公开(公告)号：US11778741B2

公开(公告)日：2023-10-03

申请号：US17906166

申请日：2021-03-12

Applicant: LG INNOTEK CO., LTD.

Inventor： Yong Han Jeon ,  Jin Seok Lee ,  Tae Ki Kim

IPC: H05K1/11

CPC classification number: H05K1/113 ,  H05K2201/099 ,  H05K2201/09481 ,  H05K2201/09618 ,  H05K2201/10371 ,  H05K2201/10931 ,  H05K2201/10977

Abstract: A circuit board according to an embodiment includes an insulating layer; a circuit pattern disposed on an upper surface of the insulating layer; a first solder resist disposed on an upper surface of the insulating layer and having a height smaller than a height of the circuit pattern; and a second solder resist disposed on an upper surface of the first solder resist and including a first portion having an upper surface lower than an upper surface of the circuit pattern and a second portion having an upper surface higher than the upper surface of the circuit pattern, wherein the circuit pattern includes: a plurality of first circuit patterns disposed on an upper surface of a first region of the insulating layer, and a plurality of second circuit patterns disposed on an upper surface of a second region of the insulating layer; wherein the first portion of the second solder resist is disposed between the plurality of first circuit patterns to have an upper surface lower than an upper surface of the first circuit pattern; and wherein the second portion of the second solder resist has an upper surface higher than an upper surface of the second circuit pattern, and is disposed to cover the plurality of second circuit patterns between the plurality of second circuit patterns.