公开(公告)号：US20240044369A1

公开(公告)日：2024-02-08

申请号：US18244965

申请日：2023-09-12

Applicant: LINTEC CORPORATION

Inventor： Yosuke KOMA

IPC: F16C33/20 ,  B29C43/02 ,  B29C71/00

CPC classification number: F16C33/208 ,  B29C43/021 ,  B29C71/0009 ,  F16C2208/20 ,  F16C2220/40 ,  B29C2043/026

Abstract: A device EA that manufactures a projection-bearing body having a structure in which projections CV are formed on a bearing sheet BS comprises: a material transfer unit 10 that executes a material transfer step of transferring a base material BM containing a plastic material PM; a material support unit 20 that executes a material support step of supporting the base material BM transferred by the material transfer unit 10, by a support member 22 having a support surface 22A in which recesses 22B corresponding to the projections CV are formed; and a press unit 30 that executes a pressing step of pressing the base material BM in a direction toward the support surface 22A to fill the plastic material PM in the recesses 22B and forming the projections CV from the plastic material PM. In the base material BM, the plastic material PM is stacked on one surface of the bearing sheet BS. When transferring the base material BM, the material transfer unit 10 places the base material BM on the support member 22, with the plastic material PM in contact with the support surface 22A.

公开(公告)号：US20240001625A1

公开(公告)日：2024-01-04

申请号：US18244987

申请日：2023-09-12

Applicant: LINTEC CORPORATION

Inventor： Yosuke KOMA

IPC: B29C67/20 ,  B29C43/02

CPC classification number: B29C67/202 ,  B29C43/021 ,  B29L2031/7544

Abstract: A device EA that manufactures a projection-bearing body CB in which projections CV are formed comprises: a material support unit 20 that executes a material support step of supporting a base material BM, by a support member 22 having a support surface 22A in which recesses 22B corresponding to the projections CV are formed; a press unit 30 that executes a pressing step of pressing the base material BM in a direction toward the support surface 22A to fill the plastic material PM in the recesses 22B and forming the projections CV from the plastic material to form the projection-bearing body CB; and a separating unit 60 that executes a separating step of separating the projection-bearing body CB from the support member 22. The support member 22 has a structure dividable into a plurality of support members, and the separating unit 60 includes an individually separating unit 63 that separates the divided first and second support member 22α, 22β individually from the projection-bearing body CB.

公开(公告)号：US20180298238A1

公开(公告)日：2018-10-18

申请号：US15767932

申请日：2016-10-12

Applicant: LINTEC CORPORATION ,  SUMITOMO SEIKA CHEMICALS CO., LTD.

Inventor： Yosuke KOMA ,  Yutaka NANASHIMA ,  Yoshitomo ONO ,  Kiyoshi NISHIOKA ,  Shizuka HACHIKEN

IPC: C09J7/38 ,  C09J169/00 ,  C09J133/08 ,  C09J133/10

CPC classification number: C09J7/38 ,  C08K5/205 ,  C08K5/29 ,  C08K5/31 ,  C08K5/3435 ,  C08K5/3445 ,  C08K5/3462 ,  C09J7/385 ,  C09J133/00 ,  C09J133/08 ,  C09J133/10 ,  C09J169/00 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2205/302 ,  C09J2433/00 ,  C09J2469/00 ,  C08K5/16

Abstract: A pressure sensitive adhesive sheet is provided which comprises a pressure sensitive adhesive layer formed of a pressure sensitive adhesive composition. The pressure sensitive adhesive composition contains an aliphatic polycarbonate and a pressure sensitive adhesive resin other than the aliphatic polycarbonate. The pressure sensitive adhesive sheet can be reduced in the adhesive strength at desired timing by a novel mechanism of action so that the release of an adherend becomes easy. The above pressure sensitive adhesive composition preferably contains an acid/base generator that generates an acid or a base by applying energy.

