公开(公告)号：US20170005062A1

公开(公告)日：2017-01-05

申请号：US15125705

申请日：2015-03-16

Applicant: LINTEC CORPORATION

Inventor： Yuichiro AZUMA ,  Hideaki SUZUKI ,  Naoya SAIKI ,  Yuta SAGAWA

IPC: H01L23/00 ,  C09J7/02 ,  H01L21/683

CPC classification number: H01L24/29 ,  C09J7/38 ,  C09J133/06 ,  C09J133/12 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2205/114 ,  C09J2433/00 ,  C09J2461/00 ,  C09J2463/00 ,  H01L21/6836 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/94 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2221/68386 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73265 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2224/27 ,  H01L2924/0665 ,  H01L2224/45099

Abstract: A die-bonding layer formation film to be used for fixing a processed product to an adherend, includes an adhesive layer, wherein, the storage elastic modulus has a local minimum value at a temperature within a range of 80° C. to 150° C., wherein the adhesive layer has a shear strength to a peeling strength test substrate of 20 N/2 mm□ or more and 50 N/2 mm□ or less, wherein the shear strength is measured after the processed product is placed above the peeling strength test substrate via the die-bonding layer formation film and the die-bonding layer formation film on the peeling strength test substrate is heated at 175° C. for 1 hour and then further maintained under an environment of 250° C. for 30 seconds. Bubbles (voids) are unlikely to grow at the boundary between the adhesive layer and an adherend even when subjected to thermal history.

Abstract translation: 用于将加工产品固定到被粘物上的芯片接合层形成膜包括粘合剂层，其中储能弹性模量在80℃至150℃的温度范围内具有局部最小值 其中，所述粘合剂层对剥离强度试验基材的剪切强度为20N / 2mm以上且50N / 2mm以下，其中，在将所述加工品置于剥离物上方之后测定剪切强度 通过芯片接合层形成膜和剥离强度试验基板上的芯片接合层形成膜将强度试验基板在175℃下加热1小时，然后在250℃的环境下进一步保持30秒 。 即使经历了热历史，气泡（空隙）也不可能在粘合剂层和被粘物之间的边界处生长。

公开(公告)号：US20160046840A1

公开(公告)日：2016-02-18

申请号：US14778802

申请日：2014-03-26

Applicant: LINTEC CORPORATION

Inventor： Hiroyuki YONEYAMA ,  Naoya SAIKI

IPC: C09J7/02

CPC classification number: C09J7/243 ,  C09J7/20 ,  C09J7/38 ,  C09J7/40 ,  C09J2201/606 ,  C09J2201/622 ,  C09J2203/326 ,  H01L21/6836 ,  H01L23/544 ,  H01L23/552 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2223/54433 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A protective film-forming composite sheet 10 comprises a pressure sensitive adhesive sheet 16 in which a pressure sensitive adhesive layer 12 is provided on a base material 11, a protective film-forming film 13, and a release film 14. When α (mN/25 mm) represents the maximum peel force between the protective film-forming film 13 and the release film 14; β (mN/25 mm) represents the minimum peel force between the pressure sensitive adhesive sheet 16 and the protective film-forming film 13; and γ (mN/25 mm) represents the maximum peel force between the pressure sensitive adhesive sheet 16 and the protective film-forming film 13, the following relationships (1) to (3) hold for α, β, and γ; β≧70  (1) α/β≦0.50  (2) γ≦2000  (3).

Abstract translation: 保护膜形成复合片10包括在基材11上形成有压敏粘合剂层12的压敏粘合片16，保护膜形成膜13和剥离膜14.当α（mN / 25mm）表示保护膜形成膜13和剥离膜14之间的最大剥离力; ＆bgr （mN / 25mm）表示压敏粘合片16和保护膜形成膜13之间的最小剥离力; γ（mN / 25mm）表示压敏粘合片16与保护膜形成膜13之间的最大剥离力，关于（1）〜（3），α，＆bgr，γ的关系成立。 ＆bgr;≥70（1）α/＆bgr;＆nlE; 0.50（2）γ＆nlE; 2000（3）。

公开(公告)号：US20210269678A1

公开(公告)日：2021-09-02

申请号：US17258618

申请日：2019-07-10

Applicant: LINTEC CORPORATION

Inventor： Yumiko AMINO ,  Naoya SAIKI ,  Misaki SAKAMOTO

IPC: C09J7/29 ,  C09J7/38 ,  B32B27/08 ,  B32B27/30 ,  B32B27/40 ,  B32B27/36 ,  B32B27/32 ,  B32B7/12

Abstract: The invention relates to a peel detection label that is a laminate including a support, a pattern layer formed in a part of the surface of the support, and a pressure-sensitive adhesive laminate having at least a low modulus layer (X), a high modulus layer (Y) and a pressure-sensitive adhesive layer (Z) in that order, in which the low modulus layer (X) has a surface in contact with the support and the pattern layer and a surface in contact with the high modulus layer (Y), and satisfies the following requirement (1):
Requirement (1): when the pressure-sensitive adhesive layer (Z) of the peel detection label is attached to an adherend and then the peel detection label is peeled off from the adherend, the maximum vertical tensile stress applied to an element of the low modulus layer (X) that is located closest to the support is 0.19 MPa or more when analyzed by a finite element method using Abaqus.