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    CIRCUIT BOARD
    1.
    发明公开
    CIRCUIT BOARD 审中-公开

    公开(公告)号：US20230240005A1

    公开(公告)日：2023-07-27

    申请号：US17928703

    申请日：2021-06-10

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Yong Suk KIM ,  Jeong Han KIM ,  Moo Seong KIM

    IPC: H05K1/02 ,  H05K1/11

    CPC classification number: H05K1/0296 ,  H05K1/115

    Abstract: A circuit board according to an embodiment comprises: an insulation layer; a circuit pattern disposed on the upper surface or under the lower surface of the insulation layer; and a buffer layer disposed on at least one surface of the upper surface and the lower surface of the insulation layer, wherein the buffer layer includes carbon, nitrogen, and oxygen, the ratio of the nitrogen to the carbon ((carbon/nitrogen)*100) is 5 to 15, and the ratio of the oxygen to the carbon ((carbon/oxygen)*100) is 15 to 30.

    CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
    2.
    发明申请
    CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME 有权

    公开(公告)号：US20240414844A1

    公开(公告)日：2024-12-12

    申请号：US18699444

    申请日：2022-09-30

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Yong Suk KIM ,  Bo Ra KANG ,  Jeong Han KIM

    IPC: H05K1/11 ,  H01L23/498 ,  H05K1/02

    Abstract: A circuit board according to an embodiment includes a first insulating layer, a coating layer disposed on the first insulating layer, and a circuit pattern layer disposed on the coating layer, wherein the circuit pattern layer includes a first metal layer disposed on the coating layer, and a second metal layer disposed on the first metal layer, the coating layer includes a first functional group, and the first insulating layer includes a reactive group bonded to the first functional group.

    CIRCUIT BOARD
    4.
    发明申请
    CIRCUIT BOARD 有权

    公开(公告)号：US20220287174A1

    公开(公告)日：2022-09-08

    申请号：US17636063

    申请日：2020-08-25

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Yong Suk KIM ,  Dong Hwa LEE

    IPC: H05K1/02 ,  H05K1/11 ,  H05K1/05

    Abstract: A circuit board according to an embodiment includes a first insulating portion including at least one insulating layer; a second insulating portion disposed on the first insulating portion and including at least one insulating layer; and a third insulating portion disposed under the first insulating portion and including at least one insulating layer; wherein the insulating layer constituting the first insulating portion includes a prepreg containing glass fibers, and wherein each of the insulating layers constituting the second and third insulating portions is made of resin coated copper (RCC).

    TOUCH PANEL INCLUDING PATTERNS OF MESH STRUCTURES
    5.
    发明申请
    TOUCH PANEL INCLUDING PATTERNS OF MESH STRUCTURES 审中-公开
    触摸板包括MESH结构的图案

    公开(公告)号：US20150324047A1

    公开(公告)日：2015-11-12

    申请号：US14706244

    申请日：2015-05-07

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Yong Suk KIM ,  Bong Jun PARK ,  Seongsu OEM ,  Young Sun YOU ,  Jinwoong LEE

    IPC: G06F3/041

    CPC classification number: G06F3/044 ,  G06F3/0412 ,  G06F2203/04111 ,  G06F2203/04112

    Abstract: Disclosed herein is a touch panel. The touch panel can have improved electrical properties and implement a large size because it includes patterns of mesh structures. Furthermore, the visibility of a view region can be improved by increasing the density of meshes in a region in which patterns are intersected, excellent electrical properties can be implemented, and a panel fabrication process can be simplified.