公开(公告)号：US20240424271A1

公开(公告)日：2024-12-26

申请号：US18692290

申请日：2022-06-30

Applicant: LINTEC CORPORATION ,  The University of Tokyo

Inventor： Yosuke KOMA ,  Beomjoon KIM ,  JongHo PARK

IPC: A61M37/00 ,  A61B5/00 ,  A61B5/145

Abstract: A microneedle structure of the present invention comprises: a liquid-impermeable base material that has a through-hole; a liquid-absorbable absorbent material that fills the through-hole; a needle-shaped portion that is provided on one surface side of the base material and has a flow channel formed therein; and a functional member that is provided on the other surface side of the base material. The needle-shaped portion and the absorbent material are connected to each other, and the absorbent material and the functional member are connected to each other.

公开(公告)号：US20240180465A1

公开(公告)日：2024-06-06

申请号：US18553432

申请日：2022-03-31

Applicant: LINTEC CORPORATION

Inventor： Yosuke KOMA

IPC: A61B5/15 ,  A61B5/145 ,  A61L31/06 ,  A61L31/14

CPC classification number: A61B5/150984 ,  A61B5/150022 ,  A61L31/06 ,  A61L31/148 ,  A61B5/14532 ,  A61B2562/12

Abstract: Microneedle structure of the present invention includes a needle-shaped portion on one surface side of a base material. The base material has fluid permeability in its thickness direction. The needle-shaped portion is composed of a composition that contains a low-melting-point resin having a melting point of 150° C. or lower. The needle-shaped portion has a surface and an interior that are formed with hole portions. The method for producing a microneedle structure of the present invention includes a bonding step of heating a composition containing a low-melting-point resin having a melting point of 150° C. or lower to bond the heated low-melting-point resin and the base material. Thus, the microneedle structure and the method for producing the microneedle structure are provided, in which the influence of high temperature on the base material is reduced and the degree of freedom in selecting the base material is high.

公开(公告)号：US20160372358A1

公开(公告)日：2016-12-22

申请号：US15122195

申请日：2015-03-02

Applicant: LINTEC CORPORATION

Inventor： Yosuke KOMA ,  Takuo NISHIDA ,  Misaki SAKAMOTO

IPC: H01L21/683 ,  C09J5/06 ,  C09J7/02 ,  C09J133/06 ,  H01L21/78 ,  H01L21/324

CPC classification number: H01L21/6836 ,  C08F220/06 ,  C09J4/00 ,  C09J4/06 ,  C09J5/00 ,  C09J5/06 ,  C09J7/22 ,  C09J7/38 ,  C09J7/385 ,  C09J133/06 ,  C09J201/02 ,  C09J2201/122 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2205/302 ,  C09J2205/31 ,  H01L21/324 ,  H01L21/78 ,  H01L2221/68322 ,  H01L2221/68327

Abstract: As a semiconductor-related-member processing sheet which can stably achieve to enhance the removability of the semiconductor-related-member processing sheet and to suppress the reliability degradation of members comprising chips manufactured from a semiconductor-related member using the semiconductor-related-member processing sheet, there is provided a semiconductor-related-member processing sheet, comprising a base material and a pressure sensitive adhesive layer provided on or above one surface of the base material, wherein the pressure sensitive adhesive layer comprises one or more types of energy ray polymerizable compounds having an energy ray polymerizable functional group, wherein at least one type of the energy ray polymerizable compounds is a polymerizable branched polymer that is a polymer having a branched structure, wherein a contact angle on a measurement target surface is 40° or less when measured using a water droplet under an environment of 25° C. and a relative humidity of 50%.

Abstract translation: 作为能够稳定地实现半导体相关部件处理片的可去除性的半导体相关部件处理片，并且使用半导体相关部件抑制由包括由半导体相关部件制造的芯片的部件的可靠性劣化 提供了一种半导体相关件处理片，其包括基材和设置在基材的一个表面上或之上的压敏粘合剂层，其中该压敏粘合剂层包含一种或多种类型的能量射线 具有能量射线聚合性官能团的可聚合化合物，其中至少一种类型的能量射线可聚合化合物是作为具有支化结构的聚合物的可聚合支化聚合物，其中测量目标表面上的接触角为40°以下， 在25℃的环境和相对湿度下使用水滴测量 50％。