wherein the circuit pattern includes: a plurality of first circuit patterns disposed on an upper surface of a first region of the insulating layer, and a plurality of second circuit patterns disposed on an upper surface of a second region of the insulating layer; wherein the first portion of the second solder resist is disposed between the plurality of first circuit patterns to have an upper surface lower than an upper surface of the first circuit pattern; and wherein the second portion of the second solder resist has an upper surface higher than an upper surface of the second circuit pattern, and is disposed to cover the plurality of second circuit patterns between the plurality of second circuit patterns.

公开(公告)号：US20220338346A1

公开(公告)日：2022-10-20

申请号：US17638898

申请日：2020-08-25

Applicant: LG INNOTEK CO., LTD.

Inventor： Il Sik NAM ,  Yong Suk KIM ,  Dong Keun LEE ,  Tae Ki KIM ,  Hye Jin JO

IPC: H05K1/11 ,  H05K1/02

Abstract: A printed circuit board according to an embodiment includes an insulating layer; a first pad disposed on an upper surface of the insulating layer; a second pad disposed on a lower surface of the insulating layer; a first device mounted on the first pad; a second device mounted on the second pad; a first molding layer disposed on the insulating layer and molding the first device; and a second molding layer disposed on the lower surface of the insulating layer and molding the second device, wherein a lower surface of the second molding layer is positioned on the same plane as a lower surface of the second device.