公开(公告)号：US20170311447A1

公开(公告)日：2017-10-26

申请号：US15495405

申请日：2017-04-24

Applicant: LINEAR TECHNOLOGY CORPORATION

Inventor： John David BRAZZLE ,  Frederick E. BEVILLE ,  David A. PRUITT

IPC: H05K1/18 ,  H05K3/34 ,  H05K1/02 ,  H05K3/28

CPC classification number: H05K1/181 ,  H01L23/49811 ,  H01L23/50 ,  H05K1/0203 ,  H05K3/284 ,  H05K3/3426 ,  H05K2201/1003 ,  H05K2201/10515 ,  H05K2201/10522 ,  H05K2201/10553 ,  H05K2201/10757 ,  H05K2203/1316

Abstract: A component-on-package circuit may include a component for an electrical circuit and a circuit module attached to the component. The circuit module may have circuitry and at least one leadframe which connects the circuitry to the component both electrically and thermally. The leadframe may have a high degree of both electrical and thermal conductivity and a non-planar shape that provides spring-like cushioning of force applied to the component in the direction of the circuit module.A method of making a component-on-package circuit may include attaching a component for an electrical circuit to a circuit module. The circuit module may have circuitry and at least one leadframe which connects the circuitry to the component after the attachment both electrically and thermally. The leadframe may have a high degree of both electrical and thermal conductivity and a non-planar shape that provides a spring-like cushioning of force applied to the component in the direction of the circuit module. The circuit module may be encapsulated in molding material after the circuit module has been attached to the component, without encapsulation the component at the same time.