    Abstract translation: 这里公开了触摸面板。 触摸面板可以具有改善的电气性能并且实现大尺寸，因为它包括网格结构的图案。 此外，可以通过增加图案相交的区域中的网格的密度来提高视区的可视性，可以实现优异的电性能，并且可以简化面板制造工艺。

    TOUCH PANEL
    6.
    发明申请
    TOUCH PANEL 有权
    触控面板

    公开(公告)号：US20140139759A1

    公开(公告)日：2014-05-22

    申请号：US14087449

    申请日：2013-11-22

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Seong Su OEM ,  Hyun Min NAH ,  Yong Suk KIM ,  Jin Bok KIM ,  Myung Ki MIN ,  Woo Ju JEONG ,  Jae Hak HER

    IPC: G02F1/1333

    CPC classification number: G02F1/13338 ,  G06F3/044

    Abstract: Disclosed is a touch panel. The touch panel includes a substrate, a sensor part on the substrate, a connection electrode to connect the sensor part on the substrate, and an anti-view part on the connection electrode. A position of the connection electrode corresponds to a position of the anti-view part. A method of fabricating the touch panel includes forming the sensor part on the substrate, forming a connection electrode layer on the substrate, and patterning the connection electrode layer. The connection electrode layer includes a conductive layer and an anti-view layer.

    Abstract translation: 公开了一种触摸面板。 触摸面板包括基板，基板上的传感器部分，用于连接基板上的传感器部分的连接电极和连接电极上的反视角部分。 连接电极的位置对应于反视角部的位置。 一种制造触摸面板的方法包括在基板上形成传感器部分，在基板上形成连接电极层，并对连接电极层进行构图。 连接电极层包括导电层和反视图层。

    CIRCUIT BOARD
    7.
    发明公开
    CIRCUIT BOARD 审中-公开

    公开(公告)号：US20230269872A1

    公开(公告)日：2023-08-24

    申请号：US18011293

    申请日：2021-06-17

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Yong Suk KIM ,  Jeong Han KIM

    IPC: H05K1/03 ,  H05K1/05 ,  H05K1/11

    CPC classification number: H05K1/0306 ,  H05K1/056 ,  H05K1/115

    Abstract: A circuit board according to an embodiment includes: an insulating portion including a plurality of insulating layers; a circuit pattern disposed on surfaces of the plurality of insulating layers; and a via passing through at least one insulating layer among the plurality of insulating layers; wherein the insulating portion includes: a first insulating portion including at least one insulating layer; a second insulating portion disposed on the first insulating portion and including a plurality of insulating layers; and a third insulating portion disposed under the first insulating portion and including a plurality of insulating layers; wherein the first insulating portion is formed of prepreg containing glass fibers, wherein at least one of the second insulating portion and the third insulating portion includes a resin coated copper (RCC) and a solder resist disposed on the RCC, wherein the circuit pattern is disposed on a surface of the solder resist, and wherein the via is formed passing through the solder resist.

    PRINTED CIRCUIT BOARD
    8.
    发明申请
    PRINTED CIRCUIT BOARD 有权

    公开(公告)号：US20220061147A1

    公开(公告)日：2022-02-24

    申请号：US17413427

    申请日：2019-12-12

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Yong Suk KIM ,  Hyun Gu IM ,  Byeong Kyun CHOI

    IPC: H05K1/02

    Abstract: A printed circuit board according to an embodiment includes: an insulating layer; and a circuit pattern disposed on the insulating layer, wherein the circuit pattern includes an upper surface, a lower surface, a first side surface, and a second side surface, and surface roughness Ra of at least three surfaces of the upper surface, the lower surface, the first side surface, and the second side surface of the circuit pattern is 0.1 μm to 0.31 μm.

    CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
    9.
    发明申请
    CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME 有权

    公开(公告)号：US20240407095A1

    公开(公告)日：2024-12-05

    申请号：US18699544

    申请日：2022-09-30

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Han Sang KIM ,  Bo Ra KANG ,  Yong Suk KIM

    IPC: H05K1/11 ,  H01L23/498 ,  H05K1/02

    Abstract: A circuit board according to an embodiment includes a first insulating layer, a coating layer disposed on the first insulating layer, and a circuit pattern layer disposed on the coating layer, wherein the circuit pattern layer includes a first metal layer disposed on the coating layer, and a second metal layer disposed on the first metal layer, wherein the coating layer includes a first functional group bonded to the first insulating layer, and a second functional group bonded to the first metal layer.

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