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    METHOD FOR TREATING A SEMICONDUCTOR DEVICE
    2.
    发明申请
    METHOD FOR TREATING A SEMICONDUCTOR DEVICE 有权
    用于处理半导体器件的方法

    公开(公告)号：US20160279677A1

    公开(公告)日：2016-09-29

    申请号：US15079532

    申请日：2016-03-24

    Applicant: LIFE TECHNOLOGIES CORPORATION

    Inventor： James A. BALL ,  Phil WAGGONER ,  Scott PARKER

    IPC: B08B3/08 ,  G01N27/414 ,  C11D3/34 ,  C11D3/43 ,  B08B9/08 ,  C11D3/16

    CPC classification number: B08B3/08 ,  B05D3/00 ,  B05D5/12 ,  B08B9/08 ,  C11D1/22 ,  C11D3/162 ,  C11D3/3418 ,  C11D3/43 ,  C11D7/34 ,  C11D7/5013 ,  C11D7/5022 ,  C11D11/0047 ,  G01N27/414 ,  G01N27/4145 ,  G01N27/4148 ,  H01L21/02057

    Abstract: A method of treating a sensor array including a plurality of sensors and an isolation structure, where a sensor of the plurality of sensors has a sensor pad exposed at a surface of the sensor array and the isolation structure is disposed between the sensor pad and sensor pads of other sensors of the plurality of sensors, comprises exposing the sensor pad and the isolation structure to a non-aqueous organo-silicon solution including an organo-silicon compound and a first non-aqueous carrier; applying an acid solution including an organic acid and a second non-aqueous carrier to the sensor pad; and rinsing the acid solution from the sensor pad and the isolation structure.

    Abstract translation: 一种处理包括多个传感器和隔离结构的传感器阵列的方法，其中所述多个传感器中的传感器具有在所述传感器阵列的表面处暴露的传感器垫，并且所述隔离结构设置在所述传感器垫和传感器垫之间 所述多个传感器中的其它传感器包括将所述传感器垫和所述隔离结构暴露于包括有机硅化合物和第一非水载体的非水有机硅溶液; 将包含有机酸和第二非水性载体的酸溶液施加到传感器垫; 以及从传感器垫和隔离结构冲洗酸溶液。

    METHOD FOR TREATING A SEMICONDUCTOR DEVICE
    4.
    发明申请
    METHOD FOR TREATING A SEMICONDUCTOR DEVICE 有权

    公开(公告)号：US20210129192A1

    公开(公告)日：2021-05-06

    申请号：US17079756

    申请日：2020-10-26

    Applicant: Life Technologies Corporation

    Inventor： James A. BALL ,  Phil WAGGONER ,  Scott T. PARKER

    IPC: B08B3/08 ,  B08B9/08 ,  C11D3/16 ,  G01N27/414 ,  C11D3/34 ,  C11D3/43 ,  C11D1/22 ,  C11D11/00 ,  H01L21/02

    Abstract: A method of treating a sensor array including a plurality of sensors and an isolation structure, where a sensor of the plurality of sensors has a sensor pad exposed at a surface of the sensor array and the isolation structure is disposed between the sensor pad and sensor pads of other sensors of the plurality of sensors, comprises exposing the sensor pad and the isolation structure to a non-aqueous organo-silicon solution including an organo-silicon compound and a first non-aqueous carrier; applying an acid solution including an organic acid and a second non-aqueous carrier to the sensor pad; and rinsing the acid solution from the sensor pad and the isolation structure.

    METHOD FOR MAKING A WELL DISPOSED OVER A SENSOR
    5.
    发明申请
    METHOD FOR MAKING A WELL DISPOSED OVER A SENSOR 审中-公开

    公开(公告)号：US20200090947A1

    公开(公告)日：2020-03-19

    申请号：US16687630

    申请日：2019-11-18

    Applicant: LIFE TECHNOLOGIES CORPORATION

    Inventor： Phil WAGGONER ,  Jordan OWENS

    IPC: H01L21/311 ,  G01N27/414 ,  H01L21/02 ,  H01L21/027 ,  H01L21/285 ,  H01L21/3213

    Abstract: A method for forming a well providing access to a sensor pad includes patterning a first photoresist layer over a dielectric structure disposed over the sensor pad; etching a first access into the dielectric structure and over the sensor pad, the first access having a first characteristic diameter; patterning a second photoresist layer over the dielectric structure; and etching a second access over the dielectric structure and over the sensor pad. The second access has a second characteristic diameter. The first and second accesses overlapping. A diameter ratio of the first characteristic diameter to the second characteristic diameter is not greater than 0.7. The first access exposes the sensor pad. The second access has a bottom depth less than a bottom depth of the first access.

    METHOD OF FORMING ION SENSORS
    7.
    发明申请
    METHOD OF FORMING ION SENSORS 有权

    公开(公告)号：US20210325337A1

    公开(公告)日：2021-10-21

    申请号：US17267754

    申请日：2019-08-16

    Applicant: LIFE TECHNOLOGIES CORPORATION

    Inventor： Phil WAGGONER

    IPC: G01N27/414 ,  H01L21/203

    Abstract: A method for manufacturing a sensor includes etching an insulator layer disposed over a substrate to define an opening exposing a sensor surface of a sensor disposed on the substrate, a native oxide forming on the sensor surface; sputtering the sensor surface with a noble gas to at least partially remove the native oxide from the sensor surface; and annealing the sensor surface in a hydrogen atmosphere.

    METHOD FOR TREATING A SEMICONDUCTOR DEVICE
    8.
    发明申请
    METHOD FOR TREATING A SEMICONDUCTOR DEVICE 审中-公开

    公开(公告)号：US20200055097A1

    公开(公告)日：2020-02-20

    申请号：US16663099

    申请日：2019-10-24

    Applicant: LIFE TECHNOLOGIES CORPORATION

    Inventor： James A. BALL ,  Phil WAGGONER ,  Scott PARKER

    IPC: B08B3/08 ,  H01L21/02 ,  G01N27/414 ,  C11D11/00 ,  C11D1/22 ,  C11D3/43 ,  C11D3/34 ,  C11D3/16 ,  B08B9/08

    Abstract: A method of treating a sensor array including a plurality of sensors and an isolation structure, where a sensor of the plurality of sensors has a sensor pad exposed at a surface of the sensor array and the isolation structure is disposed between the sensor pad and sensor pads of other sensors of the plurality of sensors, comprises exposing the sensor pad and the isolation structure to a non-aqueous organo-silicon solution including an organo-silicon compound and a first non-aqueous carrier; applying an acid solution including an organic acid and a second non-aqueous carrier to the sensor pad; and rinsing the acid solution from the sensor pad and the isolation structure.

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